JP2024540436A5 - - Google Patents

Info

Publication number
JP2024540436A5
JP2024540436A5 JP2024527687A JP2024527687A JP2024540436A5 JP 2024540436 A5 JP2024540436 A5 JP 2024540436A5 JP 2024527687 A JP2024527687 A JP 2024527687A JP 2024527687 A JP2024527687 A JP 2024527687A JP 2024540436 A5 JP2024540436 A5 JP 2024540436A5
Authority
JP
Japan
Prior art keywords
substrate
channel
interconnects
integrated device
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024527687A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024540436A (ja
Filing date
Publication date
Priority claimed from US17/532,754 external-priority patent/US12243855B2/en
Application filed filed Critical
Publication of JP2024540436A publication Critical patent/JP2024540436A/ja
Publication of JP2024540436A5 publication Critical patent/JP2024540436A5/ja
Pending legal-status Critical Current

Links

JP2024527687A 2021-11-22 2022-10-28 はんだ相互接続部間に配置されたチャネル相互接続部を備えるパッケージ Pending JP2024540436A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/532,754 2021-11-22
US17/532,754 US12243855B2 (en) 2021-11-22 2021-11-22 Package comprising channel interconnects located between solder interconnects
PCT/US2022/048192 WO2023091285A1 (en) 2021-11-22 2022-10-28 Package comprising channel interconnects located between solder interconnects

Publications (2)

Publication Number Publication Date
JP2024540436A JP2024540436A (ja) 2024-10-31
JP2024540436A5 true JP2024540436A5 (cg-RX-API-DMAC7.html) 2025-10-14

Family

ID=84487697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024527687A Pending JP2024540436A (ja) 2021-11-22 2022-10-28 はんだ相互接続部間に配置されたチャネル相互接続部を備えるパッケージ

Country Status (7)

Country Link
US (1) US12243855B2 (cg-RX-API-DMAC7.html)
EP (1) EP4437587A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024540436A (cg-RX-API-DMAC7.html)
KR (1) KR20240104099A (cg-RX-API-DMAC7.html)
CN (1) CN118215998A (cg-RX-API-DMAC7.html)
TW (1) TW202324621A (cg-RX-API-DMAC7.html)
WO (1) WO2023091285A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117810101A (zh) * 2023-12-28 2024-04-02 上海易卜半导体有限公司 半导体封装方法、半导体组件及电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7307293B2 (en) * 2002-04-29 2007-12-11 Silicon Pipe, Inc. Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths
JP4520355B2 (ja) 2005-04-19 2010-08-04 パナソニック株式会社 半導体モジュール
JP5352146B2 (ja) * 2008-07-23 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置
US10289796B2 (en) * 2016-12-06 2019-05-14 Synopsys, Inc. Automated place-and-route method for HBM-based IC devices

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