JP2503360Y2 - 樹脂封止型半導体集積回路装置 - Google Patents
樹脂封止型半導体集積回路装置Info
- Publication number
- JP2503360Y2 JP2503360Y2 JP1989078063U JP7806389U JP2503360Y2 JP 2503360 Y2 JP2503360 Y2 JP 2503360Y2 JP 1989078063 U JP1989078063 U JP 1989078063U JP 7806389 U JP7806389 U JP 7806389U JP 2503360 Y2 JP2503360 Y2 JP 2503360Y2
- Authority
- JP
- Japan
- Prior art keywords
- area
- resin
- package
- small area
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989078063U JP2503360Y2 (ja) | 1989-06-30 | 1989-06-30 | 樹脂封止型半導体集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989078063U JP2503360Y2 (ja) | 1989-06-30 | 1989-06-30 | 樹脂封止型半導体集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0317644U JPH0317644U (US06650917-20031118-M00005.png) | 1991-02-21 |
JP2503360Y2 true JP2503360Y2 (ja) | 1996-06-26 |
Family
ID=31621009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989078063U Expired - Lifetime JP2503360Y2 (ja) | 1989-06-30 | 1989-06-30 | 樹脂封止型半導体集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2503360Y2 (US06650917-20031118-M00005.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04140717A (ja) * | 1990-10-01 | 1992-05-14 | Semiconductor Energy Lab Co Ltd | 液晶装置 |
US8440509B2 (en) | 1997-11-27 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing a semiconductor device by etch back process |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5458476B2 (ja) * | 2007-05-23 | 2014-04-02 | 株式会社デンソー | モールドパッケージおよびその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189659A (ja) * | 1983-04-13 | 1984-10-27 | Matsushita Electronics Corp | 半導体装置 |
JPS6045447U (ja) * | 1983-09-07 | 1985-03-30 | 日本電気株式会社 | 半導体装置 |
-
1989
- 1989-06-30 JP JP1989078063U patent/JP2503360Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04140717A (ja) * | 1990-10-01 | 1992-05-14 | Semiconductor Energy Lab Co Ltd | 液晶装置 |
US8440509B2 (en) | 1997-11-27 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing a semiconductor device by etch back process |
Also Published As
Publication number | Publication date |
---|---|
JPH0317644U (US06650917-20031118-M00005.png) | 1991-02-21 |
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