JP2515883Y2 - 基板予熱装置 - Google Patents
基板予熱装置Info
- Publication number
- JP2515883Y2 JP2515883Y2 JP1990100140U JP10014090U JP2515883Y2 JP 2515883 Y2 JP2515883 Y2 JP 2515883Y2 JP 1990100140 U JP1990100140 U JP 1990100140U JP 10014090 U JP10014090 U JP 10014090U JP 2515883 Y2 JP2515883 Y2 JP 2515883Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- preheating device
- temperature
- hot plate
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 48
- 238000005476 soldering Methods 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 239000008187 granular material Substances 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100140U JP2515883Y2 (ja) | 1990-09-27 | 1990-09-27 | 基板予熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100140U JP2515883Y2 (ja) | 1990-09-27 | 1990-09-27 | 基板予熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0460363U JPH0460363U (enrdf_load_stackoverflow) | 1992-05-25 |
| JP2515883Y2 true JP2515883Y2 (ja) | 1996-10-30 |
Family
ID=31842560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990100140U Expired - Lifetime JP2515883Y2 (ja) | 1990-09-27 | 1990-09-27 | 基板予熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515883Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426476A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Reflow solder dipping device |
-
1990
- 1990-09-27 JP JP1990100140U patent/JP2515883Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0460363U (enrdf_load_stackoverflow) | 1992-05-25 |
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