TWI506605B - Display structure - Google Patents
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- TWI506605B TWI506605B TW103111791A TW103111791A TWI506605B TW I506605 B TWI506605 B TW I506605B TW 103111791 A TW103111791 A TW 103111791A TW 103111791 A TW103111791 A TW 103111791A TW I506605 B TWI506605 B TW I506605B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2320/00—Control of display operating conditions
- G09G2320/02—Improving the quality of display appearance
- G09G2320/0209—Crosstalk reduction, i.e. to reduce direct or indirect influences of signals directed to a certain pixel of the displayed image on other pixels of said image, inclusive of influences affecting pixels in different frames or fields or sub-images which constitute a same image, e.g. left and right images of a stereoscopic display
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Description
本發明是有關於一種顯示器結構，特別是指一種提升色彩純淨度，及色彩飽和度的顯示器結構。The invention relates to a display structure, in particular to a display structure for improving color purity and color saturation.
發光二極體(light emitting diode，LED)具有體積小、低耗電，及高亮度等優點，近年已由小型電子產品擴及至大型家電等相關領域，而目前發展的大尺寸、薄型化，且具高色彩解析度的顯示器，更是主要採用發光二極體作為該顯示器的發光元件。通常該顯示器的發光元件會具有多個像素(pixel)，每一個像素具有紅、綠、藍發光二極體晶片，而該等像素經排列後即可組成一全彩的發光二極體顯示器。The light emitting diode (LED) has the advantages of small size, low power consumption, and high brightness. In recent years, it has been expanded from small electronic products to related fields such as large household appliances, and the current development is large and thin, and A display with high color resolution mainly uses a light-emitting diode as a light-emitting element of the display. Generally, the light-emitting element of the display has a plurality of pixels, each of which has red, green, and blue light-emitting diode chips, and the pixels are arranged to form a full-color light-emitting diode display.
就上述全彩發光二極體顯示器而言，該等發光元件通常是彼此相鄰地設置，其中，以陣列地排列方式最為常見。In the case of the above-described full-color light-emitting diode display, the light-emitting elements are usually disposed adjacent to each other, and the array arrangement is most common.
一般而言，當發光元件呈陣列方式設置時，相鄰的發光二極體晶片發出的光並無特定的指向性，且為了具有更高解析度的顯示效果，該等發光元件將會更緊密的排列，此時該等發光元件各個相鄰的發光二極體晶片發出的光源勢必會彼此干擾，而使顯示色彩不均勻，甚至影響 顯示器整體的色彩飽和度。In general, when the light-emitting elements are arranged in an array, the light emitted by the adjacent light-emitting diode chips has no specific directivity, and the light-emitting elements will be closer in order to have a higher resolution display effect. Arrangement, at this time, the light sources emitted by the adjacent light-emitting diode chips of the light-emitting elements are bound to interfere with each other, and the display color is uneven or even affected. The overall color saturation of the display.
因此，本發明之目的，即在提供一種提升色彩飽和度，使整體顯示色彩均勻而具高色彩飽和度的顯示器結構。Accordingly, it is an object of the present invention to provide a display structure that enhances color saturation and provides uniform color display with high color saturation.
於是本發明顯示器結構，包含一個晶片本體、多個發光二極體單元，及多個擋光牆。Thus, the display structure of the present invention comprises a wafer body, a plurality of light emitting diode units, and a plurality of light blocking walls.
該晶片本體包括一個基板，及一個設置於該基板的電路單元。該等發光二極體單元與該電路單元電連接，並可對外發光。該等擋光牆設置於任相鄰的發光二極體單元之間，令任相鄰之發光二極體單元產生的光互不干擾。The wafer body includes a substrate and a circuit unit disposed on the substrate. The light emitting diode units are electrically connected to the circuit unit and can emit light externally. The light blocking walls are disposed between any adjacent light emitting diode units, so that light generated by any adjacent light emitting diode units does not interfere with each other.
較佳地，該等擋光牆的高度不小於該發光二極體單元的高度。Preferably, the height of the light blocking walls is not less than the height of the light emitting diode unit.
較佳地，該等擋光牆為相互交錯地設置於該基板的表面。Preferably, the light blocking walls are disposed on the surface of the substrate in a staggered manner.
較佳地，該等擋光牆是由該基板的表面朝遠離該基板方向延伸而實質平行該等發光二極體單元。Preferably, the light blocking walls extend substantially parallel to the light emitting diode unit by the surface of the substrate extending away from the substrate.
較佳地，該電路單元具有多個分別對應該等發光二極體單元的驅動電路，及多個串聯任兩個相鄰的驅動電路的傳輸電路，該晶片本體還包括一個與其中一個驅動電路電連接的輸入電路，及一個與其中之另一個驅動電路電連接的輸出電路。Preferably, the circuit unit has a plurality of driving circuits respectively corresponding to the light emitting diode units, and a plurality of transmitting circuits connecting the two adjacent driving circuits in series, the chip body further comprising one driving circuit An electrically connected input circuit and an output circuit electrically coupled to another of the drive circuits.
較佳地，每一個驅動電路具有一個與對應的發 光二極體單元電連接的連接部，且每一個發光二極體單元具有一個與該連接部電連接的電極部。Preferably, each of the drive circuits has a corresponding one The light diode unit is electrically connected to the connection portion, and each of the light emitting diode units has an electrode portion electrically connected to the connection portion.
較佳地，每一個發光二極體單元包括一個紅色發光二極體晶片、一個綠色發光二極體晶片，及一個藍色發光二極體晶片，且該紅色、綠色，及藍色發光二極體晶片分別與驅動電路電連接。Preferably, each of the light emitting diode units comprises a red light emitting diode chip, a green light emitting diode chip, and a blue light emitting diode chip, and the red, green, and blue light emitting diodes The body wafers are electrically connected to the drive circuits, respectively.
較佳地，每一個發光二極體單元還包括一個發光二極體封裝件，且該紅色、綠色，及藍色發光二極體晶片被封裝於該發光二極體封裝件。Preferably, each of the light emitting diode units further includes a light emitting diode package, and the red, green, and blue light emitting diode chips are packaged in the light emitting diode package.
本發明之功效在於：藉由該等擋光牆設置於任相鄰的發光二極體單元間，而可避免任相鄰的發光二極體單元所發出的光彼此干擾，且能增加正向發光，使顯示器結構提升整體色彩飽和度。The effect of the invention is that the light blocking walls are disposed between any adjacent light emitting diode units, so that the light emitted by any adjacent light emitting diode units can be prevented from interfering with each other, and the positive light emitting can be increased to make the display The structure improves overall color saturation.
1‧‧‧晶片本體1‧‧‧chip body
11‧‧‧基板11‧‧‧Substrate
12‧‧‧電路單元12‧‧‧ circuit unit
120‧‧‧驅動電路120‧‧‧Drive circuit
121‧‧‧連接部121‧‧‧Connecting Department
122‧‧‧傳輸電路122‧‧‧Transmission circuit
13‧‧‧輸入電路13‧‧‧Input circuit
14‧‧‧輸出電路14‧‧‧Output circuit
2‧‧‧發光二極體單元2‧‧‧Lighting diode unit
21‧‧‧電極部21‧‧‧Electrode
22‧‧‧紅色發光二極體晶片22‧‧‧Red LED Diode Wafer
23‧‧‧綠色發光二極體晶片23‧‧‧Green LED chip
24‧‧‧藍色發光二極體晶片24‧‧‧Blue LED Diode Wafer
25‧‧‧發光二極體封裝件25‧‧‧Light Emitting Diodes
3‧‧‧擋光牆3‧‧‧Light blocking wall
H‧‧‧高度H‧‧‧ Height
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一局部立體圖，說明本發明顯示器結構省略一輸入電路及一輸出電路之一第一較佳實施例；圖2是一剖視示意圖，輔助說明圖1該第一較佳實施例；圖3是一剖視示意圖，說明本發明每一個發光二極體單元具有一個發光二極體封裝件；及圖4是一剖視示意圖，說明本發明顯示器結構之一第二較佳實施例。Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a partial perspective view showing the first preferred embodiment of the display structure of the present invention omitting an input circuit and an output circuit. 2 is a schematic cross-sectional view of the first preferred embodiment of FIG. 1; FIG. 3 is a cross-sectional view showing each of the light emitting diode units of the present invention having a light emitting diode package; 4 is a cross-sectional view showing a second preferred embodiment of the display structure of the present invention.
