CN103354068A - Method for manufacturing LED displayer and LED displayer - Google Patents

Method for manufacturing LED displayer and LED displayer Download PDF

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Publication number
CN103354068A
CN103354068A CN2013102737520A CN201310273752A CN103354068A CN 103354068 A CN103354068 A CN 103354068A CN 2013102737520 A CN2013102737520 A CN 2013102737520A CN 201310273752 A CN201310273752 A CN 201310273752A CN 103354068 A CN103354068 A CN 103354068A
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CN
China
Prior art keywords
protective cover
printed
pwb
wiring board
upper surface
Prior art date
Application number
CN2013102737520A
Other languages
Chinese (zh)
Inventor
王鹏
Original Assignee
王鹏
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 王鹏 filed Critical 王鹏
Priority to CN2013102737520A priority Critical patent/CN103354068A/en
Publication of CN103354068A publication Critical patent/CN103354068A/en

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Abstract

The invention relates to a method for manufacturing an LED displayer and the LED displayer. The method for manufacturing the LED displayer includes the steps of (1) manufacturing a printed circuit board, (2) enabling LED wafers to be fixed on the printed circuit board, (3) covering the upper surface of the printed circuit board through a protective cover, (4) injecting transparent packaging glue from the positions of N light-emitting through holes of the protective cover, (5) baking the printed circuit board, (6) conducting welding on components in a driving circuit on the lower surface of the printed circuit board, and (7) completing the manufacturing processes. The LED displayer comprises the printed circuit board, the LED wafers and the protective cover, the N LED wafers are fixed on N welding pad sets on the upper surface of the printed circuit board respectively, and a welding pad in each welding pad set is connected with the driving circuit on the lower surface of the printed circuit board through a conducting circuit on the printed circuit board. The protective cover covers the upper surface of the printed circuit board, the N light-emitting through holes are formed in the protective cover, and the N light-emitting through holes are located above the N LED wafers respectively. The method and the LED displayer are easy to operate and low in production cost.

Description

The method for making of light-emitting diode display and light-emitting diode display

 

(1), technical field: the method for making and the light-emitting diode display that the present invention relates to a kind of light-emitting diode display.

(2), background technology: the production technology of traditional light-emitting diode display spare is: play the PIN pin in printed board first, and then die bond, bonding wire, install plastic cement external member, encapsulating, baking-curing additional, utilize at last the PIN pin to be welded on the drive circuit board, could form so a complete light-emitting diode display spare; Whole process labor intensive, material resources need the special PIN machine of beating and beat the PIN personnel.Existing light-emitting diode display spare dot matrix production technology is very complicated, and links all needs a large amount of manpower and materials, and production cost is higher.And present market development is more and more harsher to the requirement of production cost, and the production technology of this complex process, labor intensive material resources can not adapt to the development in market.Under this background, it is imperative to seek a kind of technique novel dot matrix display device simple, easy to operate, with low cost.

(3), summary of the invention:

The technical problem to be solved in the present invention is: not enough for prior art, a kind of method for making and light-emitting diode display of simple to operate, light-emitting diode display that production cost is low are provided.

Technical scheme of the present invention:

A kind of method for making of light-emitting diode display, contain the following step:

Step 1: make the printed-wiring board (PWB) that is used for fixed L ED wafer: the upper surface of this printed-wiring board (PWB) is provided with N pad group, N pad group is used for fixing respectively N LED wafer, contain M pad in each pad group, M pad by the conducting wire on the printed-wiring board (PWB) respectively with the printed-wiring board (PWB) lower surface on driving circuit in corresponding site be connected; N is the natural number more than or equal to 1, and M is the natural number more than or equal to 2;

Step 2: adopt the die bond mode that N LED wafer is separately fixed on N the pad group;

Step 3: the upper surface at printed-wiring board (PWB) covers a protective cover, the material of protective cover is light tight material, the inside of this protective cover is by laterally baffles and vertical baffles are divided into N independently emitting space, N LED wafer lays respectively in N the emitting space, the upper surface of this protective cover is provided with N luminous through hole, this N luminous through hole is communicated with N emitting space respectively, and this N luminous through hole lays respectively at the top of N LED wafer;

Step 4: inject transparent enclosure glue from N luminous through hole, make transparent enclosure glue be full of N emitting space, transparent enclosure glue links together protective cover and printed-wiring board (PWB);

Step 5: printed-wiring board (PWB) is put into the baking box baking;

Step 6: the components and parts in the driving circuit on the welding printed-wiring board (PWB) lower surface;

Step 7: complete.

In the step 1, N pad group is evenly arranged on the upper surface of printed-wiring board (PWB); M is 2, or is 3, or is 4.

In the step 3, the bottom surface of protective cover is identical with the size dimension of printed-wiring board (PWB), and the upper surface of protective cover is the plane.

The profile of protective cover is cuboid, or is the square bodily form, or is flat cylindrical; The material of protective cover is opaque-plastic.

In the step 4, adopt the method for some glue to inject transparent enclosure glue from luminous through hole.

A kind of light-emitting diode display that adopts said method to make, contain printed-wiring board (PWB), LED wafer and protective cover, the upper surface of printed-wiring board (PWB) is provided with N pad group, be fixed with respectively N LED wafer on N the pad group, contain M pad in each pad group, M pad by the conducting wire on the printed-wiring board (PWB) respectively with the printed-wiring board (PWB) lower surface on driving circuit in corresponding site be connected; The upper surface of printed-wiring board (PWB) is coated with a protective cover, the material of protective cover is light tight material, the inside of this protective cover is by laterally baffles and vertical baffles are divided into N independently emitting space, N LED wafer lays respectively in N the emitting space, the upper surface of this protective cover is provided with N luminous through hole, this N luminous through hole is communicated with N emitting space respectively, and this N luminous through hole lays respectively at the top of N LED wafer; Be full of transparent enclosure glue in N the emitting space, transparent enclosure glue links together protective cover and printed-wiring board (PWB); N is the natural number more than or equal to 1, and M is the natural number more than or equal to 2;

N pad group is evenly arranged on the upper surface of printed-wiring board (PWB); M is 2, or is 3, or is 4.

The bottom surface of protective cover is identical with the size dimension of printed-wiring board (PWB), and the upper surface of protective cover is the plane.

The profile of protective cover is cuboid, or is the square bodily form, or is flat cylindrical; The material of protective cover is opaque-plastic.

Beneficial effect of the present invention:

1. the present invention is in the direct die bond of the upper surface of printed-wiring board (PWB), lower surface at printed-wiring board (PWB) arranges driving circuit, saved the setting of beating this link of PIN pin and drive circuit board, not only simplified operating procedure, saved manpower, and reduced production cost.

2. the present invention adopts the method for a glue to inject transparent enclosure glue from luminous through hole, compares with traditional glue-pouring method, has reduced the use amount of glue, has saved material, has reduced production cost.

(4), description of drawings:

Fig. 1 is the structural representation of wiring board;

Fig. 2 is the structural representation behind the fixed L ED wafer on the wiring board;

Fig. 3 is the structural representation behind the covered protection cover on the wiring board;

Fig. 4 is the A-A sectional structure synoptic diagram among Fig. 3;

Fig. 5 is the structural representation of protective cover reverse side.

(5), embodiment:

Referring to Fig. 1~Fig. 5, among the figure, the method for making of light-emitting diode display contains the following step:

Step 1: make the printed-wiring board (PWB) 1 that is used for fixed L ED wafer: the upper surface of this printed-wiring board (PWB) 1 is provided with 16 pad groups, 16 pad groups are used for fixing respectively 16 LED wafers 4, contain in each pad group 3,2 pads of 2 pads 3 by the conducting wire on the printed-wiring board (PWB) 1 respectively with printed-wiring board (PWB) 1 lower surface on driving circuit in corresponding site be connected;

Step 2: adopt the die bond mode that 16 LED wafers 4 are separately fixed on 14 pad groups;

Step 3: the upper surface at printed-wiring board (PWB) 1 covers a protective cover 2, the material of protective cover 2 is light tight material, the inside of this protective cover 2 is by laterally baffles 6 and vertical baffles 7 are divided into 16 independently emitting spaces 8,16 LED wafers 4 lay respectively in 16 emitting spaces 8, the upper surface of this protective cover 2 is provided with 16 luminous through holes 5, these 16 luminous through holes 5 are communicated with 16 emitting spaces 8 respectively, and these 16 luminous through holes 5 lay respectively at the top of 16 LED wafers 4;

Step 4: inject transparent enclosure glue from 16 luminous through holes 5, make transparent enclosure glue be full of 16 emitting spaces 8, transparent enclosure glue links together protective cover 2 and printed-wiring board (PWB) 1;

Step 5: printed-wiring board (PWB) 1 is put into the baking box baking;

Step 6: the components and parts 9 in the driving circuit on welding printed-wiring board (PWB) 1 lower surface;

Step 7: complete.

In the step 1,16 pad groups are evenly arranged on the upper surface of printed-wiring board (PWB) 1.

In the step 3, the bottom surface of protective cover 2 is identical with the size dimension of printed-wiring board (PWB) 1, and the upper surface of protective cover 2 is the plane.

The profile of protective cover 2 is cuboid; The material of protective cover 2 is opaque-plastic.

In the step 4, adopt the method for some glue to inject transparent enclosure glue from luminous through hole 5.

The light-emitting diode display that adopts said method to make contains printed-wiring board (PWB) 1, LED wafer 4 and protective cover 2, the upper surface of printed-wiring board (PWB) 1 is provided with 16 pad groups, be fixed with respectively 16 LED wafers 4 on 16 pad groups, contain in each pad group 3,2 pads of 2 pads 3 by the conducting wire on the printed-wiring board (PWB) 1 respectively with printed-wiring board (PWB) 1 lower surface on driving circuit in corresponding site be connected; The upper surface of printed-wiring board (PWB) 1 is coated with a protective cover 2, the material of protective cover 2 is light tight material, the inside of this protective cover 2 is by laterally baffles 6 and vertical baffles 7 are divided into 16 independently emitting spaces 8,16 LED wafers 4 lay respectively in 16 emitting spaces 8, the upper surface of this protective cover 2 is provided with 16 luminous through holes 5, these 16 luminous through holes 5 are communicated with 16 emitting spaces 8 respectively, and these 16 luminous through holes 5 lay respectively at the top of 16 LED wafers 4; Be full of transparent enclosure glue in 16 emitting spaces 8, transparent enclosure glue links together protective cover 2 and printed-wiring board (PWB) 1.

16 pad groups are evenly arranged on the upper surface of printed-wiring board (PWB) 1.

The bottom surface of protective cover 2 is identical with the size dimension of printed-wiring board (PWB) 1, and the upper surface of protective cover 2 is the plane.

The profile of protective cover 2 is cuboid; The material of protective cover 2 is opaque-plastic.

Claims (9)

1. the method for making of a light-emitting diode display is characterized in that: contain the following step:
Step 1: make the printed-wiring board (PWB) that is used for fixed L ED wafer: the upper surface of this printed-wiring board (PWB) is provided with N pad group, N pad group is used for fixing respectively N LED wafer, contain M pad in each pad group, M pad by the conducting wire on the printed-wiring board (PWB) respectively with the printed-wiring board (PWB) lower surface on driving circuit in corresponding site be connected; N is the natural number more than or equal to 1, and M is the natural number more than or equal to 2;
Step 2: adopt the die bond mode that N LED wafer is separately fixed on N the pad group;
Step 3: the upper surface at printed-wiring board (PWB) covers a protective cover, the material of protective cover is light tight material, the inside of this protective cover is by laterally baffles and vertical baffles are divided into N independently emitting space, N LED wafer lays respectively in N the emitting space, the upper surface of this protective cover is provided with N luminous through hole, this N luminous through hole is communicated with N emitting space respectively, and this N luminous through hole lays respectively at the top of N LED wafer;
Step 4: inject transparent enclosure glue from N luminous through hole, make transparent enclosure glue be full of N emitting space, transparent enclosure glue links together protective cover and printed-wiring board (PWB);
Step 5: printed-wiring board (PWB) is put into the baking box baking;
Step 6: the components and parts in the driving circuit on the welding printed-wiring board (PWB) lower surface;
Step 7: complete.
2. the method for making of light-emitting diode display according to claim 1, it is characterized in that: in the described step 1, N pad group is evenly arranged on the upper surface of printed-wiring board (PWB); M is 2, or is 3, or is 4.
3. the method for making of light-emitting diode display according to claim 1, it is characterized in that: in the described step 3, the bottom surface of protective cover is identical with the size dimension of printed-wiring board (PWB), and the upper surface of protective cover is the plane.
4. the method for making of light-emitting diode display according to claim 3, it is characterized in that: the profile of described protective cover is cuboid, or is the square bodily form, or is flat cylindrical; The material of protective cover is opaque-plastic.
5. the method for making of light-emitting diode display according to claim 1 is characterized in that: in the described step 4, adopt the method for some glue to inject transparent enclosure glue from luminous through hole.
6. light-emitting diode display that adopts the method in the claim 1 to make, it is characterized in that: contain printed-wiring board (PWB), LED wafer and protective cover, the upper surface of printed-wiring board (PWB) is provided with N pad group, be fixed with respectively N LED wafer on N the pad group, contain M pad in each pad group, M pad by the conducting wire on the printed-wiring board (PWB) respectively with the printed-wiring board (PWB) lower surface on driving circuit in corresponding site be connected; The upper surface of printed-wiring board (PWB) is coated with a protective cover, the material of protective cover is light tight material, the inside of this protective cover is by laterally baffles and vertical baffles are divided into N independently emitting space, N LED wafer lays respectively in N the emitting space, the upper surface of this protective cover is provided with N luminous through hole, this N luminous through hole is communicated with N emitting space respectively, and this N luminous through hole lays respectively at the top of N LED wafer; Be full of transparent enclosure glue in N the emitting space, transparent enclosure glue links together protective cover and printed-wiring board (PWB); N is the natural number more than or equal to 1, and M is the natural number more than or equal to 2.
7. light-emitting diode display according to claim 6, it is characterized in that: described N pad group is evenly arranged on the upper surface of printed-wiring board (PWB); M is 2, or is 3, or is 4.
8. light-emitting diode display according to claim 6, it is characterized in that: the bottom surface of described protective cover is identical with the size dimension of printed-wiring board (PWB), and the upper surface of protective cover is the plane.
9. light-emitting diode display according to claim 8, it is characterized in that: the profile of described protective cover is cuboid, or is the square bodily form, or is flat cylindrical; The material of protective cover is opaque-plastic.
CN2013102737520A 2013-07-02 2013-07-02 Method for manufacturing LED displayer and LED displayer CN103354068A (en)

Priority Applications (1)

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CN2013102737520A CN103354068A (en) 2013-07-02 2013-07-02 Method for manufacturing LED displayer and LED displayer

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Application Number Priority Date Filing Date Title
CN2013102737520A CN103354068A (en) 2013-07-02 2013-07-02 Method for manufacturing LED displayer and LED displayer

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CN103354068A true CN103354068A (en) 2013-10-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109461727A (en) * 2017-09-06 2019-03-12 弘凯光电(深圳)有限公司 A kind of moulding manufacture method showing screen and LED module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165182A (en) * 1987-12-22 1989-06-29 Canon Inc Light emitting diode display device
KR20090064959A (en) * 2007-12-17 2009-06-22 이창환 Led lighting panel for indoor advertisment
CN101761810A (en) * 2010-02-25 2010-06-30 宁波复洋光电有限公司 White light plane light source LED module and manufacturing method thereof
CN201946238U (en) * 2010-07-30 2011-08-24 北京韦侨顺科贸有限公司 LED lattice display panel
CN102419936A (en) * 2011-11-28 2012-04-18 上海三思电子工程有限公司 Light emitting diode (LED) dot matrix block with small dot space and preparation method for LED dot matrix block

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165182A (en) * 1987-12-22 1989-06-29 Canon Inc Light emitting diode display device
KR20090064959A (en) * 2007-12-17 2009-06-22 이창환 Led lighting panel for indoor advertisment
CN101761810A (en) * 2010-02-25 2010-06-30 宁波复洋光电有限公司 White light plane light source LED module and manufacturing method thereof
CN201946238U (en) * 2010-07-30 2011-08-24 北京韦侨顺科贸有限公司 LED lattice display panel
CN102419936A (en) * 2011-11-28 2012-04-18 上海三思电子工程有限公司 Light emitting diode (LED) dot matrix block with small dot space and preparation method for LED dot matrix block

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109461727A (en) * 2017-09-06 2019-03-12 弘凯光电(深圳)有限公司 A kind of moulding manufacture method showing screen and LED module

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Address after: 450000 No. 32, golden shuttle Road, hi tech Zone, Henan, Zhengzhou

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Application publication date: 20131016

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