JP2502995Y2 - ダイボンディング装置における接着剤塗布量確認装置 - Google Patents

ダイボンディング装置における接着剤塗布量確認装置

Info

Publication number
JP2502995Y2
JP2502995Y2 JP1990013050U JP1305090U JP2502995Y2 JP 2502995 Y2 JP2502995 Y2 JP 2502995Y2 JP 1990013050 U JP1990013050 U JP 1990013050U JP 1305090 U JP1305090 U JP 1305090U JP 2502995 Y2 JP2502995 Y2 JP 2502995Y2
Authority
JP
Japan
Prior art keywords
adhesive
substrate
syringe
die bonding
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990013050U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03104800U (enExample
Inventor
茂 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP1990013050U priority Critical patent/JP2502995Y2/ja
Publication of JPH03104800U publication Critical patent/JPH03104800U/ja
Application granted granted Critical
Publication of JP2502995Y2 publication Critical patent/JP2502995Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1990013050U 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置 Expired - Lifetime JP2502995Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990013050U JP2502995Y2 (ja) 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990013050U JP2502995Y2 (ja) 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置

Publications (2)

Publication Number Publication Date
JPH03104800U JPH03104800U (enExample) 1991-10-30
JP2502995Y2 true JP2502995Y2 (ja) 1996-06-26

Family

ID=31516492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990013050U Expired - Lifetime JP2502995Y2 (ja) 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置

Country Status (1)

Country Link
JP (1) JP2502995Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013048130A (ja) * 2011-08-29 2013-03-07 Panasonic Corp 樹脂塗布装置および樹脂塗布方法
JP2013168533A (ja) * 2012-02-16 2013-08-29 Panasonic Corp 樹脂塗布装置および樹脂塗布方法

Also Published As

Publication number Publication date
JPH03104800U (enExample) 1991-10-30

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