JP2501811Y2 - 光半導体装置 - Google Patents
光半導体装置Info
- Publication number
- JP2501811Y2 JP2501811Y2 JP10770289U JP10770289U JP2501811Y2 JP 2501811 Y2 JP2501811 Y2 JP 2501811Y2 JP 10770289 U JP10770289 U JP 10770289U JP 10770289 U JP10770289 U JP 10770289U JP 2501811 Y2 JP2501811 Y2 JP 2501811Y2
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- tubular portion
- substrate
- present
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10770289U JP2501811Y2 (ja) | 1989-09-12 | 1989-09-12 | 光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10770289U JP2501811Y2 (ja) | 1989-09-12 | 1989-09-12 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0345676U JPH0345676U (US06650917-20031118-M00005.png) | 1991-04-26 |
JP2501811Y2 true JP2501811Y2 (ja) | 1996-06-19 |
Family
ID=31656382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10770289U Expired - Fee Related JP2501811Y2 (ja) | 1989-09-12 | 1989-09-12 | 光半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2501811Y2 (US06650917-20031118-M00005.png) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006303384A (ja) * | 2005-04-25 | 2006-11-02 | Shinko Electric Ind Co Ltd | 光半導体素子用ステム及び光半導体装置 |
JP5121421B2 (ja) * | 2007-11-30 | 2013-01-16 | 新光電気工業株式会社 | 光半導体素子用パッケージおよび光半導体装置 |
KR101271134B1 (ko) * | 2011-12-27 | 2013-06-04 | 삼성중공업 주식회사 | 문풀호스 이송장치 및 이를 포함하는 시추선 |
-
1989
- 1989-09-12 JP JP10770289U patent/JP2501811Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0345676U (US06650917-20031118-M00005.png) | 1991-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7420754B2 (en) | Optical module and method for manufacturing the same | |
US4933729A (en) | Photointerrupter | |
US5808325A (en) | Optical transmitter package assembly including lead frame having exposed flange with key | |
US4877756A (en) | Method of packaging a semiconductor laser and photosensitive semiconductor device | |
US5307362A (en) | Mold-type semiconductor laser device | |
JPH10144965A (ja) | 光半導体装置及びその製造方法 | |
EP0592746B1 (en) | Encapsulated light emitting diode and method for encapsulating the same | |
KR100428271B1 (ko) | 집적회로패키지와그제조방법 | |
JP3054576B2 (ja) | 半導体装置 | |
US5223746A (en) | Packaging structure for a solid-state imaging device with selectively aluminium coated leads | |
JP2501811Y2 (ja) | 光半導体装置 | |
KR20030024283A (ko) | 방열 리드프레임과 이를 이용한 광 반도체 소자 및 그제조방법과, 반도체 소자 | |
JPH02209785A (ja) | 光半導体装置 | |
JP3869575B2 (ja) | 半導体レーザ | |
CN1574520A (zh) | 模制半导体激光器 | |
US20090117689A1 (en) | Packaged integrated circuits | |
JP2948382B2 (ja) | パッケージ型半導体レーザ装置 | |
KR20080089041A (ko) | 외부리드 없는 리드프레임을 갖는 led 패키지 및 그제조방법 | |
JP2935925B2 (ja) | モールド型半導体レーザ装置 | |
JP2560137B2 (ja) | 半導体レーザ装置 | |
JP2565160B2 (ja) | 発光装置 | |
JPH07170019A (ja) | 半導体レーザ装置 | |
JPH02303055A (ja) | リードフレーム | |
JPH0620159B2 (ja) | 光半導体装置の製造方法 | |
JPS59119774A (ja) | 光結合半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |