JP2505987Y2 - 加速度センサ - Google Patents

加速度センサ

Info

Publication number
JP2505987Y2
JP2505987Y2 JP1989152605U JP15260589U JP2505987Y2 JP 2505987 Y2 JP2505987 Y2 JP 2505987Y2 JP 1989152605 U JP1989152605 U JP 1989152605U JP 15260589 U JP15260589 U JP 15260589U JP 2505987 Y2 JP2505987 Y2 JP 2505987Y2
Authority
JP
Japan
Prior art keywords
axis
detection element
acceleration
package
acceleration sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989152605U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0390447U (enrdf_load_stackoverflow
Inventor
和廣 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacoh Corp
Original Assignee
Wacoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacoh Corp filed Critical Wacoh Corp
Priority to JP1989152605U priority Critical patent/JP2505987Y2/ja
Publication of JPH0390447U publication Critical patent/JPH0390447U/ja
Application granted granted Critical
Publication of JP2505987Y2 publication Critical patent/JP2505987Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Pressure Sensors (AREA)
JP1989152605U 1989-12-28 1989-12-28 加速度センサ Expired - Lifetime JP2505987Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989152605U JP2505987Y2 (ja) 1989-12-28 1989-12-28 加速度センサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989152605U JP2505987Y2 (ja) 1989-12-28 1989-12-28 加速度センサ

Publications (2)

Publication Number Publication Date
JPH0390447U JPH0390447U (enrdf_load_stackoverflow) 1991-09-13
JP2505987Y2 true JP2505987Y2 (ja) 1996-08-07

Family

ID=31698858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989152605U Expired - Lifetime JP2505987Y2 (ja) 1989-12-28 1989-12-28 加速度センサ

Country Status (1)

Country Link
JP (1) JP2505987Y2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7095226B2 (en) * 2003-12-04 2006-08-22 Honeywell International, Inc. Vertical die chip-on-board
JP5118923B2 (ja) * 2007-09-11 2013-01-16 ローム株式会社 半導体装置
JP2009258012A (ja) * 2008-04-18 2009-11-05 Mitsubishi Electric Corp 加速度センサ
US8266959B2 (en) * 2008-11-26 2012-09-18 Fluke Corporation System and method of identifying the orientation of a tri-axial accelerometer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722049U (enrdf_load_stackoverflow) * 1980-07-11 1982-02-04
JPS61156839A (ja) * 1984-12-28 1986-07-16 Mitsubishi Electric Corp 半導体装置
JPH01107138U (enrdf_load_stackoverflow) * 1988-01-12 1989-07-19
US4862298A (en) * 1988-03-11 1989-08-29 Magnetic Peripherals Inc. Shock load detection device

Also Published As

Publication number Publication date
JPH0390447U (enrdf_load_stackoverflow) 1991-09-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term