JPH0494286A - Mount position adjustment device for solid-state image pickup device - Google Patents

Abstract

PURPOSE:To prevent deviation of position of the solid-state image pickup device and its destruction by forming a slot for guiding an electrode terminal of the solid-state, image pickup device to a support, pressing the electrode terminal guided through the slot with a pressing member and inserting the terminal between the slot and the pressing member. CONSTITUTION:An electrode terminal 7 of a solid-state image pickup device 1 is guided with a slot 2 provided to a support, and the mount position is simply decided through the restriction by the slot 2. Then the electrode terminal 7 is pressed by a pressing member 3 to insert the solid-state image pickup device 1 between the slot 2 and the member 3, the electrode terminal 7 of the solid- state image pickup device 1 is pressed by the pressing member 3 and inserted between the member 3 and an electrode 4a of a drive circuit for the solid-state image pickup device 1 built in the position adjustment device main body provided to a bottom of the slot 2 of the support and the terminal 7 is in contact with the electrode 4a, the solid-state image pickup device 1 is connected electrically to the drive circuit so as to be in a state to be driven. Thus, the production of deviation of the position and its destruction is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an attachment position adjustment device for adjusting the attachment position of a solid-state image pickup device used in a solid-state color image pickup device.

2. Description of the Related Art Generally, in a solid-state color imaging device, imaging light is separated into a plurality of color components by a color separation system, and a subject image of each color component is obtained as an image by the solid-state imaging device.

Even though standard color television signals such as NTSC system are formed and output from each image pickup output, in a color image pickup device using a plurality of solid-state image pickup devices, the object of each color component imaged by each solid-state image pickup device is It is necessary to accurately superimpose images, that is, perform registration adjustment.

FIG. 3 is an exploded perspective view of a main part of a conventional mounting position adjusting device holder.

A mounting position adjustment device that adjusts the position of each solid-state imaging device 1 on an optical member 6 such as a prism (i) Connects the solid-state imaging device 1 and the drive circuit to the electrode terminal 7 of each solid-state imaging device that captures a subject image of each color component. A glass epoxy substrate having an opening 8 in the center of the solid-state imaging device 4 is inserted from the back side to make the solid-state imaging device 1 operable.

Next, using the opening 8 of the glass epoxy substrate 9, the mounting member 10 is fixed to the back surface of the solid-state imaging device 1 with an instant adhesive or the like, and then fixed to the position adjustment jig 11 via the mounting member 10 with screws 12. Then, a standard subject is imaged, the position of the solid-state imaging device 1 with respect to the standard subject image is detected, and the position of the solid-state imaging device 1 is mechanically adjusted. After setting the position, check to see if there is any foreign matter adhering to the joint surface of the prism 6 and the solid-state image sensor l. If it is, wipe it off with a cloth containing a solvent and glue the prism 6 and the solid-state image sensor l together. The adhesive portion between the solid-state imaging device 1 and the mounting member 10 is peeled off, the glass epoxy substrate 9 is removed, and the mounting of the solid-state imaging device 1 can be completed.

Problems to be Solved by the Invention Generally, in a color imaging device using a plurality of solid-state imaging devices, it is not possible to electrically adjust the imaging screen position like an image pickup tube. It is necessary to adjust the relative position with extremely high precision, and in particular, in a solid-state color imaging device that uses the so-called spatial picture element shifting method to achieve high resolution, it is necessary to adjust the relative position on the order of 1 μm.

Conventional mounting position adjustment devices require a glass epoxy board with a dedicated opening to connect the solid-state imaging device and the solid-state imaging device drive circuit, and the connection is done manually. uses instant adhesive and mounting materials, and care must be taken with the amount of adhesive when fixing, and there is a risk of misalignment and damage to the solid-state imaging device when separating the solid-state imaging device and mounting material. Due to its nature, skill is required.

In addition, foreign matter on the joint surface between the prism and the solid-state imaging device is manually removed.

Therefore, in the past, workability was extremely poor and productivity was low (°C). Therefore, the present invention has been developed. To provide a mounting position adjustment device that does not use instant adhesive or the like for fixing, has a configuration that can prevent positional displacement and damage, can be automated, and can achieve extremely good workability and high productivity. Means for Solving the Problems: An installation in which the mounting position of the solid-state imaging device is adjusted while the solid-state imaging device is held in a holding part and the light-receiving surface of the solid-state imaging device is opposed to the optical member. In the position adjustment device, a groove in which an electrode terminal of a solid-state imaging device is guided is formed in the holding portion, and the electrode terminal guided in the groove is pressed and held by a pressing member.

The grooves formed in the holding part are formed at the same pitch as the electrode terminals, and an electrode is formed on the bottom surface of the groove to establish electrical continuity with the electrode terminals.

An electrode ζ that establishes electrical continuity with the electrode terminal is formed on the part of the pressing member that presses the electrode terminal.

A nozzle is provided for ejecting or suctioning gas toward the opposing portion of the solid-state imaging device and the light-receiving surface of the optical member.

Effect: By the above means, the electrode terminal force of the solid-state imaging device (the electrode terminal is regulated by being guided by the groove provided in the holding part, and the holding position of the solid-state imaging device can be easily adjusted, and the holding position is compatible. This makes it possible to narrow the range of adjustment when making high-precision position adjustments, resulting in good workability.Also, the electrode terminal can be held by pressing it against the bottom of the groove with a pressing member and clamping it.A solid-state imaging device that does not require adhesive. By pressing the electrode terminal against the solid-state imaging device driving electrode provided at the bottom of the groove with a pressing member, the electrode terminal of the solid-state imaging device and the driving electrode can be connected at the same time as being held.

