JP2024058857A - Component mounting machine and component mounting method - Google Patents

Abstract

A technique capable of improving component mounting efficiency is provided.
[Solution] The component mounter includes a component holding unit that holds a component supplied to a component supply position, a head that holds the component holding unit so that it can be raised and lowered with a first stroke, a head drive mechanism that holds the head so that it can be raised and lowered with a second stroke and moves it horizontally, and a movement path control unit that controls a path along which the head moves. The movement path control unit moves the head along a predetermined path while maintaining the head at the lowest point of the second stroke when an upper end of a mounted component is located below a first lower end on a predetermined path toward a component mounting position, moves the head along the predetermined path when the upper end of the mounted component is located below the second lower end, and moves the head along a detour path when the upper end of the mounted component is located above the second lower end.
[Selected figure] Figure 4

Description

The technology disclosed in this specification relates to a technology for mounting components on a substrate. More specifically, it relates to a technology for determining the movement path of the head of a component mounter.

Patent Document 1 discloses a component mounter that determines the movement path of the head when transporting a component picked up at the bottom end of the nozzle to a mounting position on the circuit board, based on the maximum separation distance, which is the distance between the top surface of the circuit board and the bottom end of the nozzle that has stroked to its highest point relative to the head. If a component has already been mounted on the circuit board, the movement path of the head is determined based on the height of the component previously mounted on the circuit board, the maximum separation distance, and the height of the component to be mounted later (i.e., the component picked up at the bottom end of the nozzle).

International Publication No. 2015-173947

Some component mounters have a head that can be raised and lowered relative to the board. By raising and lowering the head, it is sometimes possible to avoid interference between a component that has been mounted on the circuit board first and a component that will be mounted on the circuit board later. Patent Document 1 takes into consideration the raising and lowering of the nozzle, but does not give any consideration to the raising and lowering of the head. This specification provides technology that can improve the efficiency of component mounting in a component mounter that can raise and lower the head in addition to the nozzle.

The technology disclosed in this specification is embodied by a component mounter that mounts a component at a mounting position on a board. The component mounter may include a component holding unit that holds the component supplied to a component supply position, a head that holds the component holding unit so that it can be raised and lowered with a first stroke, a head drive mechanism that holds the head so that it can be raised and lowered with a second stroke and moves the head horizontally relative to the board, and a movement path control unit that controls the path that the head moves along the board from the component supply position to the mounting position. The movement path control unit may move the head along the predetermined path from the component supply position to the mounting position while maintaining the head at the lowest point of the second stroke when the upper end of the mounted component already mounted on the board is located below a first lower end, which is the lower end of the component held by the component holding unit when the head is at the lowest point of the second stroke and the component holding unit is at the highest point of the first stroke; move the head along the predetermined path while raising the head so that the lower end of the component held by the component holding unit is higher than the upper end of the mounted component when the upper end of the mounted component is located above the second lower end when the upper end of the mounted component is located above the second lower end.

When the upper end of the mounted component is located below the first lower end, the component mounter moves the head along a predetermined path to the mounting position while maintaining the head at the lowest point of the second stroke. Therefore, by maintaining the head at the lowest point of the second stroke, the distance by which the component holder is lowered at the mounting position can be reduced. This can increase the mounting efficiency of the components. Furthermore, when the upper end of the mounted component is located below the second lower end, the component mounter moves the head along a predetermined path to the mounting position while raising the head so that the lower end of the component is higher than the upper end of the mounted component. In this way, when the upper end of the mounted component is located below the second lower end, the component mounter can move the head to the mounting position along the same predetermined path as when the upper end of the mounted component is located below the first lower end. This can increase the mounting efficiency of the components.

The methods of mounting the components disclosed herein are also novel and useful.

FIG. 1 is a diagram showing a schematic configuration of a component mounter according to first and second embodiments. FIG. 1 is a diagram showing a schematic configuration of a component mounter according to first and second embodiments. FIG. 2 is a cross-sectional view taken along line III-III in FIG. 11 is a flowchart showing an example of a movement route control process.

The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

The component mounter disclosed in this specification may further include an imaging unit capable of imaging the bottom and/or side of the component held by the component holding unit at a predetermined imaging position. In this case, the predetermined path may be a path that passes through the imaging position and heads toward the mounting position. With this configuration, it is possible to image the bottom and/or side of the component while increasing the component mounting efficiency.

In the component mounter disclosed in this specification, the detour path may include an external path that passes outside the outline of the board in a plan view. This configuration makes it possible to more reliably prevent interference between components moving along the detour path and mounted components, compared to a configuration in which the head passes above the board.

In the component mounting machine disclosed in this specification, the detour path may be a single-motion path that is made up of a path that moves linearly in the board transport direction in which the board is transported, and a path that moves linearly in a direction perpendicular to the board transport direction. With this configuration, it is easy to determine whether interference will occur between a component moving along the detour path and a mounted component.

(First embodiment)
A component mounter 10 according to an embodiment will be described with reference to the drawings. The component mounter 10 is a device that mounts electronic components 4 on a circuit board 2 having conductor wiring. The component mounter 10 is also called an electronic component mounting device or a chip mounter. Usually, the component mounter 10 is installed together with other board work machines such as a solder printer and a board inspection machine to form a series of mounting lines. In this embodiment, the components 4 include various types of electronic components. Therefore, the components 4 have various sizes (i.e., width, depth, height). Hereinafter, the circuit board 2 will be simply referred to as the board 2, and the electronic components 4 will be simply referred to as the components 4.

The configuration of the component mounter 10 will be described with reference to Figures 1 to 3. The component mounter 10 includes a component feeder 12, a component waste box 13, a feeder holder 14, a head 16, a head drive mechanism 30, a head moving device 18, a board conveyor 20, an imaging unit 40, a control unit 26, a touch panel 24, and a tray unit 50.

The component feeder 12 is removably attached to the feeder holding section 14. The component feeder 12 is a tape-type feeder that supplies a plurality of components 4 stored on a tape. The tape mounted on the component feeder 12 transports the components 4 in the +Y direction. The components 4 transported to the tip of the component feeder 12 on the +Y direction side are picked up by the nozzle 6, which will be described later, and mounted at the mounting position P2. In this way, the component feeder 12 supplies the components 4 to the component supply position P1. The component disposal box 13 is a box for storing components 4 that have developed abnormalities.

As shown in FIG. 3 in particular, the tray unit 50 is a tray-type feeder that supplies a plurality of parts 4 stored on a tray 56. In a modified example, instead of the tray unit 50, a bulk-type feeder that supplies a plurality of parts 4 randomly stored in a container may be used.

The tray unit 50 comprises a pair of pallet movement shuttles 52 extending in the Y direction, and a tray pallet 54. The pair of pallet movement shuttles 52 transport the tray pallet 54 in the +Y direction. A tray 56 is placed on the upper surface of the tray pallet 54. When the tray 56 is transported to the tip of the +Y direction side of the tray unit 50, each of the multiple components 4 placed on the tray 56 is picked up by a nozzle 6, which will be described later, and mounted at the mounting position P2. In this way, the tray unit 50 supplies the components 4 to the component supply position P1.

As shown in FIG. 2 in particular, the head 16 is held by a head drive mechanism 30. The head drive mechanism 30 includes a Y-axis slider 32 and an X-axis slider 34. The Y-axis slider 32 is attached so as to be movable in the Y direction relative to the substrate 2, and is driven by a drive device (not shown) to move in the Y direction relative to the substrate 2. The X-axis slider 34 is attached so as to be movable in the X direction relative to the Y-axis slider 32, and is driven by a drive device (not shown) to move in the X direction relative to the Y-axis slider 32. The head 16 is held by the X-axis slider 34. By driving the X-axis slider 34 and the Y-axis slider 32, the head 16 can move in the X direction and the Y direction (i.e., horizontally relative to the substrate 2).

The head drive mechanism 30 further includes a Z-axis slider 36 that is attached so as to be movable in the Z direction relative to the X-axis slider 34. The Z-axis slider 36 moves in the Z direction relative to the X-axis slider 34 by being driven by a drive device (not shown). When the Z-axis slider 36 moves in the Z direction, the head 16 attached to the Z-axis slider 36 also moves in the Z direction. This causes the head 16 to rise and fall with the second stroke S2.

The head 16 has a nozzle 6 (an example of a component holder) accommodated in the nozzle mounting hole 17. The nozzle 6 moves up and down along the nozzle mounting hole 17 with a first stroke S1. That is, the head 16 holds the nozzle 6 in the nozzle mounting hole 17 so that it can move up and down with the first stroke S1. The nozzle 6 holds the component 4 supplied to the component supply position P1 by suctioning it from above. With the component 4 held by the nozzle 6, the head 16 moves in a horizontal direction relative to the board 2. When the head 16 reaches above the mounting position P2, which is the position on the board 2 where the component 4 is mounted, the nozzle 6 descends along the first stroke S1. As a result, the component 4 approaches the board 2, and the component 4 is mounted at the mounting position P2. In a modified example, the nozzle 6 may be held so that it moves up and down along the outer surface of the head 16 with the first stroke S1.

As shown in FIG. 3 in particular, the board conveyor 20 is a device that loads, positions, and unloads the board 2. As an example, the board conveyor 20 in this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below. As can be seen in FIG. 3, the board conveyor 20 transports the board 2 in the board transport direction D1. This allows components 4 to be mounted on a new board 2.

The control unit 26 is configured using a computer equipped with a CPU and a storage device. The control unit 26 controls the operation of each part of the component mounter 10 based on, for example, a production program transmitted from an external management device (not shown). The control unit 26 controls, for example, the height of the nozzle 6 and the respective positions of the X-axis slider 34, the Y-axis slider 32, and the Z-axis slider 36. The control unit 26 also controls the path along which the head 16 moves from the component supply position P1 toward the mounting position P2 along the board 2, as will be described in detail with reference to FIG. 4.

The imaging unit 40 is disposed between the component feeder 12 and the board conveyor 20 (specifically, the board conveyor 20 of the pair of board conveyors 20 that is installed on the component feeder 12 side). The imaging unit 40 includes a camera and a light source (not shown). The camera of the imaging unit 40 is disposed so that its imaging direction faces upward, and images the nozzle 6 from below in a state in which the component 4 is adsorbed. That is, when the nozzle 6 adsorbs the electronic component 4, the camera images the bottom surface of the electronic component 4 adsorbed to the nozzle 6. For example, a CCD camera is used as the camera of the imaging unit 40. The light source is composed of an LED, and illuminates the bottom surface (imaging surface) of the component 4 adsorbed to the nozzle 6. Image data of the image captured by the imaging unit 40 is stored in the memory (not shown) of the control unit 26. The touch panel 24 is a display device that provides the worker with various information about the component mounter 10, and is also an input device that receives instructions and information from the worker.

With reference to FIG. 2, the positional relationship between the bottom end 4B of the component 4 held by the nozzle 6 and the top end 5T of the mounted component (so-called pre-attached component) 5 already mounted on the board 2 will be described. For example, when the top end 5T of the mounted component 5 is located above the bottom end 4B of the component 4 and the head 16 passes above the mounted component 5, the component 4 will interfere with the mounted component 5. When the nozzle 6 is raised to the highest point in the first stroke S1, the bottom end 4B of the component 4 will rise to the first bottom end B1. When the top end 5T of the mounted component 5 is located below the first bottom end B1, when the nozzle 6 is raised to the highest point, the component 4 will not interfere with the mounted component 5 even if the head 16 passes above the mounted component 5.

Furthermore, if the upper end 5T of the mounted component 5 is located above the first lower end B1, when the nozzle 6 is raised to the highest point in the first stroke S1 and the head 16 is further raised to the highest point in the second stroke S2, the lower end 4B of the component 4 rises to the second lower end B2. If the upper end 5T of the mounted component 5 is located below the second lower end B2, the component 4 does not interfere with the mounted component 5.

The positional relationship between component supply position P1 and mounting position P2 will be described with reference to FIG. 3. As described above, a component 4 located at the tip of the component feeder 12 in the +Y direction is picked up by the nozzle 6 and mounted at mounting position P2. That is, a component supply position P1 is provided for each tape of the component feeder 12. In this embodiment, the mounting path of component 4F placed on the central tape feeder of the three tape feeders included in the component feeder 12 will be mainly described.

For example, the travel distance of the head 16 can be reduced by moving the head 16 the shortest distance along a straight path R10 (an example of a predetermined path) that extends from the component supply position P1 on the component feeder 12 to the mounting position P2. However, a mounted component 5 may be present on the straight path R10. In that case, the head 16 moving along the straight path R10 passes above the mounted component 5. As described with reference to FIG. 2, if the upper end 5T of the mounted component 5 located on the straight path R10 is located above the lower end 4B of the component 4F, the mounted component 5 and the component 4F will interfere with each other when the head 16 moves along the straight path R10.

To avoid interference between the mounted component 5 and component 4F, the head 16 can move along the detour path R20. The detour path R20 includes a first detour path R21, a second detour path R22, and a third detour path R23. In the detour path R20, the head 16 does not pass above the mounted component 5. Therefore, even if the upper end 5T of the mounted component 5 is located above the lower end 4B of component 4F, interference between the mounted component 5 and component 4F can be avoided.

As shown in FIG. 3, the detour path R20 includes external paths (e.g., a first detour path R21 and a second detour path R22) that pass outside the outer edge of the substrate 2 in a plan view. This makes it possible to more reliably prevent interference between component 4F and component 5 moving along the detour path R20 compared to a configuration in which the head 16 passes above the substrate 2.

Furthermore, the first detour path R21 and the third detour path R23 of the detour path R20 are paths that move linearly along the board transport direction D1. The second detour path R22 of the detour path R20 is a path that moves linearly along a direction perpendicular to the board transport direction D1. That is, the detour path R20 is a single-movement path composed of paths that move in the X and Y directions. This allows the mounted component 5 to be detoured with relatively simple control compared to a configuration in which the mounted component 5 is detoured by a path that moves in an oblique direction inclined to the board transport direction D1. In addition, by adopting a path that moves linearly as the detour path, it is easy to check whether interference between the component 4F and the mounted component 5 has been avoided. For example, as shown in FIG. 3, when the mounted component 5 is detoured to mount the component 4F on the board 2, it is necessary to check whether interference between the mounted component 5 and the component 4F has been avoided by the detour path R20. Here, the position (x1, y1) where the mounted component 5 is mounted and the size (d5x (dimension in the X direction), d5y (dimension in the Y direction)) of the mounted component 5 are known. In addition, the mounting position (x2, y2) of the component 4F and the size (d4x (dimension in the X direction), d4y (dimension in the Y direction)) of the component 4F are also known. For the detour route R20 shown in FIG. 3, which moves in the +X direction on the outside of the board 2, then in the +Y direction, and finally in the -X direction, if the following formula y1+d5y/2<y2-d4y/2 is satisfied, it can be determined that the component 4F can be mounted at the mounting position (x2, y2) without interfering with the component 5. Alternatively, it can be determined whether the detour route R20 can avoid interference with the mounted component 5 by whether a mounted component 5 of a predetermined height exists in an area where y2-d4y/2-Δy<y<y2+d4y/2+Δy. In this way, using the mounting positions and dimensions of components 4F and 5, it is easy to determine whether interference between components 4F and 5 will occur on the detour route.

The movement path control process executed by the control unit 26 will be described with reference to FIG. 4. The control unit 26 controls the movement path of the head drive mechanism 30 based on the movement path determined by the movement path control process. Below, the component for which the movement path is determined is referred to as the "target component", the mounting position of the target component is referred to as the "target mounting position", and the straight line path extending from the component supply position P1 to the target mounting position is referred to as the "target straight line path".

First, the control unit 26 receives mounted component information from a management device (not shown) (S10). Here, the mounted component information includes the identification information, mounting position P2, and size (i.e., width, depth, height) of all components mounted on the board 2.

Next, the control unit 26 receives the mounting order from the management device (S12). The mounting order is information that associates component identification information with the mounting order.

The control unit 26 determines the movement path of the target component according to the mounting order received in S12. The control unit 26 judges whether or not there is a mounted component (e.g., mounted component 5) on the target straight path (S20). Specifically, the control unit 26 judges whether or not there is a mounting position for a pre-attached component that has a mounting order earlier than the target component on the target straight path based on the mounting component information received in S10 and the mounting order received in S12. If there is a mounting position for a pre-attached component on the target straight path (YES in S20), the control unit 26 judges that there is a mounted component on the target straight path and proceeds to S22. On the other hand, if there is no mounting position for a pre-attached component on the target straight path (NO in S20), the control unit 26 judges that there is no mounted component on the target straight path and proceeds to S60.

In S60, the control unit 26 selects a target straight path (e.g., straight path R10) as the movement path of the target component. This allows the head 16 to move from the component supply position P1 to the target mounting position in the shortest distance if there is no mounted component on the target straight path.

In S22, the control unit 26 acquires the height of the mounted component that was determined to be on the target straight line path in S20. Specifically, the control unit 26 acquires information regarding the height (e.g., height 5H) of the component that was determined to be a pre-attached component in S20 from the mounted component information received from the management device in S10. This allows the control unit 26 to acquire the height of the top end of the mounted component.

In S30, the control unit 26 determines whether the upper end of the mounted component is lower than the first lower end (e.g., first lower end B1). Specifically, the control unit 26 calculates the first lower end by subtracting the height of the target component (e.g., height 4H) from the height of the lower end of the nozzle 6 that has been raised to the highest point of the first stroke S1. If the upper end of the mounted component is higher than the first lower end B1 (NO in S30), the control unit 26 proceeds to S40. If the upper end of the mounted component is lower than the first lower end B1 (YES in S30), the control unit 26 proceeds to S32.

In S32, the control unit 26 adjusts the height of the nozzle 6. Specifically, the control unit 26 raises the nozzle 6 to the first stroke S1 so that the bottom end of the target component (e.g., bottom end 4B) is positioned higher than the top end of the mounted component. This makes it possible to avoid interference between the target component and the mounted component even if the head 16 moves along the target linear path (S60).

In S40, the control unit 26 determines whether the top end of the mounted component is below the second bottom end B2. If the top end of the mounted component is above the second bottom end B2 (NO in S40), the control unit 26 proceeds to S50. If the top end of the mounted component is below the second bottom end B2 (YES in S40), the control unit 26 proceeds to S42.

In S42, the control unit 26 adjusts the height of the head 16. Specifically, if the nozzle 6 is not at the highest point in the first stroke S1, the control unit 26 first raises the nozzle 6 to the highest point in the first stroke S1. Furthermore, the control unit 26 raises the head 16 in the second stroke S2 so that the bottom end of the target component (e.g., bottom end 4B) is higher than the top end of the mounted component. This makes it possible to avoid interference between the target component and the mounted component even if the head 16 moves along the target linear path (S60).

In S50, the control unit 26 selects a detour route (e.g., detour route R20). This allows the target component to be mounted at the target mounting position while avoiding interference between the target component and the mounted component, even if the top end of the mounted component is above the second bottom end B2. Note that whether or not interference between the target component and the mounted component has been avoided by the detour route can be determined by the method described above.

(Effects of this embodiment)
In the component mounter 10 of this embodiment, when the upper end 5T of the mounted component 5 is located below the first lower end B1 (YES in S30), the head 16 is moved along the linear path R10 without adjusting the height of the head 16 (i.e., while the head 16 is maintained at the lowest point of the second stroke S2). This allows the component mounter 10 to move the head 16 to the mounting position along the linear path R10 in the shortest distance. By maintaining the head 16 at the lowest point of the second stroke S2, the distance by which the nozzle 6 is lowered at the mounting position P2 can be reduced. This allows the component mounting efficiency to be improved. In addition, when the upper end 5T of the mounted component 5 is located below the second lower end B2, the component mounter 10 moves the head 16 along the linear path R10 in a state in which the head 16 is raised so that the lower end 4B of the component 4 is higher than the upper end 5T. This allows the mounter 10 to move the head 16 to the mounting position P2 along the linear path R10 in the shortest distance, thereby reducing the movement distance of the head 16. Furthermore, when the upper end 5T of the mounted component 5 is located below the second lower end B2, the mounter 10 can move the head to the mounting position along the same linear path R10 as when the upper end 5T of the mounted component 5 is located below the first lower end B1. As a result, the component mounting efficiency can be improved.

Second Example
The component mounter 10 of the second embodiment will be described with reference to FIG. 3. In this embodiment, the mounting path of the component 4S located furthest on the +Y direction side and the +X direction side among the multiple components 4 arranged on the tray 56 will be mainly described. As shown by the dashed line in FIG. 3, the component mounter 10 of the second embodiment moves the component 4S, which is sucked at the component supply position P1 on the tray 56, to the imaging position P3 along the imaging preparation path R2, and after capturing an image of the lower surface of the component 4 with the camera of the imaging unit 40, moves it to the mounting position P2. That is, the component mounter 10 of the second embodiment has a different path for moving the head 16 from the component mounter 10 of the first embodiment. The component mounter 10 of the second embodiment selects a path toward the mounting position P2 via the imaging position P3, rather than a straight path extending from the component supply position P1 of the component 4S on the tray 56 to the mounting position P2. However, in other respects, the component mounter 10 of the second embodiment has a similar configuration to the component mounter 10 of the first embodiment.

In the component mounter 10 of this embodiment, a component 4S is supplied from the imaging position P3 to the mounting position P2. The movement distance of the head 16 can be reduced by moving the head 16 the shortest distance along the straight path R12 extending from the imaging position P3 to the mounting position P2. However, if a mounted component 5 is present on the straight path R12, the head 16 moving along the straight path R12 passes above the mounted component 5, creating the possibility of interference between the component 4 and the mounted component 5. The control unit 26 of the second embodiment controls the path along which the head 16 moves from the imaging position P3 toward the mounting position P2.

The control unit 26 of the second embodiment executes the movement path control process of FIG. 4. At this time, the control unit 26 of the second embodiment determines in S20 whether or not there is a mounted component (e.g., mounted component 5) on a straight path (e.g., straight path R12) extending from the imaging position P3 to the mounting position P2. That is, in this embodiment, the straight path extending from the imaging position P3 to the target mounting position corresponds to the "target straight path". Other processes in the movement path control process executed by the control unit 26 of the second embodiment are similar to the movement path control process of the first embodiment. According to the component mounter 10 of this embodiment, it is possible to improve the efficiency of mounting the component 4 whose underside has been imaged. In this embodiment, the imaging preparation path R2 and the straight path R12 are examples of the "predetermined path".

Points to note regarding the component mounter 10 described in the embodiment are described below. In this specification, the first embodiment in which the component 4 is moved from the component supply position P1 to the mounting position P2 and the second embodiment in which the component 4 is moved from the component supply position P1 to the mounting position P2 via the imaging position P3 are described as separate embodiments. However, in a modified example, for example, a path from the component supply position P1 to the mounting position P2 and a path from the component supply position P1 to the mounting position P2 via the imaging position P3 may be assigned to each component to be mounted. In that case, for example, the mounting component information may include information indicating whether or not the component is imaged in association with the identification information of the component. When information indicating the presence of imaging is included, the control unit 26 may execute a movement path control process based on a straight line path R12 moving from the imaging position P3 to the mounting position P2, and when information indicating the presence of imaging is not included, the movement path process may be executed based on a straight line path R10 moving from the component supply position P1 to the mounting position P2. Furthermore, in another modified example, if there is no need to capture an image of the underside of the component 4, the component mounter 10 of the first embodiment does not need to be equipped with the imaging unit 40.

In the above-described embodiment, the imaging unit 40 is positioned so that its imaging direction faces upward. However, in a modified example, the imaging unit 40 may further include a camera that images the side of the component 4 in addition to the camera whose imaging direction faces upward. In that case, the imaging unit 40 may further image the side in addition to the bottom surface of the component 4 at the imaging position P3. Furthermore, in a further modified example, the imaging unit 40 may only image the side of the component 4. In that case, the imaging unit 40 does not need to include a camera whose imaging direction faces upward.

In addition, in the above-described embodiment, the control unit 26 of the component mounter 10 determines the movement path of the head drive mechanism 30 by the movement path processing, but in this modified example, for example, an external management device may execute the movement path processing. In that case, the management device may transmit the component mounting program generated by the movement path processing to the component mounter 10. In that case, the control unit 26 of the component mounter 10 may move the head drive mechanism 30 based on the component mounting program received from the management device.

Furthermore, in the above-described embodiment, the component 4 is picked up by the nozzle 6, but this is not limited to such a configuration, and the component mounter 10 may be provided with, for example, a chuck for gripping the component 4 instead of the nozzle 6.

In addition, in the above-described embodiment, the detour path R20 includes external paths (e.g., the first detour path R21 and the second detour path R22), but the detour path R20 may also be a path on the substrate 2.

Furthermore, in the above-described embodiment, the detour path R20 is a single-motion path composed of a path that moves linearly along the board transport direction D1 and a path that moves linearly along a direction perpendicular to the board transport direction D1. However, the detour path R20 may also be a path that includes a path that moves in an oblique direction inclined with respect to the board transport direction D1.

In the embodiment described above, the control unit 26 adjusts the height of the nozzle 6 in S32 of FIG. 4, and then adjusts the height of the head 16 in S42. However, in a modified example, the control unit 26 may adjust the height of the nozzle 6 after adjusting the height of the head 16.

Specific examples of the technology disclosed in this specification have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exert technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings achieves multiple objectives simultaneously, and achieving one of those objectives is itself technically useful.

2: Circuit board 4: Electronic component 4B: Lower end 4H: Height 5: Mounted component 5T: Upper end 6: Nozzle 10: Component mounter 12: Component feeder 14: Feeder holder 16: Head 17: Nozzle mounting hole 18: Head moving device 20: Board conveyor 24: Touch panel 26: Control unit 30: Head driving mechanism 32: Y-axis slider 34: X-axis slider 36: Z-axis slider 40: Imaging unit 50: Tray unit 52: Pallet moving shuttle 54: Tray pallet 56: Tray B1: First lower end B2: Second lower end D1: Board transport direction P1: Component supply position P2: Mounting position P3: Imaging positions R10, R12: Straight path R2: Imaging preparation path R20: Detour path R21: First detour path R22: Second detour path R23: Third detour path S1: First stroke S2: Second stroke

Claims (5)

A component mounter that mounts components to mounting positions on a substrate, comprising:
a component holding section for holding the component supplied to the component supply position;
a head that holds the component holder so as to be movable up and down by a first stroke;
a head drive mechanism that holds the head so that the head can be raised and lowered by a second stroke and moves the head in a horizontal direction relative to the substrate;
a movement path control unit that controls a path along which the head moves along the board from the component supply position to the mounting position;
Equipped with
The movement path control unit is
when an upper end of a mounted component already mounted on the board is located below a first lower end which is a lower end of the component held by the component holding unit when the head is at the lowermost point of the second stroke and the component holding unit is at the uppermost point of the first stroke, on a predetermined path from the component supply position to the mounting position, the head is moved along the predetermined path while maintaining the head at the lowermost point of the second stroke;
when the upper end of the mounted component is located above the first lower end and below a second lower end which is the lower end of the component held in the component holding unit when the head is at the highest point of the second stroke and the component holding unit is at the highest point of the first stroke, moving the head along the predetermined path with the head raised so that the lower end of the component held in the component holding unit is higher than the upper end of the mounted component;
moving the head along a detour path that detours around the mounted component when the upper end of the mounted component is located above the second lower end;
Component mounting machine. an imaging unit capable of imaging an underside and/or a side surface of the component held by the component holding unit at a predetermined imaging position,
The predetermined path is a path passing through the imaging position and heading toward the mounting position.
2. The component mounter according to claim 1. The component mounter according to claim 1, wherein the bypass path includes an external path that passes outside the outline of the board in a plan view. The component mounter according to any one of claims 1 to 3, wherein the bypass path is a single-motion path consisting of a path that moves linearly in the board transport direction in which the board is transported and a path that moves linearly in a direction perpendicular to the board transport direction. A component mounting method for mounting components to mounting positions on a substrate by a component mounter, comprising the steps of:
The component mounter includes:
a component holding section for holding the component supplied to the component supply position;
a head that holds the component holder so as to be movable up and down by a first stroke;
a head drive mechanism that holds the head so that the head can be raised and lowered by a second stroke and moves the head in a horizontal direction relative to the substrate;
a movement path control unit that controls a path along which the head moves along the board from the component supply position to the mounting position;
Equipped with
The component mounting method includes:
a step of moving the head along a predetermined path from the component supply position to the mounting position while maintaining the head at a lowest point of the second stroke, when an upper end of a mounted component already mounted on the board is located below a first lower end which is a lower end of the component held by the component holding unit when the head is at a lowest point of the second stroke and the component holding unit is at a highest point of the first stroke;
moving the head along the predetermined path in a state in which the head is raised so that the lower end of the component held by the component holding unit is higher than the upper end of the mounted component, when the upper end of the mounted component is located above the first lower end and below a second lower end which is the lower end of the component held by the component holding unit when the head is at the uppermost point of the second stroke and the component holding unit is at the uppermost point of the first stroke;
moving the head along a detour path that detours around the mounted component when the upper end of the mounted component is located above the second lower end;
Equipped with
Component mounting method.

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