JP2507302C - - Google Patents
Info
- Publication number
- JP2507302C JP2507302C JP2507302C JP 2507302 C JP2507302 C JP 2507302C JP 2507302 C JP2507302 C JP 2507302C
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- scanning
- scan
- wheel assembly
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 228
- 238000010884 ion-beam technique Methods 0.000 claims description 93
- 239000004065 semiconductor Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 22
- 239000012809 cooling fluid Substances 0.000 claims description 16
- 230000033001 locomotion Effects 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000013536 elastomeric material Substances 0.000 claims 2
- 238000005468 ion implantation Methods 0.000 description 34
- 238000002513 implantation Methods 0.000 description 27
- 238000005516 engineering process Methods 0.000 description 17
- 230000000712 assembly Effects 0.000 description 15
- 238000000429 assembly Methods 0.000 description 15
- 238000001816 cooling Methods 0.000 description 13
- 238000012545 processing Methods 0.000 description 13
- 229920001971 elastomer Polymers 0.000 description 12
- 239000000806 elastomer Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000012530 fluid Substances 0.000 description 8
- 239000007943 implant Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 230000001154 acute effect Effects 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
- 239000013598 vector Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- HAYXDMNJJFVXCI-UHFFFAOYSA-N arsenic(5+) Chemical compound [As+5] HAYXDMNJJFVXCI-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000013626 chemical specie Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 235000015277 pork Nutrition 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 241000238557 Decapoda Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 239000000837 restrainer Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2573779B2 (ja) | 半導体ウェハをイオンインプランテーションする装置 | |
| US4733091A (en) | Systems and methods for ion implantation of semiconductor wafers | |
| US4899059A (en) | Disk scanning apparatus for batch ion implanters | |
| US5389793A (en) | Apparatus and methods for ion implantation | |
| JPH0755464B2 (ja) | 磁気的に結合された２軸型ロボット | |
| US7135691B2 (en) | Reciprocating drive for scanning a workpiece through an ion beam | |
| US4965862A (en) | Disk scanning apparatus for batch ion implanters | |
| KR100254931B1 (ko) | 이온 주입기용 주사 및 경사장치 | |
| JP3142285B2 (ja) | イオン注入装置及び方法 | |
| US7112808B2 (en) | Wafer 2D scan mechanism | |
| US6749764B1 (en) | Plasma processing comprising three rotational motions of an article being processed | |
| JP2507302C (cs) | ||
| TW444237B (en) | Ion implantation apparatus | |
| CN112139680A (zh) | 用于处理基板的装置和方法 | |
| JP2573779C (cs) | ||
| JP4016279B2 (ja) | ウエハの受け台傾斜機構及び冷却システム | |
| KR100340154B1 (ko) | 웨이퍼를 스피닝하기 위한 웨이퍼 척 | |
| EP0342933B1 (en) | Disk scanning apparatus for batch ion implanters | |
| JP2007533078A (ja) | ばねと釣合重りを用いて往復回転運動を行うウエハ走査システム | |
| JPH07138757A (ja) | 基板保持装置 | |
| JPH0663106B2 (ja) | 自公転装置 | |
| CN223140758U (zh) | 离子注入机的晶圆夹持装置及离子注入机 | |
| KR101824561B1 (ko) | 이송장치 | |
| JP2008047525A (ja) | イオン注入中にウエハ温度を一時的に低下させる方法 | |
| JPS63301453A (ja) | イオン打込方法及びその装置 |