As a result, it is possible to hold the solid-state imaging device and drive the solid-state imaging device at the same time, capture a standard object image, and detect the position of each solid-state imaging device, making it possible to achieve extremely high productivity in adjusting the position of the solid-state imaging device.

Embodiments Examples of the present invention will be described below with reference to the drawings, but FIG. This is a perspective view of the main part of the mounting position adjustment device holding part that adjusts the mounting position of the device. Easy positioning is possible, and the range of adjustment when performing highly accurate positioning can be narrowed.

Next, the solid-state imaging device 1 is held by pressing and clamping the electrode terminal 7 with the pressing member 3. At the same time, a mounting position adjustment device provided at the bottom of the groove 2 of the holding portion is used for driving the solid-state imaging device built in the main body. The electrode terminal 7 of the solid-state imaging device 1 is pressed and held by the pressing member 3 to contact the electrode 4a of the circuit (not shown), and the solid-state imaging device 1 is electrically connected to the drive circuit and can be driven. becomes.

In this embodiment, the electrode 4a is provided at the bottom of the groove 2, but for example, a film-like electrode 4b may be attached to the portion of the pressing member 3 that presses the electrode terminal 7. As a result, even if the electrode 4b is worn out, it becomes easy to form the electrode.

As a result of the above, a standard object image can be captured, position detection is possible, and automation is possible with a configuration that has good workability.The standard object image is then automatically moved by a preset amount to the vicinity of the joint surface of the prism 6. The image is captured, the position of the solid-state imaging device 1 relative to the standard object image is detected, and the position is adjusted mechanically. Then, by imaging the joint surface of the prism 6 and the solid-state imaging device 1 with the solid-state imaging device 1, the foreign object is recognized and automatically suctioned by a nozzle 5 provided near the holding part that blows out clean air. After removing any foreign matter from the joint surface between the prism 6 and the solid-state imaging device 1, fix the joint surface between the prism 6 and the solid-state imaging device 1 with adhesive or the like.A Then, press and clamp the electrode terminal 7. The mounting on the prism 6 can be completed by releasing the pressing member 3 and returning to the origin of the machine position. Figure 2 shows the mounting position of the solid-state imaging device using the apparatus of the embodiment shown in Figure 1. FIG. 4 is an explanatory diagram when performing adjustment.

The color separation prism 6 is attached to a master lens 14 via a lens mount 13, and a chart box 15 containing a standard object image is provided at the tip of the master lens 14.
Imaging light for adjusting the mounting position is irradiated onto the color separation prism 6 through the master lens 14.

Also, each solid-state imaging device 1a, 2b, 3ci 6
Position adjustment jigs 17a and 17b for dimensional alignment
, 17c, respectively, and the color separation prism 6
An image, that is, a standard subject image, is imaged using the imaging light of each color component separated by the .

Each imaging output obtained from each solid-state imaging device 1a, lb, lc is supplied to a high-resolution monitor 19 and a measuring device 2o via an image signal processing circuit 18. and,
With this mounting position adjustment device (upper), each solid-state imaging device 1a is displayed on the screen of the high-resolution monitor 19.

While checking the state of the mounting positions of lb and lc, the mounting positions can be adjusted by operating the position adjustment jigs 17a, 17b, and 17c with reference to the solid-state imaging device 1b for capturing green images.

As described in detail, the present invention enables simple position adjustment of the holding position of a solid-state imaging device, is compatible, and narrows the adjustment range when performing high-precision position adjustment, resulting in good workability. .

Further, there is no need for a holding adhesive, and the solid-state imaging device can be held instantly without any positional shift or damage. Moreover, since a glass epoxy substrate dedicated to connection with a drive circuit is not required and the solid-state imaging device can be driven at the same time as being held, a standard subject image can be captured and the position can be detected. Furthermore, when the electrode is worn out, it is easy to form the film-like electrode, and foreign matter on the bonding surface can be automatically removed. As a result, it can be automated with a configuration that has good work efficiency, stable quality, reduced costs, and dramatically improved productivity.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the main parts of an embodiment of the mounting adjustment device of the present invention. Fig. 2 is an explanation of the mounting adjustment of an imaging device performed using the same embodiment. Fig. 3 is a main part of the mounting adjustment device of the conventional example. Partial perspective view 41...Solid-state imaging device 2...
3. Pressing part 4... Electrode 5... Nozzle k
6... Name of Prism agent Patent attorney Shigetaka Awano and 1 other person Figure

Claims (4)

[Claims] (1) A mounting position adjustment device for a solid-state imaging device that adjusts the mounting position of the solid-state imaging device while holding the solid-state imaging device in a holding part and making the light-receiving surface of the solid-state imaging device face an optical member. The solid-state image pickup device is characterized in that the holding portion is formed with a groove in which the electrode terminal of the solid-state imaging device is guided, and the electrode terminal guided in the groove is pressed and held by a pressing member. Mounting position adjustment device for imaging device. (2) The mounting position adjustment device for a solid-state imaging device according to claim (1), wherein the grooves formed in the holding portion are formed at the same pitch as the electrode terminals, and the bottom surface of the groove is formed with the electrode terminals. A mounting position adjustment device for a solid-state imaging device, characterized in that an electrode for electrical conduction is formed. (3) In the attachment adjustment device for a solid-state imaging device according to claim (1) or (2), the electrode that establishes electrical continuity with the electrode terminal is formed on a portion of the pressing member that presses the electrode terminal. A mounting position adjustment device for a solid-state imaging device, characterized by: (4) A mounting position adjusting device for a solid-state imaging device according to claim (1), comprising a nozzle for ejecting or suctioning gas to a portion facing the solid-state imaging device and the light-receiving surface of the optical member. A mounting position adjustment device for a solid-state imaging device, characterized in that: