JP2503649Y2 - Flexible printed wiring board electronic component connection device - Google Patents

Description

[Detailed description of the device] [Industrial applications]

The present invention relates to an electronic component connecting device for a flexible printed wiring board, and more particularly to an electronic component connecting device for a flexible printed wiring board, which allows an electronic component having lead terminals to be reliably and easily mounted on the flexible printed wiring board. It is about.

[Prior art]

Conventionally, an electrode for connecting an electronic component is arranged on a circuit pattern of a flexible printed wiring board, a lead terminal of the electronic component is placed on the electrode, a heat-sensitive adhesive film is attached from the upper surface, and heat and pressure are applied. It is known that a lead terminal of the electronic component is connected to the electrode.

[Problems to be solved by the device]

The sensitive temperature of the heat-sensitive adhesive film used for connecting the conventional lead terminals is unknown, and is unstable when the lead terminals are placed on the electrodes. Therefore, a technical problem to be solved in order to specify the sensitive temperature of the heat-sensitive adhesive film so that the periphery of the electrode is not deformed by heat and the lead terminal can be stably mounted on the electrode. The present invention aims to solve the problems.

[Means for Solving the Problems]

This invention was proposed in order to achieve the above-mentioned object, and an electrode for connecting an electronic component is arranged on a circuit pattern of a flexible printed wiring board, and a lead terminal of the electronic component is placed on the electrode. In an electronic component connecting device comprising a heat-sensitive adhesive film adhered to the lead terminals to be temporarily fixed, and the heat-sensitive adhesive film being heated to connect the lead terminals of the electronic component to electrodes. The reaction temperature of the heat-sensitive adhesive film is lower than the melting temperature of the solder, and is formed within the heat resistant temperature range of the flexible printed wiring board, and at the electrode portion provided on the flexible printed wiring board. After opening the insertion hole, bending the tip of the lead terminal of the electronic component into the insertion hole and inserting the bent portion, the heat-sensitive adhesive film is attached from the upper surface of the lead terminal of the electronic component. Stick on the electrode There is provided St. electronic component connecting apparatus heated fixed flexible printed wiring board.

[Action]

The tip portion of the lead terminal of the electronic component is bent and the bent portion is inserted into the insertion hole provided in the electrode of the circuit pattern of the flexible printed wiring board, and the lead terminal is placed on the electrode. In that case, since the lead terminal is stably placed on the electrode, the lead terminal is temporarily fixed to the electrode when the heat-sensitive adhesive film is attached from the upper surface. And
When the heat-sensitive adhesive film is heated, the heat-sensitive adhesive film is firmly adhered to the flexible printed wiring board, and is contracted to press the lead terminals into contact with the electrodes to connect the electronic components to the flexible printed wiring board. . At this time, since the reaction temperature of the heat-sensitive adhesive film is lower than the melting temperature of the solder and is formed within the heat-resistant temperature range of the flexible printed wiring board, the heat-sensitive adhesive film is heated. When the lead terminals are adhesively fixed to the electrodes, the heat does not deform the periphery of the electrodes.

【Example】

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. For the sake of explanation, conventionally well-known components will be described at the same time. In FIG. 1, 1 is a flexible printed wiring board (hereinafter referred to as FPB), 2 is a base film, and 3 is a circuit pattern formed by a method such as etching. Electrodes 4, 4 ... For mounting electronic components or for circuit connection are formed at predetermined positions of the circuit pattern 3, and a portion other than the electrodes 4, 4 ... Is covered with a cover film 5 on its upper surface. In the figure, an IC 6 is mounted on the substantially central portion of the FPB 1, and a cylindrical capacitor 7 is connected to the right side edge portion. In the capacitor 7, the lead terminals 8 and 8 are placed on the electrodes 4 and 4, and the electrodes are formed by a heat-sensitive adhesive film 9 attached to the upper surface thereof.
It is closely connected to 4, 4 and electrically connected. To make this connection, as shown in FIG. 2, the lead terminals 8, 8 of the electronic component 10 such as a capacitor are placed on the electrodes 4, 4 of the FPB 1, and the heat-sensitive adhesive film 9 cut to a predetermined size is cut by the FP.
The lead terminals 8,8 are adhered to the upper surface of B1 to adhere the lead terminals 8,8 to the electrodes 4,4.At this time, the bent portions 8a, 8a at the tip of the lead terminals 8,8 are connected to the electrodes 4,8. Insertion hole opened at one end of 4
The lead terminals 8 and 8 are placed on the electrodes 4 and 4, respectively. Therefore, the lead terminals 8 and 8 are correctly placed on the electrodes 4 and 4 and are stable. Then, when the heat-sensitive adhesive film 9 is heated to a predetermined temperature, the film 9 shrinks and solidifies, and firmly adheres to the FPB1. At this time, FP
The electronic parts 10 are fixed by pressing the lead terminals 8 and 8 sandwiched between them and the electrodes B1 to the electrodes 4 and 4. Moreover, since the reaction temperature of the heat-sensitive adhesive film 9 is lower than the melting temperature of the solder and is within the heat resistant temperature range of the base film 2, there is no possibility of deforming the periphery of the electrodes 4, 4.

[Effect of device]

This invention, as described in detail in the above-mentioned one embodiment, when connecting an electronic component to a flexible printed wiring board, opens an insertion hole at one end portion of an electrode provided in a circuit pattern of the flexible printed wiring board, Then, the tip portion of the lead terminal of the electronic component is bent into the insertion hole, and the bent portion is inserted, and
Since the lead terminal is placed on the electrode, the lead terminal is properly placed on the electrode. Then, since the heat-sensitive adhesive film is attached from the upper surface, the lead terminal is temporarily fixed on the electrode in a correct posture. Therefore, by heating the heat-sensitive adhesive film to a predetermined temperature, the heat-sensitive adhesive film shrinks and solidifies,
The lead terminal is firmly adhered to the electrode. Moreover, since the reaction temperature of the heat-sensitive adhesive film is lower than the melting temperature of the solder and is formed within the heat-resistant temperature range of the flexible printed wiring board, the heat-sensitive adhesive film is heated at the time of heating. Thus, the lead terminal and the electrode are properly joined without deforming the periphery of the electrode. Thus, according to the present invention, it is easy to attach and heat the heat-sensitive adhesive film, and the reduction in the number of steps improves quality and yield as well as productivity,
It contributes to cost reduction.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, FIG. 1 is a plan view of a flexible printed wiring board to which electronic parts are connected, and FIG. 2 is a partial vertical cross-sectional view showing a main part. 1 ...... Flexible printed wiring board 3 ...... Circuit pattern 4 ...... Electrode 8 ...... Lead terminal 8a ...... Bent portion 9 ...... Heat sensitive adhesive film 10 ...... Electronic component 11 ...... Insertion hole

Claims (1)

(57) [Scope of utility model registration request] 1. An electrode for connecting an electronic component is arranged on a circuit pattern of a flexible printed wiring board, a lead terminal of the electronic component is placed on the electrode, and a thermosensitive adhesive film is attached to the lead terminal. In the electronic component connecting device, in which the heat sensitive adhesive film is temporarily fixed and the lead terminals of the electronic component are connected to the electrodes, the reaction temperature of the heat sensitive adhesive film is The temperature of the flexible printed wiring board is lower than that of the flexible printed wiring board, and an insertion hole is formed in the electrode portion provided on the flexible printed wiring board. After bending the tip of the lead terminal and inserting the bent portion, the heat-sensitive adhesive film is attached to the electrode from the upper surface of the lead terminal of the electronic component and fixed by heating. Flexible printing layout Electronic components connecting device of the plate.