JP2501051Y2 - 半導体製品リ―ド切断整形金型 - Google Patents

半導体製品リ―ド切断整形金型

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Publication number
JP2501051Y2
JP2501051Y2 JP1987201120U JP20112087U JP2501051Y2 JP 2501051 Y2 JP2501051 Y2 JP 2501051Y2 JP 1987201120 U JP1987201120 U JP 1987201120U JP 20112087 U JP20112087 U JP 20112087U JP 2501051 Y2 JP2501051 Y2 JP 2501051Y2
Authority
JP
Japan
Prior art keywords
lead
die
semiconductor product
shaping
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987201120U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01104737U (enExample
Inventor
正博 中武
Original Assignee
鹿児島日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鹿児島日本電気株式会社 filed Critical 鹿児島日本電気株式会社
Priority to JP1987201120U priority Critical patent/JP2501051Y2/ja
Publication of JPH01104737U publication Critical patent/JPH01104737U/ja
Application granted granted Critical
Publication of JP2501051Y2 publication Critical patent/JP2501051Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Wire Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987201120U 1987-12-28 1987-12-28 半導体製品リ―ド切断整形金型 Expired - Lifetime JP2501051Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987201120U JP2501051Y2 (ja) 1987-12-28 1987-12-28 半導体製品リ―ド切断整形金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987201120U JP2501051Y2 (ja) 1987-12-28 1987-12-28 半導体製品リ―ド切断整形金型

Publications (2)

Publication Number Publication Date
JPH01104737U JPH01104737U (enExample) 1989-07-14
JP2501051Y2 true JP2501051Y2 (ja) 1996-06-12

Family

ID=31491497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987201120U Expired - Lifetime JP2501051Y2 (ja) 1987-12-28 1987-12-28 半導体製品リ―ド切断整形金型

Country Status (1)

Country Link
JP (1) JP2501051Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104853536A (zh) * 2015-04-14 2015-08-19 中山市智牛电子有限公司 一种切断电子元件并折弯的装置
CN104853530A (zh) * 2015-04-14 2015-08-19 中山市智牛电子有限公司 一种切断编带电子元件并折弯的方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111790855A (zh) * 2020-07-31 2020-10-20 常州银河世纪微电子股份有限公司 一种内嵌式全包缓冲周转条及模具结构
CN114453533B (zh) * 2022-02-10 2024-04-19 安徽龙磁新能源技术有限公司 一种电感线圈整形切角气动装置
CN116532581B (zh) * 2023-05-16 2023-11-07 江苏晟驰微电子有限公司 一种具有软恢复特性快恢复二极管加工装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278157A (ja) * 1985-06-03 1986-12-09 Toshiba Corp プレス金型リ−ド押え装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104853536A (zh) * 2015-04-14 2015-08-19 中山市智牛电子有限公司 一种切断电子元件并折弯的装置
CN104853530A (zh) * 2015-04-14 2015-08-19 中山市智牛电子有限公司 一种切断编带电子元件并折弯的方法

Also Published As

Publication number Publication date
JPH01104737U (enExample) 1989-07-14

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