JP2520434Y2 - Board fixing chip fittings - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board fixing chip metal fitting, and particularly, to facilitate fixing of a circuit board,
The present invention relates to a board fixing chip fitting that can prevent stress concentration caused by fixing a circuit board.

[0002]

2. Description of the Related Art Conventionally, in order to fix a circuit board such as a hybrid IC and a printed wiring board to an apparatus main body or the like, it is directly fixed with screws, soldering, or a soft rubber adhesive. Has been adopted.

However, in the fixing method described above, since the circuit board is made of alumina, glass epoxy, or the like, the circuit board and the main body of the apparatus have different linear expansions with respect to changes in ambient temperature. There is a risk that the output stress of the circuit board may be adversely affected as well as the dynamic stress is generated.

Further, since the external vibration and shock are directly transmitted to the circuit board, the vibration and shock cause
There is a problem that the circuit board is damaged.

The object of the present invention is to fix the circuit board without causing mechanical stress to the circuit board, and also to absorb the external vibration and shock so that the circuit board can An object of the present invention is to provide a board fixing chip fitting that does not adversely affect circuit characteristics.

[0006]

In order to achieve the above object, the present invention is a board fixing chip fitting for fixing a circuit board to an apparatus body, wherein the board fixing chip fitting has a predetermined width. The both ends of the plate material are folded back in a substantially parallel state to form a curved central portion, and the curved central portion is folded inward to form a curved portion located between both end portions. A spring portion is formed on one end side of the curved portion, and a supporting portion located outside the spring portion is formed on the other end side of the curved portion, and a soldering portion is formed on one end portion of the plate material. The soldering portion is formed and fixed to the circuit board, and the supporting portion is fitted into the supporting groove provided in the device body, whereby the circuit board is fixed to the device body. Width from one end of the plate A slit having a predetermined length is provided in a direction orthogonal to the direction, and the peripheral surface of the support portion has a shape corresponding to the shape of the support groove provided in the device body. is there.

[0007]

The present invention adopts the above means,
The circuit board can be fixed without causing mechanical stress to the circuit board. Further, it is possible to improve the output characteristics of the circuit board by absorbing external vibration and shock.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention shown in the drawings will be described below. 1 to 3 show an embodiment of a board fixing chip fitting according to the present invention, and FIG. 4 shows a state in which a circuit board is fixed to an apparatus main body using the board fixing tip fitting. There is. This board fixing chip fitting 2 is shown in FIG.
As shown in FIG. 1, the elastic plate material 1 having a predetermined width such as iron or copper is integrally formed as shown in FIGS.

That is, this board fixing chip fitting 2
Is a plate material 1 having a predetermined width, which is folded back in such a manner that both ends thereof are substantially parallel to each other to form a curved central portion, and the curved central portion is folded inward to locate between the both end portions. The curved portion 5 is formed, and the spring portion 4 is formed on one end side of the curved portion 5.
And a supporting portion 6 located outside the spring portion 4 on the other end side of the bending portion 5.

As described above, the board fixing chip metal fitting 2 is
As shown in FIG. 2, it is formed in a substantially S-shaped cross section that is curved with a predetermined curvature, and a soldering portion 7 is formed at one end of the plate material 1. Further, the soldering portion 7 is provided with a slit 3 in a direction orthogonal to the width direction from one end of the plate material 1,
The tip portion of this slit 3 is formed in a circular shape. Further, the peripheral surface of the support portion 6 has a shape corresponding to the shape of the support groove 11 into which the support portion 6 fits, and is linear in this embodiment.

In order to fix the circuit board 8 to the main body 9 of the apparatus by using the board fixing chip fitting 2 having the above structure, first, the board fixing chip fitting 2 is fixed at a predetermined position on the peripheral portion of the circuit board 8. The soldering part 7 is soldered and fixed. On the other hand, a step portion 10 is provided on the inner wall of the apparatus body 9, and the step portion 1
A support groove 11 is provided on the upper part of 0.

Then, as shown in FIG. 4, the circuit board 8 to which the board fixing chip fitting 2 is fixed is positioned inside the apparatus main body 9, and the supporting portion 6 of the board fixing chip fitting 2 is held in the apparatus main body 9. The circuit board 8 is brought into contact with the step portion 10 by fitting in the groove 11.

When the circuit board 8 is fixed by the board fixing chip fitting 2 as described above, the bending portion 5 and the spring portion 4 relieve the mechanical stress generated in the circuit board 8 due to the change in the ambient temperature, and the circuit board 8 Does not adversely affect the output characteristics of the. Further, since the bending portion 5 and the spring portion 4 absorb external vibrations and shocks, there is no possibility that the circuit board 8 is damaged by the vibrations and shocks.

Since the slit 3 is provided in the soldering portion 7 of the board fixing chip fitting 2, the solder 12 can easily escape during soldering and the joint area can be reduced. Therefore, stress concentration due to the solder 12 and voids in the solder 12 can be minimized.

Further, since the board fixing chip fitting 2 is provided with the spring portion 4, the bending portion 5 and the supporting portion 6,
It has a structure that can be reduced in height and can be used as a surface mount component. Furthermore, when the circuit board 8 is fixed to the device body 9 by using the board fixing chip fitting 2, the device body 9 and the circuit board 8 are connected via the board fixing chip fitting 2, so that the board fixing is performed. The tip fitting 2 can be used as a ground contact.

FIG. 5 shows another embodiment of the board fixing chip fitting according to the present invention, and FIG. 6 shows a state in which the circuit board is fixed to the apparatus main body using the board fixing chip fitting. There is. This board fixing chip metal fitting 22 is integrally formed from a plate material having elasticity such as iron or copper similar to the plate material 1 of the first embodiment as shown in FIG.

That is, this board fixing chip fitting 22
Is a plate member having a predetermined width, which is folded back in such a manner that both ends thereof are substantially parallel to each other, and a central portion is formed into a curved shape. A curved portion 25 is formed, a spring portion 24 is formed on one end side of the curved portion 25, and a supporting portion 26 located outside the spring portion 24 is formed on the other end side of the curved portion 25. To do.

As described above, the board fixing chip metal fitting 22 is formed in a substantially S-shaped cross section which is curved with a predetermined curvature, and the soldering portion 27 is formed at one end of the plate member. Further, the soldering portion 27 is provided with a slit 23 in a direction orthogonal to the width direction from one end of the plate material.
The tip portion of 3 is formed in a curved shape. Further, the peripheral surface of the support portion 26 has a shape corresponding to the shape of the support groove 31 into which the support portion 26 is fitted, and is curved in this embodiment.

A board fixing chip metal member 22 having the above-mentioned structure
In order to fix the circuit board 28 to the cylindrical device body 29 by using, the soldering portion 27 of the board fixing chip metal fitting 22 is first soldered to a predetermined position on the peripheral edge of the circuit board 28. Fix it. On the other hand, a step portion 30 is provided on the inner wall of the apparatus main body 29, and a support groove 31 is provided on the upper portion of the step portion 30.

Then, as shown in FIG. 6, the circuit board 28 to which the board fixing chip metal fitting 22 is fixed is attached to the main body 2 of the apparatus.
9, the supporting portion 26 of the board fixing chip metal fitting 22 is fitted into the supporting groove 31 of the apparatus main body 29, and the circuit board 28 is brought into contact with the step portion 30.

When the circuit board 28 is fixed by the board fixing chip metal fittings 22 as described above, the bending portion 25 and the spring portion 24 relieve the mechanical stress generated in the circuit board 28 due to the change in the ambient temperature, and the circuit board 28. Does not adversely affect the output characteristics of the. Further, the bending portion 2 is protected from external vibrations and impacts.
5 and the spring portion 24 absorb it, so that there is no risk of the circuit board 28 being damaged by this vibration or impact.

Since the soldering portion 27 of the board fixing chip fitting 22 is provided with the slit 23,
Since the escape of the solder 32 at the time of soldering can be facilitated and the joint area can be reduced, stress concentration due to the solder 32 and voids in the solder 32 can be reduced as much as possible.

Further, the board fixing chip fitting 22 is provided with a spring portion 24, a bending portion 25, and a supporting portion 26,
Since it is bent, it has a structure that can be reduced in height and can be used as a surface mount component. In addition, the device main body 29 is provided with a board fixing chip fitting 22
When the circuit board 28 is fixed using the
Since 9 and the circuit board 28 are connected via the board fixing chip fitting 22, the board fixing chip fitting 22 can be used as a ground contact.

[0024]

The present invention is configured as described above, so that a board fixing chip metal fitting is soldered to a predetermined position on the peripheral portion of the circuit board and the circuit board fixing chip metal fitting is attached. Can be easily attached to the main body of the apparatus by fitting the support portion of the chip fixing metal fitting for the substrate into the support groove of the main body of the apparatus. Further, the bending portion and the spring portion relieve the mechanical stress generated in the circuit board due to the change in the ambient temperature between the circuit board and the apparatus main body, and the output characteristics of the circuit board are not adversely affected. Further, since the bending portion and the spring portion absorb vibrations and impacts from the outside, there is no possibility of damaging the circuit board due to the vibrations and impacts.

Further, since the slits are provided in the soldering portion of the board fixing chip fitting, the solder can easily escape during soldering, and the joint area can be reduced. Stress concentration and voids in the solder can be reduced as much as possible. The board fixing chip fitting is provided with a spring portion, a bending portion, and a supporting portion and is bent, so that the height can be reduced and it can be used as a surface mount component. .

Further, when the circuit board is fixed to the main body of the apparatus by using the board fixing chip fitting, the apparatus main body and the circuit board are connected through the board fixing chip fitting, so that the board fixing chip fitting is connected. Has an excellent effect that it can be used as a ground contact.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment of a substrate fixing chip fitting according to the present invention.

FIG. 2 is a schematic front view showing one embodiment of a board fixing chip fitting according to the present invention.

FIG. 3 is a schematic view showing a plate member of one embodiment of a chip fixing metal fitting for a substrate according to the present invention.

FIG. 4 is a schematic cross-sectional view showing a state in which a circuit board is attached to the apparatus main body by using the board fixing chip fitting of one embodiment according to the present invention.

FIG. 5 is a schematic plan view showing another embodiment of the substrate fixing chip fitting according to the present invention.

FIG. 6 is a schematic cross-sectional view showing a state in which a circuit board is attached to an apparatus main body using a board fixing chip fitting of another embodiment according to the present invention.

[Explanation of symbols]

 1 ... Plate material 2, 22 ... Chip fixing member for substrate 3, 23 ... Slit 4, 24 ... Spring portion 5, 25 ... Curved portion 6, 26 ... Support portion 7, 27 ... Soldering portion 8 , 28 ...... Circuit board 9, 29 ...... Device body 10, 30 ...... Step portion 11, 31 ...... Support groove 12, 32 ...... Solder

Claims (3)

(57) [Scope of utility model registration request] 1. A board fixing chip fitting (2) for fixing a circuit board (8) (28) to an apparatus body (9) (29).
(22), wherein the board fixing chip fittings (2) (2
In 2), the plate material (1) having a predetermined width is folded back so that both ends thereof are substantially parallel to each other to form a curved central portion, and the curved central portion is folded inward to form both ends. Bending portions (5) (25) located between the portions are formed, and spring portions (4) (24) are formed at one end side of the bending portions (5) (25), and the bending portion (5) is formed. Supporting portions (6) and (26) located outside the spring portions (4) and (24) are formed on the other end side of (25), and soldering portions (6) and (26) are formed at one end of the plate material (1). 7) and (27) are formed, the soldering portions (7) and (27) are fixed to the circuit boards (8) and (28), and the supporting portions (6) and (26) are attached to the device body (9). The support boards (8) and (28) are fitted into the support grooves (11) and (31) provided in the device body (29). Board fixing tip fittings, characterized in that the fixing. 2. The board fixing chip fitting according to claim 1, wherein slits (3) (23) having a predetermined length are provided from one end of the plate material (1) in a direction orthogonal to the width direction. 3. The supporting groove (1) provided in the device body (9) (29) is provided on the peripheral surface of the supporting portion (6) (26).
1) The shape corresponding to the shape of (31).
Chip fittings for fixing the board.