JP2517166B2 - Mounting position adjustment device for solid-state imaging device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting position adjusting device for adjusting a mounting position of a solid-state imaging device used in a solid-state color imaging device.

2. Description of the Related Art Generally, in a solid-state color image pickup device, image pickup light is separated into a plurality of color components by a color separation system, and a subject image of each color component is obtained by the solid-state image pickup device. Then, a standard color television signal of the NTSC system or the like is formed and output from each image pickup output.

In a color image pickup device using a plurality of solid-state image pickup devices, it is necessary to superimpose subject images of respective color components picked up by the solid-state image pickup devices, that is, to perform registration adjustment accurately.

FIG. 3 is an exploded perspective view of a main part of a conventional mounting position adjusting device holder.

In a mounting position adjusting device that adjusts the position of each solid-state image pickup device 1 to an optical member 6 such as a prism, the solid-state image pickup device 1 and a drive circuit are connected to electrode terminals 7 of each solid-state image pickup device that picks up a subject image of each color component. Then, the glass epoxy substrate having the opening 8 in the center is inserted from the back side to make the solid-state imaging device 1 operable.

Next, using the opening 8 of the glass epoxy substrate 9, the mounting member 10 is fixed to the back surface of the solid-state imaging device 1 with an instant adhesive or the like, and is fixed to the position adjusting jig 11 with the screw 12 via the mounting member 10. Then, the standard subject is imaged, the position of the standard subject image of the solid-state imaging device 1 is detected, and the position of the solid-state imaging device 1 is mechanically adjusted. After setting the position, it is confirmed whether or not foreign matter is attached to the joint surface between the prism 6 and the solid-state image sensor 1, and if it is attached, the foreign matter is wiped off with a cloth containing a solvent to bond the prism 6 and the solid-state image sensor 1 to each other. After fixing with an agent, the adhesive portion between the fixed image pickup device 1 and the attachment member 10 is peeled off, the glass epoxy substrate 9 is removed, and the mounting of the solid-state image pickup device 1 can be completed.

Problems to be Solved by the Invention Generally, in a color image pickup device using a plurality of solid-state image pickup devices, it is not possible to electrically adjust the image pickup screen position like a pickup tube. Therefore, the optical axis of each solid-state image pickup position is mechanically adjusted. It is necessary to adjust the relative position with respect to (1) with extremely high precision, and particularly in a solid-state color image pickup device that adopts a so-called spatial pixel shift method to achieve high resolution, it is necessary to adjust the position to the order of 1 μm.

In the conventional mounting position adjusting device, a glass epoxy substrate provided with a dedicated opening for connecting the solid-state image pickup device and the solid-state image pickup device drive circuit is required, and the connection is performed manually.

Instant adhesive and other mounting materials are used to hold the solid-state imaging device, and it is necessary to pay attention to the amount of adhesive, etc. when fixing the solid-state imaging device. Also, since there is a risk of damage to the solid-state imaging device, skill is required.

In addition, foreign matter on the joint surface between the prism and the solid-state imaging device is manually removed.

 Therefore, conventionally, workability is extremely poor and productivity is low.

In view of the problem, the present invention does not require a glass epoxy substrate for connecting the solid-state image pickup device and the drive circuit for the solid-state image pickup device, and does not use an instantaneous adhesive or the like for fixing the solid-state image pickup device. An object of the present invention is to provide a mounting position adjusting device that can be automated with a structure capable of preventing displacement and damage, and that has extremely good workability and high productivity.

Means for Solving the Problems A mounting position adjusting device for adjusting a mounting position of a solid-state imaging device in a state where a solid-state imaging device is held by a holding portion and a light receiving surface of the solid-state imaging device is opposed to an optical member. Thus, the holding portion is formed with a groove for guiding the electrode terminal of the solid-state imaging device, and the electrode terminal guided by the groove is pressed by the pressing member and held.

The grooves formed in the holding portion are formed with the same pitch as the electrode terminals, and the bottom surface of the groove is provided with an electrode that electrically connects with the electrode terminals.

The electrode having electrical continuity with the electrode terminal is formed in a portion of the pressing member that presses the electrode terminal.

A nozzle for ejecting or sucking glass is provided to a portion where the solid-state imaging device faces the light receiving surface of the optical member.

Operation With the above means, the electrode terminals of the solid-state imaging device are guided by the grooves provided in the holding part, so that the electrode terminals are set and the holding position of the solid-state imaging device can be easily adjusted and the holding positions are compatible. The workability is improved because the adjustment width can be narrowed when adjusting the position with high accuracy. Since the electrode terminals can be held by pressing the electrode terminals against the groove bottom and holding them, the solid-state imaging device can be held without an adhesive. Further, by pressing the electrode terminal with the pressing member against the electrode for driving the solid-state imaging device provided at the bottom of the groove, the electrode terminal of the solid-state imaging device and the driving electrode can be connected simultaneously with holding. As a result, the solid-state imaging device can be held, at the same time, the solid-state imaging device can be driven, a standard subject image can be captured, the position of each solid-state imaging device can be detected, and extremely high productivity of position adjustment of the solid-state imaging device can be realized.

Embodiments Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a main part of a mounting position adjusting device holding portion for holding the solid-state imaging device 1 and adjusting the mounting position of the solid-state imaging device with the light receiving surface of the solid-state imaging device facing the prism 6. It is a figure.

The electrode terminal 7 of the solid-state imaging device 1 is guided by the groove 2 provided in the holding portion, is regulated by the groove 2, and the mounting position can be easily positioned. Can be narrowed.

Next, the solid-state imaging device 1 is held by pressing the electrode terminals 7 by the pressing member 3 and at the same time, driving the solid-state imaging device built in the attachment position adjusting device body provided at the bottom of the groove 2 of the holding portion. The electrode terminal 7 of the solid-state image pickup device 1 is pressed by the pressing member 3 and is brought into contact with the electrode 4a of the circuit for use (not shown), and the solid-state image pickup device 1 is electrically connected to the drive circuit and driven. It becomes possible.

In this embodiment, the electrode 4a is provided on the bottom of the groove 2, but a film-shaped electrode 4b may be attached to the portion of the pressing member 3 that presses the electrode terminal 7. As a result, the electrode can be easily formed even if the electrode 4b is worn.

As a result, the standard subject image can be captured, the position can be detected, and the workability can be automated with a configuration. Then, a predetermined amount is mechanically moved to the vicinity of the joint surface of the prism 6, a standard subject image is picked up, the position of the standard subject image of the solid-state imaging device 1 is detected, and the position is mechanically adjusted. Then, by imaging the joint surface between the prism 6 and the solid-state image pickup device 1 by the solid-state image pickup device 1, the foreign matter is recognized and, for example, clean air is jetted out by the nozzle 5 provided near the holding portion (suctioned by the nozzle). Alternatively, the foreign matter or the like on the joint surface between the prism 6 and the solid-state imaging device 1 is removed, and then the joint surface between the prism 6 and the solid-state imaging device 1 is fixed with an adhesive or the like. Then, the electrode member 7 is pressed to release the pressing member 3 which is sandwiched and returned to the origin of the opportunity position, whereby the attachment to the prism 6 can be completed.

FIG. 2 is an explanatory diagram of a case where the mounting position of the solid-state image pickup device is adjusted using the apparatus of the embodiment shown in FIG.

The color separation prism 6 is attached to the master lens 14 via the lens mount 13, and the master lens 14
A chart box 15 containing a standard subject image is provided at the tip of the, and the color separation prism 6 is irradiated from the light source 16 through the chart box 15 and the master lens 14 with imaging light for adjusting the mounting position. .

Further, the solid-state image pickup devices 1a, 2b, 3c are respectively attached to position adjusting jigs 17a, 17b, 17c for performing 6-dimensional alignment, and the image pickup light of each color component dispersed by the color separation prism 6 is obtained. Image, that is, a standard subject image is captured.

Each imaging output obtained by each solid-state imaging device 1a, 1b, 1c,
It is supplied to the high resolution monitor 19 and the measuring device 20 via the image signal processing circuit 18. Further, in this mounting position adjusting device, each solid-state image pickup device 1 is displayed on the screen of the high resolution monitor 19.
While confirming the mounting position state of a, 1b, 1c, each of the position adjustment jig 17a, with the solid-state imaging device 1b for green imaging as a reference
The mounting position can be adjusted by operating 17b and 17c.

EFFECTS OF THE INVENTION As described above, according to the present invention, the holding position of the solid-state imaging device can be easily adjusted and interchangeable, and the adjustment width when adjusting the position with high accuracy can be narrowed and the workability is good. . Further, since a holding adhesive is not required, the solid-state image pickup device is held instantly, and there is no displacement or damage. Moreover, since the glass epoxy substrate dedicated to the connection with the drive circuit is not required and the solid-state imaging device can be driven at the same time as holding, the standard subject image can be picked up and the position can be detected. In addition, it is easy to form an electrode with a film-shaped electrode when the electrode is worn. Also, foreign matter on the joint surface can be removed automatically. As a result, the workability can be automated, the quality is stable, the cost can be reduced, and the productivity can be dramatically improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an essential part of an embodiment of an attachment adjusting device of the present invention, FIG. 2 is an explanatory view of the attachment adjustment of an image pickup device using the same embodiment, and FIG. 3 is a conventional example. It is a principal part perspective view of an attachment adjusting device. 1 ... Solid-state imaging device, 2 ... Groove, 3 ... Pressing member, 4 ...
... electrodes, 5 ... nozzles, 6 ... prisms.

Claims (4)

(57) [Claims] 1. A mounting position adjusting device for a solid-state imaging device, wherein a mounting position of a solid-state imaging device is adjusted with a light-receiving surface of the solid-state imaging device facing an optical member while holding the solid-state imaging device in a holding portion. The holding portion is formed with a groove for guiding an electrode terminal of the solid-state imaging device, and the electrode terminal guided by the groove is pressed by a pressing member to be sandwiched. A mounting position adjusting device for a solid-state image pickup device. 2. A mounting position adjusting device for a fixed image pickup device according to claim 1, wherein the grooves formed in the holding portion are formed at the same pitch as the electrode terminals, and the bottom surface of the groove has the above-mentioned structure. A mounting position adjusting device for a solid-state image pickup device, wherein an electrode is formed which is electrically connected to an electrode terminal. 3. An attachment adjusting device for a fixed image pickup device according to claim 1, wherein the electrode electrically connected to the electrode terminal is formed in a portion of the pressing member that presses the electrode terminal. A mounting position adjusting device for a solid-state imaging device, which is characterized by: 4. A mounting position adjusting device for a fixed image pickup device according to claim 1, further comprising a nozzle for ejecting or sucking gas toward a facing portion of the solid-state image pickup device and a light receiving surface of the optical member. A mounting position adjusting device for a solid-state imaging device, which is characterized by being provided.