JP2025509903A - 磁気材料を含む集積デバイス及び集積受動デバイス - Google Patents

磁気材料を含む集積デバイス及び集積受動デバイス Download PDF

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Publication number
JP2025509903A
JP2025509903A JP2024555980A JP2024555980A JP2025509903A JP 2025509903 A JP2025509903 A JP 2025509903A JP 2024555980 A JP2024555980 A JP 2024555980A JP 2024555980 A JP2024555980 A JP 2024555980A JP 2025509903 A JP2025509903 A JP 2025509903A
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JP
Japan
Prior art keywords
die
interconnect
interconnects
magnetic layer
metallization
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Pending
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JP2024555980A
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English (en)
Japanese (ja)
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JP2025509903A5 (enExample
Inventor
カイ・リウ
ジェ－シュン・ラン
ジョンヘ・キム
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クアルコム，インコーポレイテッド
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Application filed by クアルコム，インコーポレイテッド filed Critical クアルコム，インコーポレイテッド
Publication of JP2025509903A publication Critical patent/JP2025509903A/ja
Publication of JP2025509903A5 publication Critical patent/JP2025509903A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/47—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts comprising two or more dielectric layers having different properties, e.g. different dielectric constants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

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  • Semiconductor Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
JP2024555980A 2022-03-25 2023-03-09 磁気材料を含む集積デバイス及び集積受動デバイス Pending JP2025509903A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/705,041 US12142561B2 (en) 2022-03-25 2022-03-25 Integrated device and integrated passive device comprising magnetic material
US17/705,041 2022-03-25
PCT/US2023/064058 WO2023183722A1 (en) 2022-03-25 2023-03-09 Integrated device and integrated passive device comprising magnetic material

Publications (2)

Publication Number Publication Date
JP2025509903A true JP2025509903A (ja) 2025-04-11
JP2025509903A5 JP2025509903A5 (enExample) 2026-03-03

Family

ID=85979732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555980A Pending JP2025509903A (ja) 2022-03-25 2023-03-09 磁気材料を含む集積デバイス及び集積受動デバイス

Country Status (7)

Country Link
US (1) US12142561B2 (enExample)
EP (1) EP4500593A1 (enExample)
JP (1) JP2025509903A (enExample)
KR (1) KR20240163616A (enExample)
CN (1) CN118805252A (enExample)
TW (1) TW202401725A (enExample)
WO (1) WO2023183722A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240355728A1 (en) * 2023-04-21 2024-10-24 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure
US20250037923A1 (en) * 2023-07-27 2025-01-30 Qualcomm Incorporated Package comprising a substrate with inductors and a magnetic layer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7319599B2 (en) * 2003-10-01 2008-01-15 Matsushita Electric Industrial Co., Ltd. Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor
US8044755B2 (en) 2008-04-09 2011-10-25 National Semiconductor Corporation MEMS power inductor
US20150340422A1 (en) * 2014-05-23 2015-11-26 Texas Instruments Incorporated Method of manufacturing a micro-fabricated wafer level integrated inductor or transformer for high frequency switch mode power supplies
US10354950B2 (en) 2016-02-25 2019-07-16 Ferric Inc. Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
US10064277B2 (en) * 2016-03-29 2018-08-28 Ferric, Inc. Integrated passive devices and assemblies including same
US12424543B2 (en) 2019-11-26 2025-09-23 Intel Corporation Selective interconnects in back-end-of-line metallization stacks of integrated circuitry

Also Published As

Publication number Publication date
KR20240163616A (ko) 2024-11-19
CN118805252A (zh) 2024-10-18
EP4500593A1 (en) 2025-02-05
WO2023183722A1 (en) 2023-09-28
US12142561B2 (en) 2024-11-12
US20230307355A1 (en) 2023-09-28
TW202401725A (zh) 2024-01-01

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