JP2512775Y2 - Clean room air flow path structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an air flow path structure of a clean room provided as an environmental space for semiconductor manufacturing work, for example, and more specifically, so-called local return air flow control. The present invention relates to a clean room air flow path structure configured to perform.

[Prior Art] Conventionally, as this type of air flow path structure, for example, one as shown in FIG. 3 is known. According to this, for example, a working room LR is provided in a clean room CR as a working environment space for semiconductor manufacturing, and a floor GF of the working room LR is provided.
Various semiconductor manufacturing apparatuses SE are arranged on the above. On the other hand, on the ceiling side of the work room LR, a filter device FU with a blower fan is installed.
Are arranged in parallel, and a space air supply duct HD arranged on the ceiling side of the clean room CR is connected to each filter device FU.

In this case, predetermined gaps CR ₁ and GR ₂ are formed between the upper part of each device SE and the surface of the ceiling CF of the work chamber LR, and between the side face of the device SE and the side wall LW of the work chamber LR. Recirculation spaces RS ₁ and RS ₂ are formed between the side wall CW of the clean room CR and the side wall LW of the work chamber LR, and between the lower end of the side wall LW of the work chamber LR and the floor GF.

Therefore, the airflow sent from the filter device FU into the working chamber LR is directed to the floor GF, and the airflow reaching the surface of the floor GF passes through the spaces between the devices SE and then the air spaces RS ₁ and RS. The airflow is repeatedly circulated by going up ₂ and returning to the above-ceiling space CS which is the upper part of the work chamber LR and heading into the work chamber LR via the filter device FU.

[Problems to be Solved by the Invention] However, in the above-described configuration of the related art, since the clearance CR ₁ is formed between the apparatus SE in the clean room CR and the ceiling CF, the filter apparatus FU moves toward the floor GF. A part of the airflow will flow into the gap GR ₁ . Therefore,
The air flow in the work chamber LR becomes uneven, and a so-called laminar flow state cannot be secured. Such turbulence of the laminar flow hinders the smooth flow of the air flow, thus lowering the circulation efficiency of the air flow, and as a result, particularly lowering the power efficiency of the blower fan of the filter device FU with a blower fan and increasing the operating cost of the entire clean room.

In addition, between the two devices FU, since there is a tendency to form an air retention region, such a portion is likely to become a dust accumulation space, and the accumulated dust is diffused into the working chamber LR by turbulent flow and is contaminated. It becomes a factor of.

The present invention has been made in view of the above circumstances, and provides an air flow path structure capable of ensuring a laminar flow state of an air flow in a clean room by a simple method and avoiding the formation of an air retention region. To aim.

{Means for Solving the Problems} In order to achieve the above-mentioned object, the present invention provides an air flow path structure of a clean room in which air for returning air flow from the ceiling surface side to the floor surface is returned to the ceiling back surface side. At
A leg is provided at the bottom of the device placed on the floor of the clean room, and the top surface of the device is brought into contact with the ceiling surface without providing a space therebetween, while the bottom surface of the device and the floor surface are contacted. , And the space between the side surface of the apparatus and the side wall of the clean room is the air space.

[Operation] The air flow sent from the blower fan side on the ceiling side goes to the floor side along one side surface of the device in the clean room, and passes between the bottom surface of the device lifted by the legs and the floor surface. After that, the space between the other side surface of the device and the side surface of the clean room is raised, and returned to the blower fan side,
There is no unnecessary turbulence of airflow in the clean room, laminar flow is maintained as a whole, and no air retention area is formed.

[Embodiment] FIG. 1 shows an embodiment of the present invention. For example, in a working room 2 divided into a clean room 1 provided as an environmental space for semiconductor manufacturing work, a cross section is taken on a floor 3. A substantially rectangular semiconductor manufacturing apparatus 4 is provided, and the apparatus 4
Has a leg 5 at the bottom corner. The leg 5 forms a gap 6 between the bottom surface of the device 4 and the upper surface of the floor 2, while the side surface of the device 4 is in contact with the side wall 2a of the working chamber 2 and The top surface of the device 4 is in contact with the surface of the ceiling 7 of the working chamber 2. Also, the working room 2
A filter device 8 with a blower fan is provided so as to be located between the both devices 4 on the ceiling side of the clean room 1, and between the side wall 1a of the clean room 1 and the side wall 2a of the work room 2 which opposes the side wall 1a. An air space 9 is formed.

Since the present embodiment is configured as described above, the airflow from the filter device 8 with a blower fan on the ceiling side toward the floor 3,
In particular, the air flow K along the side wall 2a of the work chamber 2 is generated by the semiconductor manufacturing equipment 4
Along the side surface of, that is, only the downward flow toward the floor 3 side is rectified in layers.

Then, the airflow reaching the upper surface of the floor 3 is changed in direction and is attracted to the gap 6 at the bottom of the device 4, and becomes an ascending airflow through the air space 9 between the ceiling 7 and the filter device 8. Returning to the space 10 above the ceiling, the recirculation of the air flow is repeated, which is guided by the filter device 8 with a blower fan and is again sent into the working chamber 2.

In addition, in the above-mentioned embodiment, the side surface of the device 4 is the work chamber 2
Although it is configured to contact the side wall 2a of the above, the effect of the present invention can be obtained even if the side wall 2a is slightly separated. Further, if the device 4 is large, for example, if the width of the side surface is substantially the same as the side wall 2a of the work chamber 2, the device 4 can be replaced with the side wall 2a.

In addition, since the airflow is constantly passing through the lower portions of the devices 3 and 3, that is, the gap 5, an air retention region is not formed.

FIG. 2 shows another embodiment of the present invention, in which a floor 11 having a grating structure is laid above the floor 3 in the above embodiment, and the leg 4 is provided on the floor 11.
Is configured to be installed. Even in this configuration, the same operational effect as that of the above-described embodiment is obtained.

[Advantages of the Invention] As described above, according to the present invention, in the air passage structure of the clean room in which the air space for returning the air current from the ceiling surface side to the floor surface is returned to the ceiling back surface side, in the clean room floor. A leg is provided at the bottom of the device placed on a surface so that the top surface of the device is in contact with the ceiling surface, and between the bottom surface of the device and the floor surface, and the side surface of the device and the side wall of the clean room. Since the space is defined as the air space, there is no cause for disturbing the air flow that flows out between the top surface and the ceiling surface of the device in the clean room, so that the air flow in the clean room is layered as a whole. As a result of the air flow, the circulation efficiency can be significantly increased compared to the conventional configuration, and the blast power can be reduced and the operating cost of the clean room can be reduced.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a side sectional view showing another embodiment of the present invention, and FIG. 3 is a side sectional view showing a constitutional example of a conventional air flow path structure. Is. 1 ... Clean room, 4 ... Semiconductor manufacturing equipment, 5 ... Legs.

Claims (1)

(57) [Scope of utility model registration request] 1. In an air flow path structure of a clean room in which an air space for returning the air current from the ceiling surface side to the floor surface is returned to the ceiling back surface side, at the bottom of a device arranged on the floor surface of the clean room. Between the bottom surface of the device and the floor surface, and between the side surface of the device and the side wall of the clean room, while providing leg portions to bring the top surface of the device and the ceiling surface into contact with each other without providing a space therebetween. The airflow structure of a clean room, characterized in that