在本發明被詳細描述之前，要注意的是，在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖1與圖2，本發明顯示器結構之一第一較佳實施例包含：一個晶片本體1、多個發光二極體單元2，及多個擋光牆3。Referring to FIG. 1 and FIG. 2, a first preferred embodiment of the display structure of the present invention comprises: a wafer body 1, a plurality of light emitting diode units 2, and a plurality of light blocking walls 3.
該晶片本體1包括一個基板11、一個電路單元12，一個輸入電路13，及一個輸出電路14。在本發明該第一較佳實施例中，該基板11的半導體材料以矽晶圓為例作說明，但不限於此，例如，該基板11也可視該電路單元12的需求而為其他種類的半導體材料，如鍺晶圓，或III-V族等半導體材料。The wafer body 1 includes a substrate 11, a circuit unit 12, an input circuit 13, and an output circuit 14. In the first preferred embodiment of the present invention, the semiconductor material of the substrate 11 is exemplified by a germanium wafer, but is not limited thereto. For example, the substrate 11 can also be other types depending on the requirements of the circuit unit 12. Semiconductor materials, such as germanium wafers, or semiconductor materials such as III-V.
具體的說，該電路單元12具有多個對應該發光二極體單元2設置的驅動電路120，及多個用以電連接任兩個相鄰的驅動電路120的傳輸電路122，該輸入電路13與輸出電路14分別與第一個及最後一個驅動電路120電連接。外界電能藉由該輸入電路13與該輸出電路14的配合，自該輸入電路13傳送至與該輸入電路13電連接的驅動電路120，再經該等傳輸電路122傳送至其餘的驅動電路120，最後傳輸至相對應的發光二極體單元2，形成一完整的電性迴路，也就是說，該輸入電路13、傳輸電路122、驅動電路120，及輸出電路14令該等發光二極體單元2形成一可被控制的發光迴路。於該第一較佳實施例中，該等驅動電路120及傳輸電路122，可透過微影 (lithography)、蝕刻(etching)、薄膜沉積(thin film deposition)，及擴散(diffusion)等製程同步形成於該基板11。Specifically, the circuit unit 12 has a plurality of driving circuits 120 corresponding to the LED unit 2, and a plurality of transmission circuits 122 for electrically connecting any two adjacent driving circuits 120. The input circuit 13 The output circuit 14 is electrically connected to the first and last drive circuits 120, respectively. The external electric energy is transmitted from the input circuit 13 to the driving circuit 120 electrically connected to the input circuit 13 by the input circuit 13 and the output circuit 14 , and then transmitted to the remaining driving circuit 120 via the transmission circuit 122 . Finally, it is transmitted to the corresponding light-emitting diode unit 2 to form a complete electrical circuit, that is, the input circuit 13, the transmission circuit 122, the driving circuit 120, and the output circuit 14 enable the light-emitting diode units 2 forms a light-emitting loop that can be controlled. In the first preferred embodiment, the driving circuit 120 and the transmitting circuit 122 are permeable to lithography. Processes such as lithography, etching, thin film deposition, and diffusion are simultaneously formed on the substrate 11.
該等發光二極體單元2呈陣列地設置於該晶片本體1與該電路單元12電連接，並於接收來自該電路單元12的電能時，可將電能轉換為光能而發光。該每一個發光二極體單元2包括一個紅色發光二極體晶片22、一個綠色發光二極體晶片23，及一個藍色發光二極體晶片24，而該紅色、綠色，及藍色發光二極體晶片22、23、24分別與對應的驅動電路120電連接。由於該紅色、綠色、藍色發光二極體晶片22、23、24的相關製程及構成材料的選擇為技術領域所周知，且非為本技術之重點，因此，不再多加贅述。The light emitting diode units 2 are arranged in an array, and the wafer body 1 is electrically connected to the circuit unit 12, and when receiving electrical energy from the circuit unit 12, the electrical energy can be converted into light energy to emit light. Each of the light emitting diode units 2 includes a red light emitting diode chip 22, a green light emitting diode chip 23, and a blue light emitting diode chip 24, and the red, green, and blue light emitting diodes The polar body wafers 22, 23, 24 are electrically connected to corresponding drive circuits 120, respectively. Since the selection of the related processes and constituent materials of the red, green, and blue LED chips 22, 23, and 24 is well known in the art and is not the focus of the present technology, it will not be described again.
更詳細地說，該每一個驅動電路120具有一個可與其對應的該發光二極體單元2電連接的連接部121，且該每一個發光二極體單元2也包括一個用於與該連接部121電連接的電極部21；於該第一較佳實施例中，該連接部121是設置於對應的該驅動電路120頂面，並電連接該發光二極體單元2的電極部21。該發光二極體單元2的紅色、綠色，及藍色發光二極體晶片22、23、24是分別地先與該電極部21電連接，再透過該電極部21與該驅動電路120的連接部121電連接，因此，當該驅動電路120供電予電極部21時，該等發光二極體晶片22、23、24會將電能轉換為光能，而分別發出紅光、綠光，及藍光，則每一個 發光二極體單元2所發出的光即是混合該等發光二極體晶片22、23、24的混色光。In more detail, each of the driving circuits 120 has a connecting portion 121 electrically connectable to the corresponding light emitting diode unit 2, and each of the light emitting diode units 2 also includes a connecting portion for the connecting portion In the first preferred embodiment, the connecting portion 121 is disposed on the top surface of the corresponding driving circuit 120 and electrically connects the electrode portion 21 of the LED unit 2. The red, green, and blue light-emitting diode chips 22, 23, and 24 of the light-emitting diode unit 2 are electrically connected to the electrode portion 21, respectively, and then connected to the driving circuit 120 through the electrode portion 21. The portion 121 is electrically connected. Therefore, when the driving circuit 120 supplies power to the electrode portion 21, the LED chips 22, 23, and 24 convert electrical energy into light energy, and respectively emit red light, green light, and blue light. Every one The light emitted by the light-emitting diode unit 2 is a mixed color light that mixes the light-emitting diode chips 22, 23, and 24.
此處值得一提的是，該紅色、綠色，及藍色發光二極體晶片22、23、24也可分別替換成一可發出例如藍光或紫外光等短波長光的發光二極體晶片，再搭配一波長轉換層(圖未示)。利用該波長轉換層吸收該發光二極體晶片所發出的光而激發出一波長大於該發光二極體晶片發出的光(藍光或紫外光)的激發光(例如紅光、黃光，或綠光)，如此，即可藉由該波長轉換層進一步調整該發光二極體單元2的演色性(color rendering index，CRI)及色溫(color temperature)。It is worth mentioning that the red, green, and blue LED chips 22, 23, 24 can also be replaced with a light-emitting diode wafer that emits short-wavelength light such as blue light or ultraviolet light, respectively. With a wavelength conversion layer (not shown). Absorbing light emitted by the light emitting diode chip by the wavelength conversion layer to excite excitation light having a wavelength greater than that emitted by the light emitting diode chip (blue light or ultraviolet light) (for example, red light, yellow light, or green light) Light), in this way, the color rendering index (CRI) and color temperature of the LED unit 2 can be further adjusted by the wavelength conversion layer.
該等擋光牆3設置於任相鄰的發光二極體單元2之間，使相鄰的發光二極體單元2產生的光互不干擾，因此，構成該等擋光牆3的材料須為不透光，如此，可令該等發光二極體單元2發出的光被該等擋光牆3阻擋，而可避免相鄰的發光二極體單元2所發出之光相互干擾的問題。該等擋光牆3可透過微影製程、薄膜沉積等製程形成於該基板11表面，於該第一較佳實施例中，該等擋光牆3是利用不透光的光阻材料，利用微影製程，配合該等陣列排列的發光二極體單元2而相互交錯地設置於該基板11的一表面，並由該表面朝遠離該基板11方向垂直延伸而實質的平行該發光二極體單元2。較佳地，為了有效阻隔該等發光二極體單元2彼此的光相互干擾，所以該等擋光牆3的高度H會不小於該發光二極體單元2的高度。The light blocking walls 3 are disposed between any adjacent light emitting diode units 2 so that the light generated by the adjacent light emitting diode units 2 does not interfere with each other. Therefore, the materials constituting the light blocking walls 3 must be The light is transmitted, so that the light emitted by the light-emitting diode units 2 can be blocked by the light-blocking walls 3, and the problem that the light emitted by the adjacent light-emitting diode units 2 interfere with each other can be avoided. The light blocking walls 3 are formed on the surface of the substrate 11 by a process such as a lithography process or a film deposition process. In the first preferred embodiment, the light blocking walls 3 are made of an opaque photoresist material. The lithography process is disposed on the surface of the substrate 11 alternately with the LED arrays 2 arranged in the array, and extends perpendicularly from the surface toward the substrate 11 to substantially parallel the LEDs Unit 2. Preferably, in order to effectively block the mutual interference of the light-emitting diode units 2 with each other, the height H of the light-blocking walls 3 is not less than the height of the light-emitting diode unit 2.
此外，要說明的是，本發明的該等擋光牆3只要配合形成於相鄰的發光二極體單元2之間，即可達成區隔任相鄰的發光二極體單元2，而令其發出的光彼此不互相干擾的目的，因此，其排列方式並不限於此，該等發光二極體單元2也可視顯示需求而有環圍成多邊形、彼此間隔，或呈特定形狀等排列方式，此時，該等擋光牆3是隨著該等發光二極體單元2的多變排列方式而隨之改變其設置。In addition, it should be noted that the light-shielding walls 3 of the present invention can be separated from each other by the adjacent light-emitting diode units 2, so that the adjacent light-emitting diode units 2 can be separated. The light does not interfere with each other, and therefore, the arrangement thereof is not limited thereto, and the light-emitting diode units 2 may also be arranged in a polygonal shape, spaced apart from each other, or arranged in a specific shape, depending on display requirements. The light-blocking walls 3 are changed in accordance with the variable arrangement of the light-emitting diode units 2.
參閱圖3，本發明每一個發光二極體單元2更包括一個發光二極體封裝件25，該發光二極體封裝件25為用於封裝該紅色、綠色，及藍色發光二極體晶片22、23、24，而其封裝方式可視需求而改變，例如，可先將該等發光二極體晶片22、23、24設置於該晶片本體1上後，再利用該發光二極體封裝件25一併地封裝該等發光二極體晶片22、23、24；或可先分別地封裝該等發光二極體晶片22、23、24後，再分別地將封裝後的發光二極體晶片22、23、24設置於該晶片本體1上。Referring to FIG. 3, each of the LED units 2 of the present invention further includes a light emitting diode package 25 for packaging the red, green, and blue light emitting diode chips. 22, 23, 24, and the package mode thereof may be changed according to requirements. For example, the light-emitting diode chips 22, 23, 24 may be disposed on the wafer body 1 before the light-emitting diode package is used. The LEDs 22, 23, and 24 are packaged together; or the LEDs 22, 23, and 24 may be separately packaged, and then the packaged LEDs are separately packaged. 22, 23, 24 are disposed on the wafer body 1.
值得一提的是，由於該發光二極體封裝件25為透明，並不影響該等發光二極體晶片22、23、24的發光亮度，且再透過設置於任相鄰的發光二極體封裝件25之間的該等擋光牆3的相互配合，不僅可保護該等發光二極體晶片22、23、24避免外界因素而影響其發光品質，還可增強色彩飽和度及色彩純淨度。It is worth mentioning that the light-emitting diode package 25 is transparent, does not affect the light-emitting brightness of the light-emitting diode chips 22, 23, and 24, and is further disposed through any adjacent light-emitting diode package. The mutual cooperation of the light-blocking walls 3 between 25 can not only protect the light-emitting diode chips 22, 23, 24 from external factors, but also enhance the color saturation and color purity.
參閱圖4，本發明顯示器結構的一第二較佳實 施例，大致上是相同於該第一較佳實施例，其不同之處在於該第二較佳實施例的電路單元12僅具有一個分別與該輸入電路13、該輸出電路14，以及各發光二極體單元2電連接的驅動電路120。該驅動電路120可同時輸出相同的控制訊號或多組不同的控制訊號至該等發光二極體單元2，而可控制該等發光二極體單元2同時或分別作動。當外界電訊號透過該輸入電路13與輸出電路14的配合，自該輸入電路13傳送至該驅動電路120，再傳送至該輸出電路14，形成一可被控制的發光迴路，即可同時透過各連接部121將電訊號傳送至對應的發光二極體單元2的電極部21，而控制該等發光二極體單元2的開關。Referring to FIG. 4, a second preferred embodiment of the display structure of the present invention The embodiment is substantially the same as the first preferred embodiment, except that the circuit unit 12 of the second preferred embodiment has only one input circuit 13 and the output circuit 14, respectively. The driving circuit 120 is electrically connected to the diode unit 2. The driving circuit 120 can simultaneously output the same control signal or multiple sets of different control signals to the LED units 2, and can control the LED units 2 to operate simultaneously or separately. When the external electrical signal is transmitted through the input circuit 13 and the output circuit 14, the input circuit 13 is transmitted to the driving circuit 120, and then transmitted to the output circuit 14 to form a controllable light-emitting circuit. The connecting portion 121 transmits the electrical signal to the electrode portion 21 of the corresponding light-emitting diode unit 2, and controls the switches of the light-emitting diode units 2.
綜上所述，本發明顯示器結構藉由在相鄰的發光二極體單元2間設置不透光的擋光牆3，並令該等擋光牆3的高度H不小於該等發光二極體單元2，而可避免任相鄰發光二極體單元2彼此的光干擾，且能增加發光二極體單元2的正向發光，進而使本發明顯示器結構提升整體色彩飽和度，故確實能達成本發明之目的。In summary, the display structure of the present invention is provided with an opaque light-blocking wall 3 between adjacent light-emitting diode units 2, and the height H of the light-blocking walls 3 is not less than the light-emitting diodes. The body unit 2 can avoid the light interference between any adjacent light-emitting diode units 2, and can increase the forward light emission of the light-emitting diode unit 2, thereby improving the overall color saturation of the display structure of the present invention, so that the present invention can be achieved. The purpose of the invention.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.
1‧‧‧晶片本體1‧‧‧chip body
12‧‧‧電路單元12‧‧‧ circuit unit
120‧‧‧驅動電路120‧‧‧Drive circuit
121‧‧‧連接部121‧‧‧Connecting Department
122‧‧‧傳輸電路122‧‧‧Transmission circuit
13‧‧‧輸入電路13‧‧‧Input circuit
14‧‧‧輸出電路14‧‧‧Output circuit
2‧‧‧發光二極體單元2‧‧‧Lighting diode unit
21‧‧‧電極部21‧‧‧Electrode
3‧‧‧擋光牆3‧‧‧Light blocking wall
H‧‧‧高度H‧‧‧ Height
Claims (8)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
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| TW103111791A TWI506605B (en) | 2014-03-28 | 2014-03-28 | Display structure |
| CN201510136095.4A CN104952372A (en) | 2014-03-28 | 2015-03-26 | Display structure |
| US14/670,736 US20150282265A1 (en) | 2014-03-28 | 2015-03-27 | Display Structure |
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| TW103111791A TWI506605B (en) | 2014-03-28 | 2014-03-28 | Display structure |
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| TW201537539A TW201537539A (en) | 2015-10-01 |
| TWI506605B true TWI506605B (en) | 2015-11-01 |
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| TW103111791A TWI506605B (en) | 2014-03-28 | 2014-03-28 | Display structure |
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| CN (1) | CN104952372A (en) |
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| CN105280069A (en) * | 2015-10-21 | 2016-01-27 | 黄守瑜 | Novel educational device |
| CN105303946A (en) * | 2015-10-21 | 2016-02-03 | 黄守瑜 | Medical education equipment |
| US20200050058A1 (en) * | 2018-08-10 | 2020-02-13 | Innolux Corporation | Electronic device |
| US11244930B2 (en) * | 2018-08-10 | 2022-02-08 | Innolux Corporation | Electronic device with light emitting units with reduced power consumption |
| CN111312094B (en) * | 2020-02-26 | 2021-11-23 | 江西恒明科技发展有限公司 | Shell and LED nixie tube |
| TWI728779B (en) * | 2020-04-15 | 2021-05-21 | 宏齊科技股份有限公司 | Led display screen module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1942302A1 (en) * | 2005-10-28 | 2008-07-09 | Takiron Co., Ltd. | Surface-emitting device and light-emitting method for surface-emitting device |
| TW200945940A (en) * | 2008-04-29 | 2009-11-01 | Blue Star Lighting Technology Co Ltd | Flexible LED display |
| TW201137841A (en) * | 2010-01-28 | 2011-11-01 | Sony Corp | Driving method for image display apparatus and driving method for image display apparatus assembly |
| TW201238089A (en) * | 2010-10-12 | 2012-09-16 | Au Optronics Corp | LED apparatus |
| US20130215596A1 (en) * | 2012-02-16 | 2013-08-22 | Qualcomm Mems Technologies, Inc. | Flash illumination system |
| TW201411593A (en) * | 2012-08-09 | 2014-03-16 | Pixtronix Inc | Circuits for controlling display apparatus |
| TWM488814U (en) * | 2014-03-28 | 2014-10-21 | Macroblock Inc | Display structure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2524372B2 (en) * | 1987-12-22 | 1996-08-14 | キヤノン株式会社 | Light emitting diode display |
| JP3292133B2 (en) * | 1997-04-14 | 2002-06-17 | 日亜化学工業株式会社 | LED display and display device using the same |
| JP2007264201A (en) * | 2006-03-28 | 2007-10-11 | Sanyo Electric Co Ltd | Display |
| US8378358B2 (en) * | 2009-02-18 | 2013-02-19 | Everlight Electronics Co., Ltd. | Light emitting device |
| CN202632680U (en) * | 2012-04-28 | 2012-12-26 | 北京金立翔艺彩科技股份有限公司 | Pedal type LED (Light Emitting Diode) display screen mask |
| TWI457890B (en) * | 2012-08-17 | 2014-10-21 | Macroblock Inc | Display structure and display |
| JP6186904B2 (en) * | 2013-06-05 | 2017-08-30 | 日亜化学工業株式会社 | Light emitting device |
-
2014
- 2014-03-28 TW TW103111791A patent/TWI506605B/en active
-
2015
- 2015-03-26 CN CN201510136095.4A patent/CN104952372A/en active Pending
- 2015-03-27 US US14/670,736 patent/US20150282265A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1942302A1 (en) * | 2005-10-28 | 2008-07-09 | Takiron Co., Ltd. | Surface-emitting device and light-emitting method for surface-emitting device |
| TW200945940A (en) * | 2008-04-29 | 2009-11-01 | Blue Star Lighting Technology Co Ltd | Flexible LED display |
| TW201137841A (en) * | 2010-01-28 | 2011-11-01 | Sony Corp | Driving method for image display apparatus and driving method for image display apparatus assembly |
| TW201238089A (en) * | 2010-10-12 | 2012-09-16 | Au Optronics Corp | LED apparatus |
| US20130215596A1 (en) * | 2012-02-16 | 2013-08-22 | Qualcomm Mems Technologies, Inc. | Flash illumination system |
| TW201411593A (en) * | 2012-08-09 | 2014-03-16 | Pixtronix Inc | Circuits for controlling display apparatus |
| TWM488814U (en) * | 2014-03-28 | 2014-10-21 | Macroblock Inc | Display structure |
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| US20150282265A1 (en) | 2015-10-01 |
| TW201537539A (en) | 2015-10-01 |
| CN104952372A (en) | 2015-09-30 |
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