JP2514798Y2 - 半導体チップの吸着装置 - Google Patents

半導体チップの吸着装置

Info

Publication number
JP2514798Y2
JP2514798Y2 JP1989143680U JP14368089U JP2514798Y2 JP 2514798 Y2 JP2514798 Y2 JP 2514798Y2 JP 1989143680 U JP1989143680 U JP 1989143680U JP 14368089 U JP14368089 U JP 14368089U JP 2514798 Y2 JP2514798 Y2 JP 2514798Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
nozzle
outer lead
semiconductor
suction device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989143680U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0381633U (US20100223739A1-20100909-C00005.png
Inventor
渡 秀瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1989143680U priority Critical patent/JP2514798Y2/ja
Publication of JPH0381633U publication Critical patent/JPH0381633U/ja
Application granted granted Critical
Publication of JP2514798Y2 publication Critical patent/JP2514798Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1989143680U 1989-12-13 1989-12-13 半導体チップの吸着装置 Expired - Fee Related JP2514798Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989143680U JP2514798Y2 (ja) 1989-12-13 1989-12-13 半導体チップの吸着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989143680U JP2514798Y2 (ja) 1989-12-13 1989-12-13 半導体チップの吸着装置

Publications (2)

Publication Number Publication Date
JPH0381633U JPH0381633U (US20100223739A1-20100909-C00005.png) 1991-08-21
JP2514798Y2 true JP2514798Y2 (ja) 1996-10-23

Family

ID=31690437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989143680U Expired - Fee Related JP2514798Y2 (ja) 1989-12-13 1989-12-13 半導体チップの吸着装置

Country Status (1)

Country Link
JP (1) JP2514798Y2 (US20100223739A1-20100909-C00005.png)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4541807B2 (ja) * 2004-09-03 2010-09-08 Ｏｋｉセミコンダクタ株式会社 半導体素子保持装置および半導体素子の搬送方法
JP5824641B2 (ja) * 2012-01-20 2015-11-25 パナソニックＩｐマネジメント株式会社 吸着ノズル及び部品実装装置
JP6899314B2 (ja) 2017-11-17 2021-07-07 浜松ホトニクス株式会社 吸着方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4735964U (US20100223739A1-20100909-C00005.png) * 1971-05-17 1972-12-21

Also Published As

Publication number Publication date
JPH0381633U (US20100223739A1-20100909-C00005.png) 1991-08-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees