JP2025505300A5 - - Google Patents
Info
- Publication number
- JP2025505300A5 JP2025505300A5 JP2024548629A JP2024548629A JP2025505300A5 JP 2025505300 A5 JP2025505300 A5 JP 2025505300A5 JP 2024548629 A JP2024548629 A JP 2024548629A JP 2024548629 A JP2024548629 A JP 2024548629A JP 2025505300 A5 JP2025505300 A5 JP 2025505300A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- source
- layer deposition
- deposition apparatus
- generator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH000162/2022 | 2022-02-18 | ||
| CH1622022 | 2022-02-18 | ||
| PCT/EP2023/051148 WO2023156117A1 (en) | 2022-02-18 | 2023-01-18 | Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025505300A JP2025505300A (ja) | 2025-02-21 |
| JP2025505300A5 true JP2025505300A5 (https=) | 2026-01-27 |
Family
ID=85036490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024548629A Pending JP2025505300A (ja) | 2022-02-18 | 2023-01-18 | 基板、特にコーティングされるべき表面においてくぼみを含む基板上に層を堆積させる真空層堆積装置および方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12595550B2 (https=) |
| EP (1) | EP4460590A1 (https=) |
| JP (1) | JP2025505300A (https=) |
| KR (1) | KR20240151818A (https=) |
| CN (1) | CN118715336A (https=) |
| TW (1) | TW202342795A (https=) |
| WO (1) | WO2023156117A1 (https=) |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3661761A (en) | 1969-06-02 | 1972-05-09 | Ibm | Rf sputtering apparatus for promoting resputtering of film during deposition |
| US6248219B1 (en) | 1986-06-23 | 2001-06-19 | Unaxis Balzers Aktiengesellschaft | Process and apparatus for sputter etching or sputter coating |
| KR970002340B1 (ko) | 1988-07-15 | 1997-03-03 | 미쓰비시 가세이 가부시끼가이샤 | 자기 기록 매체의 제조방법 |
| DE69032952T2 (de) * | 1989-11-15 | 1999-09-30 | Haruhisa Kinoshita | Trocken-Behandlungsvorrichtung |
| IT1240811B (it) | 1990-03-28 | 1993-12-17 | Selenia Ind Elettroniche | Metodo per la deposizione di strati sottili con assistenza di ioni da plasma rf. |
| JP2543642B2 (ja) * | 1991-01-18 | 1996-10-16 | アプライド マテリアルズ インコーポレイテッド | 高周波交流電気エネルギ―と相対的に低い周波数の交流電気的エネルギ―を有する、工作物を処理するためのシステムおよび方法 |
| US6413382B1 (en) * | 2000-11-03 | 2002-07-02 | Applied Materials, Inc. | Pulsed sputtering with a small rotating magnetron |
| US7378356B2 (en) | 2002-03-16 | 2008-05-27 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US7938931B2 (en) * | 2006-05-24 | 2011-05-10 | Lam Research Corporation | Edge electrodes with variable power |
| EP2102889B1 (en) | 2006-12-12 | 2020-10-07 | Evatec AG | Rf substrate bias with high power impulse magnetron sputtering (hipims) |
| US7858898B2 (en) * | 2007-01-26 | 2010-12-28 | Lam Research Corporation | Bevel etcher with gap control |
| US8475634B2 (en) | 2007-10-26 | 2013-07-02 | OC Oerlikon Balzers AF | Application of HIPIMS to through silicon via metallization in three-dimensional wafer packaging |
| US8438990B2 (en) * | 2008-09-30 | 2013-05-14 | Applied Materials, Inc. | Multi-electrode PECVD source |
| WO2010073207A1 (en) | 2008-12-23 | 2010-07-01 | Oc Oerlikon Balzers Ag | Rf sputtering arrangement |
| WO2017074484A1 (en) | 2015-10-25 | 2017-05-04 | Applied Materials, Inc. | Apparatus for vacuum deposition on a substrate and method for masking the substrate during vacuum deposition |
| US12217949B2 (en) | 2015-12-21 | 2025-02-04 | Ionquest Corp. | Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films |
| US20220068610A1 (en) | 2018-12-21 | 2022-03-03 | Evatec Ag | Vacuum treatment apparatus and method for vacuum plasma treating at least one substrate or for manufacturing a substrate |
| KR20220045895A (ko) * | 2020-10-06 | 2022-04-13 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 플라즈마 처리용 코일 |
-
2023
- 2023-01-18 US US18/838,890 patent/US12595550B2/en active Active
- 2023-01-18 KR KR1020247031071A patent/KR20240151818A/ko active Pending
- 2023-01-18 CN CN202380022362.8A patent/CN118715336A/zh active Pending
- 2023-01-18 WO PCT/EP2023/051148 patent/WO2023156117A1/en not_active Ceased
- 2023-01-18 EP EP23701354.5A patent/EP4460590A1/en active Pending
- 2023-01-18 JP JP2024548629A patent/JP2025505300A/ja active Pending
- 2023-02-15 TW TW112105335A patent/TW202342795A/zh unknown
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