JP2024504652A5 - - Google Patents
Info
- Publication number
- JP2024504652A5 JP2024504652A5 JP2023542970A JP2023542970A JP2024504652A5 JP 2024504652 A5 JP2024504652 A5 JP 2024504652A5 JP 2023542970 A JP2023542970 A JP 2023542970A JP 2023542970 A JP2023542970 A JP 2023542970A JP 2024504652 A5 JP2024504652 A5 JP 2024504652A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser radiation
- focusing zone
- volume
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021100675.9A DE102021100675B4 (de) | 2021-01-14 | 2021-01-14 | Verfahren zum Zerteilen eines transparenten Werkstücks |
| DE102021100675.9 | 2021-01-14 | ||
| PCT/EP2022/050305 WO2022152637A1 (de) | 2021-01-14 | 2022-01-10 | Verfahren zum zerteilen eines transparenten werkstücks |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024504652A JP2024504652A (ja) | 2024-02-01 |
| JP2024504652A5 true JP2024504652A5 (cg-RX-API-DMAC10.html) | 2024-12-17 |
| JP7891316B2 JP7891316B2 (ja) | 2026-07-16 |
Family
ID=80119358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542970A Active JP7891316B2 (ja) | 2021-01-14 | 2022-01-10 | 透明なワークピースを分割する方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20230377970A1 (cg-RX-API-DMAC10.html) |
| EP (1) | EP4277764A1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP7891316B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR20230130097A (cg-RX-API-DMAC10.html) |
| CN (1) | CN117222493A (cg-RX-API-DMAC10.html) |
| CA (1) | CA3204948A1 (cg-RX-API-DMAC10.html) |
| DE (1) | DE102021100675B4 (cg-RX-API-DMAC10.html) |
| WO (1) | WO2022152637A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2036015B1 (en) * | 2023-10-12 | 2025-04-30 | Micronit Holding B V | A method of manufacturing a nozzle assembly, comprising weakening a wafer at at least two focal zones in the depth direction by focusing a laser beam |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101333518B1 (ko) | 2007-04-05 | 2013-11-28 | 참엔지니어링(주) | 레이저 가공 방법 및 절단 방법 및 다층 기판을 가지는 구조체의 분할 방법 |
| DE102007028042B3 (de) | 2007-06-14 | 2008-08-07 | Universität Zu Lübeck | Verfahren zur Laserbearbeitung transparenter Materialien |
| AU2011279374A1 (en) | 2010-07-12 | 2013-02-07 | Filaser Usa Llc | Method of material processing by laser filamentation |
| TW201343296A (zh) | 2012-03-16 | 2013-11-01 | Ipg Microsystems Llc | 使一工件中具有延伸深度虛飾之雷射切割系統及方法 |
| DE102012110971B4 (de) | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| WO2014079478A1 (en) * | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) * | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| US20150034613A1 (en) * | 2013-08-02 | 2015-02-05 | Rofin-Sinar Technologies Inc. | System for performing laser filamentation within transparent materials |
| US9676167B2 (en) * | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9938187B2 (en) | 2014-02-28 | 2018-04-10 | Rofin-Sinar Technologies Llc | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses |
| WO2016010991A1 (en) * | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| LT3206829T (lt) * | 2014-10-13 | 2019-03-12 | Evana Technologies, Uab | Lazerinio apdorojimo būdas perskelti arba perpjauti ruošinį, formuojant "adatos" formos pažeidimus |
| EP3854513B1 (de) | 2014-11-19 | 2024-01-03 | TRUMPF Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
| JP6466369B2 (ja) * | 2016-06-14 | 2019-02-06 | イムラ アメリカ インコーポレイテッド | 超短パルスレーザでの透明材料処理 |
| EP3597353A1 (en) | 2016-09-30 | 2020-01-22 | Corning Incorporated | Apparatuses for laser processing transparent workpieces using non-axisymmetric beam spots |
| DE102017121140A1 (de) * | 2017-09-01 | 2019-03-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Laserbearbeitung eines transparenten Werkstücks |
| US20190119150A1 (en) * | 2017-10-20 | 2019-04-25 | Corning Incorporated | Methods for laser processing transparent workpieces using pulsed laser beam focal lines and chemical etching solutions |
| US20190233321A1 (en) * | 2018-01-26 | 2019-08-01 | Corning Incorporated | Liquid-assisted laser micromachining of transparent dielectrics |
| US20200283325A1 (en) * | 2019-03-05 | 2020-09-10 | Corning Incorporated | Methods for linear laser processing of transparent workpieces using pulsed laser beam focal lines and chemical etching solutions |
| CN113710407B (zh) * | 2019-06-10 | 2024-11-26 | 伊雷克托科学工业股份有限公司 | 镭射加工设备、其操作方法以及使用其加工工件的方法 |
-
2021
- 2021-01-14 DE DE102021100675.9A patent/DE102021100675B4/de active Active
-
2022
- 2022-01-10 WO PCT/EP2022/050305 patent/WO2022152637A1/de not_active Ceased
- 2022-01-10 JP JP2023542970A patent/JP7891316B2/ja active Active
- 2022-01-10 CN CN202280017510.2A patent/CN117222493A/zh active Pending
- 2022-01-10 CA CA3204948A patent/CA3204948A1/en active Pending
- 2022-01-10 KR KR1020237027585A patent/KR20230130097A/ko active Pending
- 2022-01-10 EP EP22701879.3A patent/EP4277764A1/de active Pending
-
2023
- 2023-07-13 US US18/221,501 patent/US20230377970A1/en active Pending
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