JP2522803Y2 - ドライエッチング用終点検出装置 - Google Patents
ドライエッチング用終点検出装置Info
- Publication number
- JP2522803Y2 JP2522803Y2 JP1989060526U JP6052689U JP2522803Y2 JP 2522803 Y2 JP2522803 Y2 JP 2522803Y2 JP 1989060526 U JP1989060526 U JP 1989060526U JP 6052689 U JP6052689 U JP 6052689U JP 2522803 Y2 JP2522803 Y2 JP 2522803Y2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- end point
- dry etching
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001312 dry etching Methods 0.000 title claims description 15
- 238000001514 detection method Methods 0.000 claims description 17
- 230000010355 oscillation Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989060526U JP2522803Y2 (ja) | 1989-05-25 | 1989-05-25 | ドライエッチング用終点検出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989060526U JP2522803Y2 (ja) | 1989-05-25 | 1989-05-25 | ドライエッチング用終点検出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH031532U JPH031532U (cs) | 1991-01-09 |
| JP2522803Y2 true JP2522803Y2 (ja) | 1997-01-16 |
Family
ID=31587965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989060526U Expired - Lifetime JP2522803Y2 (ja) | 1989-05-25 | 1989-05-25 | ドライエッチング用終点検出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2522803Y2 (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5274514U (cs) * | 1975-12-01 | 1977-06-03 | ||
| JP2011137843A (ja) * | 2008-03-27 | 2011-07-14 | Nec Corp | エッチング終点検出パターンおよびエッチング終点検出方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834309A (ja) * | 1981-08-25 | 1983-02-28 | Nok Corp | 非接触式面性状測定法 |
| JPS61250520A (ja) * | 1985-04-30 | 1986-11-07 | Hoya Corp | 液面レベル計 |
| JPH0691045B2 (ja) * | 1986-03-03 | 1994-11-14 | 日電アネルバ株式会社 | エツチングモニタ−装置 |
-
1989
- 1989-05-25 JP JP1989060526U patent/JP2522803Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031532U (cs) | 1991-01-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |