JP2025501976A5 - - Google Patents
Info
- Publication number
- JP2025501976A5 JP2025501976A5 JP2024539809A JP2024539809A JP2025501976A5 JP 2025501976 A5 JP2025501976 A5 JP 2025501976A5 JP 2024539809 A JP2024539809 A JP 2024539809A JP 2024539809 A JP2024539809 A JP 2024539809A JP 2025501976 A5 JP2025501976 A5 JP 2025501976A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- plunger
- slag
- mold compound
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/566,607 | 2021-12-30 | ||
| US17/566,607 US11614482B1 (en) | 2021-12-30 | 2021-12-30 | Method for manufacturing semiconductor device package with isolation |
| PCT/US2022/053337 WO2023129411A1 (en) | 2021-12-30 | 2022-12-19 | Method for manufacturing semiconductor device package with isolation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025501976A JP2025501976A (ja) | 2025-01-24 |
| JP2025501976A5 true JP2025501976A5 (enExample) | 2025-12-22 |
Family
ID=85722586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024539809A Pending JP2025501976A (ja) | 2021-12-30 | 2022-12-19 | 絶縁を有する半導体デバイスパッケージを製造するための方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11614482B1 (enExample) |
| EP (1) | EP4457527B1 (enExample) |
| JP (1) | JP2025501976A (enExample) |
| CN (1) | CN118302681A (enExample) |
| WO (1) | WO2023129411A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102702092B1 (ko) * | 2019-11-26 | 2024-09-04 | 삼성전자주식회사 | 반도체 테스트 장치 및 그 테스트 방법 |
| US11621215B1 (en) * | 2021-11-30 | 2023-04-04 | Texas Instruments Incorporated | Semiconductor device package with isolated semiconductor die and electric field curtailment |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5807763A (en) * | 1997-05-05 | 1998-09-15 | International Business Machines Corporation | Electric field test of integrated circuit component |
| US7847392B1 (en) * | 2008-09-30 | 2010-12-07 | Amkor Technology, Inc. | Semiconductor device including leadframe with increased I/O |
| AT511226B1 (de) * | 2011-03-17 | 2013-03-15 | Rainer Dr Gaggl | Vorrichtung zum hochspannungsprüfen von halbleiterbauelementen |
| US8969985B2 (en) * | 2011-08-30 | 2015-03-03 | Infineon Technologies Ag | Semiconductor chip package and method |
| US9035422B2 (en) * | 2013-09-12 | 2015-05-19 | Texas Instruments Incorporated | Multilayer high voltage isolation barrier in an integrated circuit |
| US11101209B2 (en) * | 2017-09-29 | 2021-08-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Redistribution structures in semiconductor packages and methods of forming same |
| US11201065B2 (en) * | 2019-10-31 | 2021-12-14 | Texas Instruments Incorporated | Testing semiconductor components |
| US20210231729A1 (en) | 2020-01-27 | 2021-07-29 | Texas Instruments Incorporated | High voltage integrated circuit testing interface assembly |
| US11322433B2 (en) * | 2020-04-07 | 2022-05-03 | Texas Instruments Incorporated | Hall sensor packages |
| US11552013B2 (en) * | 2021-03-31 | 2023-01-10 | Texas Instruments Incorporated | Fuses for packaged semiconductor devices |
| US11594474B2 (en) * | 2021-04-30 | 2023-02-28 | Texas Instruments Incorporated | Bondwire protrusions on conductive members |
-
2021
- 2021-12-30 US US17/566,607 patent/US11614482B1/en active Active
-
2022
- 2022-12-19 EP EP22917209.3A patent/EP4457527B1/en active Active
- 2022-12-19 CN CN202280077738.0A patent/CN118302681A/zh active Pending
- 2022-12-19 JP JP2024539809A patent/JP2025501976A/ja active Pending
- 2022-12-19 WO PCT/US2022/053337 patent/WO2023129411A1/en not_active Ceased
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