JP2504978Y2 - 電子部品の基板 - Google Patents
電子部品の基板Info
- Publication number
- JP2504978Y2 JP2504978Y2 JP1990100642U JP10064290U JP2504978Y2 JP 2504978 Y2 JP2504978 Y2 JP 2504978Y2 JP 1990100642 U JP1990100642 U JP 1990100642U JP 10064290 U JP10064290 U JP 10064290U JP 2504978 Y2 JP2504978 Y2 JP 2504978Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- electrode
- electrode pattern
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 38
- 239000006258 conductive agent Substances 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100642U JP2504978Y2 (ja) | 1990-09-25 | 1990-09-25 | 電子部品の基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100642U JP2504978Y2 (ja) | 1990-09-25 | 1990-09-25 | 電子部品の基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459180U JPH0459180U (cs) | 1992-05-21 |
| JP2504978Y2 true JP2504978Y2 (ja) | 1996-07-24 |
Family
ID=31843435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990100642U Expired - Fee Related JP2504978Y2 (ja) | 1990-09-25 | 1990-09-25 | 電子部品の基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504978Y2 (cs) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6351397A (ja) * | 1986-08-20 | 1988-03-04 | Rikagaku Kenkyusho | ルイスａ型糖脂質及びその製造法 |
| JPH0241189A (ja) * | 1988-08-01 | 1990-02-09 | Kokusai Chiteki Shiyoyuuken Kenkyusho:Kk | 組合わせゲーム器のパイ |
-
1990
- 1990-09-25 JP JP1990100642U patent/JP2504978Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0459180U (cs) | 1992-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |