JP2516937Y2 - 内周刃砥石 - Google Patents

内周刃砥石

Info

Publication number
JP2516937Y2
JP2516937Y2 JP1989048038U JP4803889U JP2516937Y2 JP 2516937 Y2 JP2516937 Y2 JP 2516937Y2 JP 1989048038 U JP1989048038 U JP 1989048038U JP 4803889 U JP4803889 U JP 4803889U JP 2516937 Y2 JP2516937 Y2 JP 2516937Y2
Authority
JP
Japan
Prior art keywords
base metal
cutting
inner peripheral
thickness
abrasive grain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989048038U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02139062U (enExample
Inventor
繁 真崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP1989048038U priority Critical patent/JP2516937Y2/ja
Publication of JPH02139062U publication Critical patent/JPH02139062U/ja
Application granted granted Critical
Publication of JP2516937Y2 publication Critical patent/JP2516937Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
JP1989048038U 1989-04-24 1989-04-24 内周刃砥石 Expired - Fee Related JP2516937Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989048038U JP2516937Y2 (ja) 1989-04-24 1989-04-24 内周刃砥石

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989048038U JP2516937Y2 (ja) 1989-04-24 1989-04-24 内周刃砥石

Publications (2)

Publication Number Publication Date
JPH02139062U JPH02139062U (enExample) 1990-11-20
JP2516937Y2 true JP2516937Y2 (ja) 1996-11-13

Family

ID=31564500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989048038U Expired - Fee Related JP2516937Y2 (ja) 1989-04-24 1989-04-24 内周刃砥石

Country Status (1)

Country Link
JP (1) JP2516937Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63172563U (enExample) * 1987-04-28 1988-11-09

Also Published As

Publication number Publication date
JPH02139062U (enExample) 1990-11-20

Similar Documents

Publication Publication Date Title
JP3197253B2 (ja) ウエーハの面取り方法
JP3075510B2 (ja) 基板の研磨方法および装置
JP2005262341A (ja) Ｃｍｐパッドコンディショナー
KR102110919B1 (ko) 양면 연마 장치
JP2516937Y2 (ja) 内周刃砥石
JP3664691B2 (ja) Ｃｍｐ加工用ドレッサ
JP2002346927A (ja) Ｃｍｐコンディショナ
JP2010017779A (ja) ウェーハ加工方法
JP3434801B2 (ja) シリコンウエハ外周部加工用ベベリングホイールの製造方法
JPS6012694Y2 (ja) ダイヤモンドブレ−ド
CN113226639B (zh) 硅晶片的螺旋倒角加工方法
JP2002184730A (ja) 半導体デバイス加工用硬質発泡樹脂溝付パッド及びそのパッド旋削溝加工用工具
JP2554424Y2 (ja) 内周刃砥石
JP2938836B2 (ja) ガラスディスクのチャンファー加工方法
JP2554425Y2 (ja) 内周刃砥石
JP2004042215A (ja) 研磨砥石，切断面鏡面加工装置，切断面鏡面加工方法
JP2000094341A (ja) ダイヤモンドオフセット研削砥石
JPS58165965A (ja) 内周形ダイヤモンド切断砥石
WO2019064837A1 (ja) 電着砥石およびその製造方法
JP4020811B2 (ja) 研磨工具
JP2002331453A (ja) ウェーハの研磨方法及びウェーハの研磨装置
JP2008023677A (ja) 硬脆材料基板用ホイール型回転砥石
JP2008238304A (ja) 切断電着ブレード
JPH08108371A (ja) 内周刃ブレード
JPH08267445A (ja) 内周刃砥石

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees