JP2024048886A - ワークピースの膜厚測定の異常を検出する方法 - Google Patents

ワークピースの膜厚測定の異常を検出する方法 Download PDF

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Publication number
JP2024048886A
JP2024048886A JP2022155025A JP2022155025A JP2024048886A JP 2024048886 A JP2024048886 A JP 2024048886A JP 2022155025 A JP2022155025 A JP 2022155025A JP 2022155025 A JP2022155025 A JP 2022155025A JP 2024048886 A JP2024048886 A JP 2024048886A
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JP
Japan
Prior art keywords
spectra
group
workpiece
spectrum
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022155025A
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English (en)
Japanese (ja)
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JP2024048886A5 (https=
Inventor
顕 中村
Akira Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2022155025A priority Critical patent/JP2024048886A/ja
Priority to KR1020230126094A priority patent/KR20240044349A/ko
Priority to US18/371,357 priority patent/US12510349B2/en
Priority to TW112136520A priority patent/TW202430325A/zh
Priority to CN202311238535.8A priority patent/CN117773766A/zh
Publication of JP2024048886A publication Critical patent/JP2024048886A/ja
Publication of JP2024048886A5 publication Critical patent/JP2024048886A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2022155025A 2022-09-28 2022-09-28 ワークピースの膜厚測定の異常を検出する方法 Pending JP2024048886A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022155025A JP2024048886A (ja) 2022-09-28 2022-09-28 ワークピースの膜厚測定の異常を検出する方法
KR1020230126094A KR20240044349A (ko) 2022-09-28 2023-09-21 워크피스의 막 두께 측정의 이상을 검출하는 방법, 광학식 막 두께 측정 장치, 및 프로그램을 기록한 기록 매체
US18/371,357 US12510349B2 (en) 2022-09-28 2023-09-21 Method of detecting abnormality in measuring of film thickness of workpiece, optical film-thickness measuring apparatus, and storage medium storing program
TW112136520A TW202430325A (zh) 2022-09-28 2023-09-25 工件之膜厚量測異常之檢測方法、光學式膜厚量測裝置、及記錄了程式之記錄媒體
CN202311238535.8A CN117773766A (zh) 2022-09-28 2023-09-25 检测工件的膜厚测定的异常的方法、光学式膜厚测定装置及记录程序的记录介质

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022155025A JP2024048886A (ja) 2022-09-28 2022-09-28 ワークピースの膜厚測定の異常を検出する方法

Publications (2)

Publication Number Publication Date
JP2024048886A true JP2024048886A (ja) 2024-04-09
JP2024048886A5 JP2024048886A5 (https=) 2025-08-08

Family

ID=90360102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022155025A Pending JP2024048886A (ja) 2022-09-28 2022-09-28 ワークピースの膜厚測定の異常を検出する方法

Country Status (5)

Country Link
US (1) US12510349B2 (https=)
JP (1) JP2024048886A (https=)
KR (1) KR20240044349A (https=)
CN (1) CN117773766A (https=)
TW (1) TW202430325A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118910575A (zh) * 2024-10-11 2024-11-08 无锡展硕科技有限公司 一种半导体晶片表面薄膜厚度实时检测装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003312892A (ja) 2002-04-17 2003-11-06 Canon Inc 紙種検知装置
JP2020053550A (ja) 2018-09-27 2020-04-02 株式会社荏原製作所 研磨装置、研磨方法、及び機械学習装置
US12085515B2 (en) * 2021-08-25 2024-09-10 Kla Corporation Methods and systems for selecting wafer locations to characterize cross-wafer variations based on high-throughput measurement signals

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118910575A (zh) * 2024-10-11 2024-11-08 无锡展硕科技有限公司 一种半导体晶片表面薄膜厚度实时检测装置
CN118910575B (zh) * 2024-10-11 2025-01-07 无锡展硕科技有限公司 一种半导体晶片表面薄膜厚度实时检测装置

Also Published As

Publication number Publication date
KR20240044349A (ko) 2024-04-04
US20240102791A1 (en) 2024-03-28
TW202430325A (zh) 2024-08-01
US12510349B2 (en) 2025-12-30
CN117773766A (zh) 2024-03-29

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