JP2024533115A5 - - Google Patents
Info
- Publication number
- JP2024533115A5 JP2024533115A5 JP2024513728A JP2024513728A JP2024533115A5 JP 2024533115 A5 JP2024533115 A5 JP 2024533115A5 JP 2024513728 A JP2024513728 A JP 2024513728A JP 2024513728 A JP2024513728 A JP 2024513728A JP 2024533115 A5 JP2024533115 A5 JP 2024533115A5
- Authority
- JP
- Japan
- Prior art keywords
- power rail
- thickness
- bpr
- contact
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/474,271 | 2021-09-14 | ||
| US17/474,271 US20230083432A1 (en) | 2021-09-14 | 2021-09-14 | Buried power rail for semiconductors |
| PCT/CN2022/117553 WO2023040722A1 (en) | 2021-09-14 | 2022-09-07 | Buried power rail for semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024533115A JP2024533115A (ja) | 2024-09-12 |
| JP2024533115A5 true JP2024533115A5 (https=) | 2024-11-08 |
Family
ID=85478565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024513728A Pending JP2024533115A (ja) | 2021-09-14 | 2022-09-07 | 半導体用埋設パワー・レール |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230083432A1 (https=) |
| JP (1) | JP2024533115A (https=) |
| CN (1) | CN117941054A (https=) |
| DE (1) | DE112022003738T5 (https=) |
| GB (1) | GB2625643A (https=) |
| WO (1) | WO2023040722A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12588265B2 (en) | 2023-08-10 | 2026-03-24 | International Business Machines Corporation | Semiconductor structure with enhanced placeholder position margin |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1569273A3 (fr) * | 2003-07-30 | 2005-09-14 | St Microelectronics S.A. | Lignes conductrices enterrées dans des zones d'isolement |
| US7517736B2 (en) * | 2006-02-15 | 2009-04-14 | International Business Machines Corporation | Structure and method of chemically formed anchored metallic vias |
| US10170413B2 (en) * | 2016-11-28 | 2019-01-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device having buried metal line and fabrication method of the same |
| US10475692B2 (en) * | 2017-04-07 | 2019-11-12 | Globalfoundries Inc. | Self aligned buried power rail |
| WO2019151024A1 (ja) * | 2018-02-02 | 2019-08-08 | 東京エレクトロン株式会社 | 半導体装置及びその製造方法 |
| CN111699550B (zh) * | 2018-03-19 | 2023-05-09 | 东京毅力科创株式会社 | 三维器件及其形成方法 |
| US10685865B2 (en) * | 2018-07-17 | 2020-06-16 | Varian Semiconductor Equipment Associates, Inc. | Method and device for power rail in a fin type field effect transistor |
| KR102576212B1 (ko) * | 2018-09-21 | 2023-09-07 | 삼성전자주식회사 | 반도체 장치 |
| US10872818B2 (en) * | 2018-10-26 | 2020-12-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Buried power rail and method forming same |
| EP3671825A1 (en) * | 2018-12-20 | 2020-06-24 | IMEC vzw | Method for connecting a buried interconnect rail and a semiconductor fin in an integrated circuit chip |
| US10720391B1 (en) * | 2019-01-04 | 2020-07-21 | Globalfoundries Inc. | Method of forming a buried interconnect and the resulting devices |
| US11101217B2 (en) * | 2019-06-27 | 2021-08-24 | International Business Machines Corporation | Buried power rail for transistor devices |
| EP3840054B1 (en) * | 2019-12-20 | 2023-07-05 | Imec VZW | Self-aligned contacts for walled nanosheet and forksheet field effect transistor devices |
| US20220020665A1 (en) * | 2020-07-14 | 2022-01-20 | Qualcomm Incorporated | Double-side back-end-of-line metallization for pseudo through-silicon via integration |
| CN114512453B (zh) * | 2020-11-17 | 2025-08-05 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
-
2021
- 2021-09-14 US US17/474,271 patent/US20230083432A1/en active Pending
-
2022
- 2022-09-07 WO PCT/CN2022/117553 patent/WO2023040722A1/en not_active Ceased
- 2022-09-07 GB GB2318213.2A patent/GB2625643A/en active Pending
- 2022-09-07 JP JP2024513728A patent/JP2024533115A/ja active Pending
- 2022-09-07 DE DE112022003738.5T patent/DE112022003738T5/de active Pending
- 2022-09-07 CN CN202280061659.0A patent/CN117941054A/zh active Pending
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