JP2510466Y2 - 高密度実装構造 - Google Patents
高密度実装構造Info
- Publication number
- JP2510466Y2 JP2510466Y2 JP1990061585U JP6158590U JP2510466Y2 JP 2510466 Y2 JP2510466 Y2 JP 2510466Y2 JP 1990061585 U JP1990061585 U JP 1990061585U JP 6158590 U JP6158590 U JP 6158590U JP 2510466 Y2 JP2510466 Y2 JP 2510466Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- soldered
- electrode
- pattern
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990061585U JP2510466Y2 (ja) | 1990-06-11 | 1990-06-11 | 高密度実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990061585U JP2510466Y2 (ja) | 1990-06-11 | 1990-06-11 | 高密度実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0420261U JPH0420261U (enrdf_load_html_response) | 1992-02-20 |
| JP2510466Y2 true JP2510466Y2 (ja) | 1996-09-11 |
Family
ID=31589963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990061585U Expired - Fee Related JP2510466Y2 (ja) | 1990-06-11 | 1990-06-11 | 高密度実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510466Y2 (enrdf_load_html_response) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS646063U (enrdf_load_html_response) * | 1987-06-30 | 1989-01-13 |
-
1990
- 1990-06-11 JP JP1990061585U patent/JP2510466Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0420261U (enrdf_load_html_response) | 1992-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |