JP2024048886A5 - - Google Patents
Info
- Publication number
- JP2024048886A5 JP2024048886A5 JP2022155025A JP2022155025A JP2024048886A5 JP 2024048886 A5 JP2024048886 A5 JP 2024048886A5 JP 2022155025 A JP2022155025 A JP 2022155025A JP 2022155025 A JP2022155025 A JP 2022155025A JP 2024048886 A5 JP2024048886 A5 JP 2024048886A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- monitoring index
- spectra included
- abnormality
- index value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022155025A JP2024048886A (ja) | 2022-09-28 | 2022-09-28 | ワークピースの膜厚測定の異常を検出する方法 |
| KR1020230126094A KR20240044349A (ko) | 2022-09-28 | 2023-09-21 | 워크피스의 막 두께 측정의 이상을 검출하는 방법, 광학식 막 두께 측정 장치, 및 프로그램을 기록한 기록 매체 |
| US18/371,357 US12510349B2 (en) | 2022-09-28 | 2023-09-21 | Method of detecting abnormality in measuring of film thickness of workpiece, optical film-thickness measuring apparatus, and storage medium storing program |
| TW112136520A TW202430325A (zh) | 2022-09-28 | 2023-09-25 | 工件之膜厚量測異常之檢測方法、光學式膜厚量測裝置、及記錄了程式之記錄媒體 |
| CN202311238535.8A CN117773766A (zh) | 2022-09-28 | 2023-09-25 | 检测工件的膜厚测定的异常的方法、光学式膜厚测定装置及记录程序的记录介质 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022155025A JP2024048886A (ja) | 2022-09-28 | 2022-09-28 | ワークピースの膜厚測定の異常を検出する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024048886A JP2024048886A (ja) | 2024-04-09 |
| JP2024048886A5 true JP2024048886A5 (https=) | 2025-08-08 |
Family
ID=90360102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022155025A Pending JP2024048886A (ja) | 2022-09-28 | 2022-09-28 | ワークピースの膜厚測定の異常を検出する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12510349B2 (https=) |
| JP (1) | JP2024048886A (https=) |
| KR (1) | KR20240044349A (https=) |
| CN (1) | CN117773766A (https=) |
| TW (1) | TW202430325A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118910575B (zh) * | 2024-10-11 | 2025-01-07 | 无锡展硕科技有限公司 | 一种半导体晶片表面薄膜厚度实时检测装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003312892A (ja) | 2002-04-17 | 2003-11-06 | Canon Inc | 紙種検知装置 |
| JP2020053550A (ja) | 2018-09-27 | 2020-04-02 | 株式会社荏原製作所 | 研磨装置、研磨方法、及び機械学習装置 |
| US12085515B2 (en) * | 2021-08-25 | 2024-09-10 | Kla Corporation | Methods and systems for selecting wafer locations to characterize cross-wafer variations based on high-throughput measurement signals |
-
2022
- 2022-09-28 JP JP2022155025A patent/JP2024048886A/ja active Pending
-
2023
- 2023-09-21 US US18/371,357 patent/US12510349B2/en active Active
- 2023-09-21 KR KR1020230126094A patent/KR20240044349A/ko active Pending
- 2023-09-25 TW TW112136520A patent/TW202430325A/zh unknown
- 2023-09-25 CN CN202311238535.8A patent/CN117773766A/zh active Pending
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