CN117773766A - 检测工件的膜厚测定的异常的方法、光学式膜厚测定装置及记录程序的记录介质 - Google Patents

检测工件的膜厚测定的异常的方法、光学式膜厚测定装置及记录程序的记录介质 Download PDF

Info

Publication number
CN117773766A
CN117773766A CN202311238535.8A CN202311238535A CN117773766A CN 117773766 A CN117773766 A CN 117773766A CN 202311238535 A CN202311238535 A CN 202311238535A CN 117773766 A CN117773766 A CN 117773766A
Authority
CN
China
Prior art keywords
workpiece
group
spectrograms
film thickness
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311238535.8A
Other languages
English (en)
Chinese (zh)
Inventor
中村显
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN117773766A publication Critical patent/CN117773766A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202311238535.8A 2022-09-28 2023-09-25 检测工件的膜厚测定的异常的方法、光学式膜厚测定装置及记录程序的记录介质 Pending CN117773766A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022155025A JP2024048886A (ja) 2022-09-28 2022-09-28 ワークピースの膜厚測定の異常を検出する方法
JP2022-155025 2022-09-28

Publications (1)

Publication Number Publication Date
CN117773766A true CN117773766A (zh) 2024-03-29

Family

ID=90360102

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311238535.8A Pending CN117773766A (zh) 2022-09-28 2023-09-25 检测工件的膜厚测定的异常的方法、光学式膜厚测定装置及记录程序的记录介质

Country Status (5)

Country Link
US (1) US12510349B2 (https=)
JP (1) JP2024048886A (https=)
KR (1) KR20240044349A (https=)
CN (1) CN117773766A (https=)
TW (1) TW202430325A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118910575B (zh) * 2024-10-11 2025-01-07 无锡展硕科技有限公司 一种半导体晶片表面薄膜厚度实时检测装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003312892A (ja) 2002-04-17 2003-11-06 Canon Inc 紙種検知装置
JP2020053550A (ja) 2018-09-27 2020-04-02 株式会社荏原製作所 研磨装置、研磨方法、及び機械学習装置
US12085515B2 (en) * 2021-08-25 2024-09-10 Kla Corporation Methods and systems for selecting wafer locations to characterize cross-wafer variations based on high-throughput measurement signals

Also Published As

Publication number Publication date
KR20240044349A (ko) 2024-04-04
JP2024048886A (ja) 2024-04-09
US20240102791A1 (en) 2024-03-28
TW202430325A (zh) 2024-08-01
US12510349B2 (en) 2025-12-30

Similar Documents

Publication Publication Date Title
JP3327289B2 (ja) 工程終了点測定装置及び測定方法及び研磨装置及び半導体デバイス製造方法及び信号処理プログラムを記録した記録媒体
JP5654753B2 (ja) スペクトルを使用した研磨終了点の決定
CN103072072B (zh) 研磨方法及研磨装置
CN109968186B (zh) 基于光谱的化学机械抛光在线终点检测方法
JP2002124496A (ja) 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置
CN107923739B (zh) 用于无接触地评价晶圆的表面特性的方法和装置
US20130344773A1 (en) Polishing apparatus and polishing method
US20180321026A1 (en) Grouping Spectral Data From Polishing Substrates
CN117773766A (zh) 检测工件的膜厚测定的异常的方法、光学式膜厚测定装置及记录程序的记录介质
CN110625516B (zh) 确定传感器轨道、计算且均匀化研磨进度、停止研磨装置的方法、记录介质及基板研磨装置
CN110383428A (zh) 半导体制造装置以及半导体制造方法
JPH09298176A (ja) 研磨方法及びそれを用いた研磨装置
US20240359285A1 (en) Method of detecting a wrong workpiece which is not an object to be polished, and optical film-thickness measuring apparatus
CN121132501A (zh) 对来自工件的反射光的光谱进行检查的方法和研磨装置
JP2024106535A (ja) 膜厚測定に使用されるプリセットスペクトルデータの異常検出方法、および光学的膜厚測定装置
JP2023159949A (ja) 研磨終点検出のためのパラメータ調整方法および研磨終点検出システム
CN114746214A (zh) 研磨装置及研磨方法
JP2026000144A (ja) ワークピースの膜厚推定方法および研磨装置
US20240359290A1 (en) Polishing method, computer-readable storage medium storing program for operating computer, and polishing apparatus
JP2025023557A (ja) 研磨装置
JPH09298175A (ja) 研磨方法及びそれを用いた研磨装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination