JP2024514551A - Ｒｆインピーダンス整合ネットワーク - Google Patents

Ｒｆインピーダンス整合ネットワーク Download PDF

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Publication number
JP2024514551A
JP2024514551A JP2023561031A JP2023561031A JP2024514551A JP 2024514551 A JP2024514551 A JP 2024514551A JP 2023561031 A JP2023561031 A JP 2023561031A JP 2023561031 A JP2023561031 A JP 2023561031A JP 2024514551 A JP2024514551 A JP 2024514551A
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JP
Japan
Prior art keywords
series
evc
input
capacitor
variable capacitance
Prior art date
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Pending
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JP2023561031A
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English (en)
Japanese (ja)
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JP2024514551A5 (https=
Inventor
イムラン・アハマド・ブッタ
Original Assignee
リノ・テクノロジーズ・インコーポレイテッド
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Publication of JP2024514551A publication Critical patent/JP2024514551A/ja
Publication of JP2024514551A5 publication Critical patent/JP2024514551A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H03H7/40—Automatic matching of load impedance to source impedance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2023561031A 2021-04-05 2022-04-05 Ｒｆインピーダンス整合ネットワーク Pending JP2024514551A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163170768P 2021-04-05 2021-04-05
US63/170,768 2021-04-05
PCT/US2022/023395 WO2022216649A1 (en) 2021-04-05 2022-04-05 Rf impedance matching network

Publications (2)

Publication Number Publication Date
JP2024514551A true JP2024514551A (ja) 2024-04-02
JP2024514551A5 JP2024514551A5 (https=) 2025-03-31

Family

ID=81384653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023561031A Pending JP2024514551A (ja) 2021-04-05 2022-04-05 Ｒｆインピーダンス整合ネットワーク

Country Status (5)

Country Link
US (1) US20240194449A1 (https=)
JP (1) JP2024514551A (https=)
KR (1) KR20240032713A (https=)
TW (1) TWI851988B (https=)
WO (1) WO2022216649A1 (https=)

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US10431428B2 (en) * 2014-01-10 2019-10-01 Reno Technologies, Inc. System for providing variable capacitance
WO2024110007A1 (en) * 2022-11-21 2024-05-30 Hitachi Energy Ltd Modular multi-level converter for dc transmission
CN117459023B (zh) * 2023-11-17 2024-07-16 深圳市恒运昌真空技术股份有限公司 阻抗匹配阵列、匹配方法、射频电源及等离子体射频系统
US20250316453A1 (en) * 2024-04-05 2025-10-09 Applied Materials, Inc. Solid state variable capacitors for rf matches
CN118740089A (zh) * 2024-07-09 2024-10-01 深圳捷迅通射频技术有限公司 一种射频匹配器、匹配方法、装置、设备及介质
US20260074693A1 (en) * 2024-09-09 2026-03-12 Applied Materials, Inc. High bandgap switched shunt capacitor architecture

Citations (6)

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JP2010103123A (ja) * 2000-08-17 2010-05-06 Mks Instruments Inc プラズマ・チューナのホット・スイッチング回路
US10269540B1 (en) * 2018-01-25 2019-04-23 Advanced Energy Industries, Inc. Impedance matching system and method of operating the same
JP2019525508A (ja) * 2016-05-24 2019-09-05 エムケーエス インストゥルメンツ，インコーポレイテッド スイッチング可能な粗同調回路網およびバラクタ微同調回路網を含むハイブリッド同調回路網を備えたソリッドステートインピーダンス整合システム
JP2020502753A (ja) * 2016-12-16 2020-01-23 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ プラズマリアクタの寄生成分のシャント取消を提供するシステムおよび方法
JP2020107965A (ja) * 2018-12-26 2020-07-09 株式会社ダイヘン インピーダンス整合装置及びインピーダンス整合方法
JP2020107488A (ja) * 2018-12-27 2020-07-09 株式会社ダイヘン インピーダンス整合装置及びインピーダンス整合方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1891650A4 (en) 2005-03-05 2012-03-28 Innovation Engineering Llc ELECTRONICALLY VARIABLE CAPACITOR ARRAY
JP2012060104A (ja) * 2010-08-11 2012-03-22 Toshiba Corp 電源制御装置、プラズマ処理装置、及びプラズマ処理方法
EP3048741B1 (en) * 2013-10-25 2018-09-12 Huawei Technologies Co., Ltd. Copper wire interface circuit
US9844127B2 (en) 2014-01-10 2017-12-12 Reno Technologies, Inc. High voltage switching circuit
US10679824B2 (en) 2015-06-29 2020-06-09 Reno Technologies, Inc. Capacitance variation
US10431428B2 (en) 2014-01-10 2019-10-01 Reno Technologies, Inc. System for providing variable capacitance
US10340879B2 (en) 2015-02-18 2019-07-02 Reno Technologies, Inc. Switching circuit
US10984986B2 (en) * 2015-06-29 2021-04-20 Reno Technologies, Inc. Impedance matching network and method
US10692699B2 (en) 2015-06-29 2020-06-23 Reno Technologies, Inc. Impedance matching with restricted capacitor switching
US10148231B2 (en) * 2016-06-14 2018-12-04 Analogic Corporation RF power amplifier with dynamic impedance matching through discrete presets and/or a variable power supply
US11521833B2 (en) 2017-07-10 2022-12-06 Reno Technologies, Inc. Combined RF generator and RF solid-state matching network
US12272522B2 (en) * 2017-07-10 2025-04-08 Asm America, Inc. Resonant filter for solid state RF impedance matching network
US12355418B2 (en) * 2021-11-01 2025-07-08 Advanced Energy Industries, Inc. Two stage pin diode driver with energy recovery
US12537483B2 (en) * 2022-11-15 2026-01-27 Nxp Usa, Inc. Amplifier device with low frequency resonance decoupling circuitry

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103123A (ja) * 2000-08-17 2010-05-06 Mks Instruments Inc プラズマ・チューナのホット・スイッチング回路
JP2019525508A (ja) * 2016-05-24 2019-09-05 エムケーエス インストゥルメンツ，インコーポレイテッド スイッチング可能な粗同調回路網およびバラクタ微同調回路網を含むハイブリッド同調回路網を備えたソリッドステートインピーダンス整合システム
JP2020502753A (ja) * 2016-12-16 2020-01-23 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ プラズマリアクタの寄生成分のシャント取消を提供するシステムおよび方法
US10269540B1 (en) * 2018-01-25 2019-04-23 Advanced Energy Industries, Inc. Impedance matching system and method of operating the same
JP2020107965A (ja) * 2018-12-26 2020-07-09 株式会社ダイヘン インピーダンス整合装置及びインピーダンス整合方法
JP2020107488A (ja) * 2018-12-27 2020-07-09 株式会社ダイヘン インピーダンス整合装置及びインピーダンス整合方法

Also Published As

Publication number Publication date
TW202301466A (zh) 2023-01-01
US20240194449A1 (en) 2024-06-13
KR20240032713A (ko) 2024-03-12
WO2022216649A1 (en) 2022-10-13
TWI851988B (zh) 2024-08-11

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