JP2503838B2 - Electronic device structure - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the basic structure of electronic equipment such as a computer main body, a private branch exchange (PBX), and a main unit of a button telephone system.

[0002]

2. Description of the Related Art As is well known, in computer main bodies, PBXs, main units of button telephones, etc., for example, a mother board on which main functional elements for controlling the entire system and an external station line are mounted, terminal devices, A large number of printed circuit boards equipped with individual function elements for controlling individual button telephones are incorporated into the housing, but conventional electronic devices have a structure as shown in FIG. 5 in order to prevent overheating of internal elements and the like. It is said that.

That is, FIG. 5 is a perspective view of the inside of the main unit of a conventional button telephone device, in which a mother board A on which main functional elements for controlling an external station line are mounted is a pair of support frames fixed to a chassis B. It is arranged in a substantially vertical state with respect to C ₁ and C ₂ . A large number of resin guide rails D extending in a direction perpendicular to the mother board A are fixed to the surface of the chassis B.
A large number of vertically oriented printed circuit boards E are provided side by side so that the air whose temperature has risen is released upward, and the individual functional devices mounted on these printed circuit boards E control individual telephones. In FIG. 5, reference numeral “F” is a connector for electrically coupling the mother board A and each printed circuit board E.

[0004]

By the way, in the recent telephone equipment (telephone system) or the like, the inside of the main device is changed according to the increase in the number of office lines used, the number of button telephones, or the increase in functions. Although there is a tendency that the number of printed circuit boards E incorporated in the main device increases, the occupied area of the main device having the above-described structure increases, and it is becoming difficult to secure the installation place of the main device. That is, according to the structure of the main device as described above, the area of the mother board A also increases due to the increase in the printed circuit board E, and the size of the main device in the horizontal direction increases, so that the ratio of the small office area increases. , It is difficult to secure a place where the main device can be installed.

Due to the increase in the number of the printed circuit boards E, the amount of heat generated inside the main device becomes very large, and the elements mounted on the printed circuit boards E can be obtained only by natural ventilation from the bottom to the top parallel to the respective printed circuit boards E. It becomes difficult to cool things, and installation of a forced fan motor is considered, and an extra internal space is provided for air cooling. However, the installation of such a forced fan motor is not preferable in view of the characteristics of the main device that requires power consumption and quietness, and by securing an extra internal space, the main device becomes larger and the occupied area increases. , The commercialability of the telephone system will be hindered.
In view of the conventional electronic device installation problems as described above, an object of the present invention is to mount on a printed circuit board without increasing the occupied area even if the number of printed circuit boards incorporated therein increases. We propose an electronic device structure that can effectively cool the above-mentioned elements.

[0006]

In order to achieve this object, according to the present invention, a mother board extending in a substantially vertical direction is arranged inside a rear surface of an electronic equipment casing and electrically connected to the mother board. A large number of substantially horizontal printed circuit boards are installed side by side inside the electronic device housing, and a power supply housing that discharges heated air from the communication opening on one side is provided below the lowest printed circuit board. At the same time, a wiring casing for discharging the internally heated air to the outside is provided on the uppermost printed circuit board, and an air suction hole for introducing the external air into the electronic device housing from one side of the printed circuit board is provided on the housing side portion. The power supply housing communicates with the wiring housing, and the air heated in the power supply housing rises and the negative pressure generated by the rising airflow draws external air from the air suction hole. Wiring It proposes a provision to an electronic device case side portion of the vertical heat radiation duct transfected serves to connect the upper portion of the communication port.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the embodiments of the present invention will be described below with reference to FIGS. The illustrated embodiment is an embodiment in which the present invention is applied to a main device of a button telephone device. As shown in FIG. 1 in which a front side plate is removed, the main device is a power transformer and a power generator that generate heat. A power supply unit housing 1 that accommodates transistors and the like is provided.

A pair of vertical support frames 2L, which oppose each other in the left-right direction, are provided on the upper portion of the power supply unit casing 1.
2R is fixed, and a wiring housing 3 for accommodating external connections and internal wirings is arranged above these support frames 2L, 2R. The mother board 4 shown in FIG. 3 is fixed between the rear side portions of the support frames 2L and 2R with a fixing screw (not shown) or the like in a vertical state. The support frame 2
Large-area ventilation windows 2a are formed on the surfaces of L and 2R, and the air circulation state inside the main device is maintained through these ventilation windows 2a. Of course, the motherboard 4 is equipped with main functional elements that control the entire system and the external line.

Further, as shown in FIG. 2, a plurality of pairs of substrate holders 5L, 5R facing each other in the left-right direction are vertically aligned on each of the facing surfaces of the supporting frames 2L, 2R with a mounting screw 6. Fixed. As shown in FIG. 4, the resin-molded substrate holders 5L and 5R have a plurality of horizontal guide grooves 5a for receiving the left and right end portions of the printed circuit board 7 electrically connected to the mother board 4 and facing each other. Therefore, when the left and right ends of the printed circuit board 7 are received in these guide grooves 5a, the printed circuit boards 7 extending in the horizontal direction are aligned in the vertical direction. A plurality of open windows 5b are formed on the surfaces of these substrate holders 5L and 5R to improve the flowability of internal air.
The ventilation state in the horizontal direction inside the main unit is improved through the open window 5b and the ventilation window 2a.

As shown in FIG. 2, the left and right side surfaces of the main unit are
The left and right side plates 8L and 8R forming a part of the casing between the power supply unit housing 1 and the wiring housing 3 are covered with a heated interior between the right side plate 8R and the right support frame 2R. A heat dissipation duct 9 that guides air upward is formed. The power supply unit housing 1 is mounted on the top plate 1a of the power supply unit housing 1 and the bottom plate 3a of the power supply unit housing 1 facing the heat dissipation duct 9 which also serves as a wiring duct between the printed circuit board 7 and the mother board 4. A communication port 1b through which the air heated in the heat radiation duct 9 can flow out and a connection port 3b through which the air in the heat radiation duct 9 flows into the wiring housing 3 are formed.

An air inlet 1c for taking in low-temperature external air into the power source housing 1 is provided on a side surface of the power source housing 1, and an air outlet is provided at an upper portion of the wiring housing 3. 3c
Are formed respectively, and the air lightened by the heating inside the power source housing 1 is guided to the heat dissipation duct 9, and the heated air flowing out from the connection port 3b at the upper part of the heat dissipation duct 9 is discharged from the air outlet 3c. It is released to the outside.

On the other hand, as shown in FIG. 1, the left side plate 8L has a large number of air suction holes 1 for taking in external air into the main unit.
No. 0, and the right side plate 8R is formed with a side surface inlet 11 through which external air flows upward into the heat dissipation duct 9 having a low pressure.

As shown in FIG. 3, on the surface of the motherboard 4, a large number of connector sockets 12 arranged in the vertical direction corresponding to the vertical arrangement pitch of the guide grooves 5a are fixed. Connector socket 1
The connector plug 1 which can be engaged with the corresponding connector socket 12 at the rear end portion of each printed circuit board 7 corresponding to 2.
3 are fixed respectively. As shown in FIG. 4, stoppers 5c for preventing careless removal of the printed circuit board 7 are integrally formed at the front end portions of the guide grooves 5a of the respective substrate holders 5L and 5R. Elasticized locking claws 14 are fixed to the left and right of the front end of the printed circuit board 7. That is, as shown in FIG. 4, each lock claw 14 cantileveredly supported by each printed circuit board 7 is provided with a protrusion 14a that can be engaged with the corresponding stopper 5c and a handle portion 14b that can be gripped by a fingertip.

In order to stabilize the voltage of each printed circuit board 7, the contact 15 is provided in the guide groove 5a of the left substrate holder 5L.
Are arranged, and the contact between these contacts 15 and the ground metal fitting 16 of the printed circuit board 7 allows electrical conduction to the ground conductor.

Since the illustrated embodiment has the above-mentioned structure, a structure having a high commercial property in which the installation area (occupied area) does not change even if the number of external office lines or the number of terminal button telephones increases Obtainable. That is, even if the number of station lines and the number of terminal buttons and telephones increase, in the illustrated example, the number of the printed circuit boards 7 aligned in the vertical direction and the vertical area of the mother board 4 only increase, so the occupied area is small. ,
Even in a small office, it is possible to obtain a main device that can be installed under a desk or the like.

The main device of the illustrated embodiment is also very advantageous in terms of handling during failure or maintenance. In other words, to remove the desired printed circuit board 7 from the motherboard 4,
When the handle 14b of the lock claw 14 is pushed down and the printed circuit board 7 is pulled to the front, the protrusion 14a of the lock claw 14 is disengaged from the stopper 5c of the substrate holders 5L, 5R. Then, the desired printed circuit board 7 can be removed. To connect the printed board 7 to the mother board 4, the left and right ends of the printed board 7 are inserted into the guide grooves 5a of the board holders 5L and 5R,
By simply pushing the printed circuit board 7 in the direction of the mother board 4, the connector socket 12 of the mother board 4 is engaged with the connector plug 13 of the printed circuit board 7, and the stopper 5
The lock claw 14 of the printed circuit board 7 is engaged with c so that the printed circuit board 7 does not come out carelessly.

As can be seen from FIG. 2, the inside of the main unit is in an air passage state partitioned by a large number of vertically adjacent printed circuit boards 7, and the air in the power supply unit casing 1 heated by internal heat generation. Becomes lighter due to the decrease in density, flows into the heat dissipation duct 9 through the communication port 1b, rises in the heat dissipation duct 9 and flows into the wiring casing 3 from the connection port 3b. Out of the air outlet 3c.

In this case, due to the pressure drop in the heat radiation duct 9, low-temperature external air is sucked into the heat radiation duct 9 through the inlets of the left side plates 8L, 8R and the side surface inlets 11 of the right side plates 8L, 8R. Therefore, an air flow from the inlet toward the heat dissipation duct 9 is generated between the printed circuit boards 7,
The air around the printed circuit board 7 whose temperature has risen due to the heat generated by the mounted elements is always discharged to the outside by the same air flow. As a result, the temperature of the printed circuit board 7 incorporated in the main device does not rise, so that the internal space can be always cooled without special forced exhaust by a fan motor or the like.

In the structure of the illustrated embodiment, the extra length of the external wiring and the wiring between the printed circuit boards 7 are connected to each other through the heat radiation duct 9.
Since it is only necessary to process the wiring inside, it is possible to obtain a compact structure in which the wiring processing work is simple.

Although the present invention is applied to the main unit of the button telephone in the above embodiment, the present invention is not limited to this example and can be applied to other electronic devices. It goes without saying.

[0021]

As is apparent from the above description, according to the present invention, not only is the power source unit casing, which generates a large amount of heat, and the printed circuit board thermally isolated, but also inside the power source unit casing. When the temperature-increased air is discharged to the outside through the heat dissipation duct, low temperature outside air is sucked into the vicinity of the printed circuit board by suction from the heat dissipation duct. You will be drunk. Therefore, according to the present invention, for cooling the printed circuit board,
There is no need to install a special fan motor, quiet operation is possible, and electronic equipment with low manufacturing cost can be obtained. Further, in the electronic device of the present invention, a large number of printed circuit boards oriented in the substantially horizontal direction are arranged in the vertical direction. Therefore, even if the number of printed circuit boards is increased, the installation area is not increased. You can

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a main unit of a key telephone device according to the present invention, showing a front plate removed.

FIG. 2 is a vertical sectional view of the main device.

FIG. 3 is an enlarged exploded perspective view of a main part around a motherboard used in the main device.

FIG. 4 is a perspective view of a substrate holder used in the main device.

FIG. 5 is a schematic perspective view of a conventional electronic device.

[Explanation of symbols]

 1 Power Supply Case 3 Wiring Case 4 Motherboard 7 Printed Circuit Board 9 Heat Dissipation Duct 10 Air Suction Hole

Claims (1)

(57) [Claims] 1. A mother board extending in a substantially vertical direction is arranged inside a rear surface of an electronic equipment casing, and a large number of substantially horizontal printed boards electrically connected to the mother board are vertically arranged inside the electronic equipment casing. It is installed side by side in a state of being divided into two parts, and a power supply unit housing that discharges heated air from the communication opening on one side is provided at the bottom of the lowest printed circuit board, and internal heated air is provided at the top of the highest printed circuit board. A wiring casing for discharging to the outside is provided, and an air suction hole for introducing external air into the electronic device casing from one side of the printed circuit board is formed in the casing side portion, and the power supply unit casing is connected to the wiring casing. A vertical heat radiation duct that also serves as a wiring duct for taking in external air from the air suction hole by negative pressure generated by the rising air and the heated air in the power supply unit Upper part An electronic device structure, characterized in that the electronic device structure is provided on a side part of an electronic device housing connected to the.