JP2515342Y2 - ボンディングワイヤ用スプール - Google Patents
ボンディングワイヤ用スプールInfo
- Publication number
- JP2515342Y2 JP2515342Y2 JP1991002283U JP228391U JP2515342Y2 JP 2515342 Y2 JP2515342 Y2 JP 2515342Y2 JP 1991002283 U JP1991002283 U JP 1991002283U JP 228391 U JP228391 U JP 228391U JP 2515342 Y2 JP2515342 Y2 JP 2515342Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- guide tube
- spool
- bonding wire
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004804 winding Methods 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 description 13
- 230000003068 static effect Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991002283U JP2515342Y2 (ja) | 1991-01-28 | 1991-01-28 | ボンディングワイヤ用スプール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991002283U JP2515342Y2 (ja) | 1991-01-28 | 1991-01-28 | ボンディングワイヤ用スプール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0499540U JPH0499540U (cs) | 1992-08-27 |
| JP2515342Y2 true JP2515342Y2 (ja) | 1996-10-30 |
Family
ID=31730290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991002283U Expired - Lifetime JP2515342Y2 (ja) | 1991-01-28 | 1991-01-28 | ボンディングワイヤ用スプール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515342Y2 (cs) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5943537A (ja) * | 1982-09-02 | 1984-03-10 | Mitsubishi Electric Corp | ワイヤボンデイング装置 |
-
1991
- 1991-01-28 JP JP1991002283U patent/JP2515342Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0499540U (cs) | 1992-08-27 |
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