JP2024040772A - Pickup device, control method for pickup device, and control program for pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pickup device that has a simpler structure and is reducible in bending moment applied to a chip component when peeled off from a dicing tape.

SOLUTION: A pickup device is configured to pick up a chip component, stuck on a dicing tape, from the dicing tape, and has a conical spring which decreases in spring constant from its outer peripheral part to its center part, and spring moving means which moves the conical spring in the direction of a normal to a principal surface of the chip component so that the center part of the conic spring is pressed against the chip component from the reverse surface of the dicing tape.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a pickup device and the like.

In manufacturing chip components such as semiconductors, a plurality of chip components are generally formed on one wafer. The wafer is then divided into individual chip components using a dividing method such as dicing. In general dicing, a dicing tape is used. Dicing tape is a film that is adhesive on one side. Dicing tape is also called a dicing sheet, wafer sheet, adhesive sheet, etc.

When dicing, the backside of the wafer is first attached to a dicing tape. The wafer is then divided into individual chip components by dicing. Once dicing is complete, the dicing tape is expanded, which is a process that stretches the dicing tape, forming gaps between the chip components. The adhesiveness of the dicing tape is then reduced by exposure to ultraviolet light or other methods. The front side of the chip components is then adsorbed by a pick-up device equipped with an adsorption means called a collet, and the chip components are picked up. In a typical method, the backside of the dicing tape is pushed up by a push-up pin. This push-up promotes the peeling of the chip components from the dicing tape.

In the above pickup device, the simplest configuration is to push up the center of the chip component with a single push-up pin. When push-up is performed with this configuration, peeling begins from the end of the chip component. At this time, a bending moment is generated where the tip of the push-up pin abuts as a fulcrum, the end of the chip component as a point of action, and the adhesive force (peel force) of the dicing tape acts on the point of action. As the size of the chip component increases, the distance from the fulcrum to the end of the chip component, which is the point of action, increases. Along with this, the bending moment applied to the chip component increases. When the stress applied to the chip component due to this bending moment exceeds the breaking stress of the chip component, the chip component is damaged. Therefore, as the size of the chip component increases, the risk of the chip component being damaged increases.

Therefore, a method for reducing the bending moment applied to chip components is proposed in Patent Document 1. For example, Patent Document 1 describes an invention of a pickup method and device for peeling off a chip component (chip) from its outer periphery. The pickup device of Patent Document 1 includes a plurality of cylinders having different diameters (a first suction cylinder, a second suction cylinder, a first push-up cylinder, and a second push-up cylinder) and a plurality of push-up pins.

In the pickup, first, by suctioning the dicing tape (applying sheet, dicing sheet) through the suction hole of the outermost cylinder (first suction cylinder), the dicing tape is attached to the upper end of the first suction cylinder. (Figure 3(a) of Cited Document 1).

Next, the first push-up cylinder, the second suction cylinder, the second push-up cylinder and the push-up pin arranged inside the first suction cylinder are raised to the same height to push the chip component upward through the dicing tape (FIG. 3(b) of Reference 1). As a result, the dicing tape to which the chip component is attached is slightly peeled off from the outer edge of the underside of the chip component on the outer periphery side of the first push-up cylinder toward the inside of the chip component. In this operation, the abutting portion of the first push-up cylinder becomes the fulcrum, and the end of the chip component above the first suction cylinder becomes the peeling point (point of action).

Next, while maintaining the heights of the first suction cylinder and the first push-up cylinder, the pickup device picks up the second push-up cylinder, the second suction cylinder, and the push-up pin located inside the first push-up cylinder. Raise the same height. Then, the pickup device pushes the chip component further upward via the dicing tape (FIG. 3(c) of Cited Document 1). As a result, the dicing tape is further peeled off from the outer periphery of the pasting surface toward the inside of the chip component on the outer periphery side of the second push-up cylinder. In this operation, the abutting portion of the second thrusting cylinder becomes a fulcrum, and the end of the chip component above the first thrusting cylinder becomes a peeling point (point of action).

Next, while maintaining the heights of the first suction cylinder, first push-up cylinder, and second push-up cylinder, move the second suction cylinder located inside the second push-up cylinder and the push-up pin to the same height. The chip component is pushed up even further (FIG. 3(d) of Cited Document 1). As a result, the dicing tape is further peeled off from the outer periphery of the pasting surface toward the inside of the chip 1 on the outer periphery side of the second adsorption cylinder. In this operation, the abutting portion of the second thrusting cylinder becomes a fulcrum, and the end of the chip component above the first thrusting cylinder becomes a peeling point (point of action).

Next, the heights of the first suction cylinder, the first push-up cylinder, the second push-up cylinder, and the second suction cylinder are maintained. Then, in this state, the push-up pin is further raised. As a result, the chip component is further pushed up. As a result, the chip component is supported on the tip of the push-up pin (FIG. 3(e) of Cited Document 1). At this time, the dicing tape in contact with the second suction cylinder is attracted and fixed to the second suction cylinder by suction from the suction groove of the second suction cylinder. In this way, the push-up pins can more effectively peel off the chip components from the dicing tape. In this operation, the abutting portion of the push-up pin becomes a fulcrum, and the end of the chip component on the second push-up cylinder becomes a peeling point (point of action).

In each of the above steps, the distance from the fulcrum to the point of action is shorter than in a configuration in which one push-up pin pushes up the center of the chip component. Therefore, the bending moment acting on the chip component is significantly reduced compared to a configuration in which a single push-up pin pushes up the center of the chip component. In the technique described in Patent Document 1, the inner cylinder and the push-up pin are pushed up one after another as the peeling progresses. In this way, the dicing tape is sequentially peeled off from the outer periphery of the chip, and the bonding area between the dicing tape and the chip component is gradually reduced.

Japanese Patent Application Publication No. 2006-005030

In the pickup device of Patent Document 1, a plurality of actuators are provided for each of the plurality of cylinders and the push-up pins in order to independently move the plurality of cylinders and the push-up pins. Therefore, there was a problem that the structure became complicated.

The present invention has been made in view of the above-mentioned problems, and aims to provide a pick-up device etc. that has a simpler structure and reduces the bending moment applied to chip components when peeling from a dicing tape. The purpose is

In order to solve the above-mentioned problems, a pickup device of the present invention is a pickup device for picking up a chip component pasted on a dicing tape from the dicing tape, and the pickup device picks up a chip component stuck on a dicing tape from the outer periphery to the center. The cone-shaped spring is attached to the chip component so that the center part of the cone-shaped spring presses the chip component through the lower surface of the dicing tape. Spring moving means for moving in the normal direction of the main surface.

Further, a method for controlling a pickup device according to the present invention is a method for controlling a pickup device for picking up a chip component pasted on a dicing tape from the dicing tape, the pickup device controlling the pickup device from the outer peripheral portion. A cone-shaped spring whose spring constant decreases toward the center, and the pickup device presses the chip component by the center of the cone-shaped spring via the lower surface of the dicing tape. , moving the cone-shaped spring in a direction normal to the main surface of the chip component.

Further, a control program for a pickup device according to the present invention is a control program for a pickup device for picking up a chip component pasted on a dicing tape from the dicing tape, the pickup device A cone-shaped spring whose spring constant decreases toward the center, and a control program for the pickup device presses the chip component through the lower surface of the dicing tape by the center of the cone-shaped spring. The pickup device is caused to perform a process of moving the cone-shaped spring in a direction normal to the principal surface of the chip component.

An advantage of the present invention is that it is possible to provide a pickup device and the like that has a simpler structure and reduces the bending moment applied to the chip component when it is peeled off from the dicing tape.

FIG. 2 is a side view showing the pickup device of the first embodiment. FIG. 2 is a side view showing a first operating state of the pickup device of the first embodiment. FIG. 7 is a side view showing a second operating state of the pickup device of the first embodiment. FIG. 7 is a side view showing a third operating state of the pickup device of the first embodiment. FIG. 7 is a side view showing a fourth operating state of the pickup device of the first embodiment. FIG. 7 is a side view showing a fifth operating state of the pickup device of the first embodiment. FIG. 7 is a side view showing a sixth operating state of the pickup device of the first embodiment. It is a side view which shows the pick-up device of 2nd Embodiment. FIG. 7 is a side view showing a first operating state of the pickup device of the second embodiment. FIG. 7 is a side view showing a second operating state of the pickup device of the second embodiment. FIG. 7 is a side view showing a third operating state of the pickup device of the second embodiment. FIG. 7 is a plan view showing an example of a method for manufacturing a cone-shaped spring according to a second embodiment. It is a top view which shows the 1st modification of the cone-shaped spring of 2nd Embodiment. It is a top view which shows the 2nd modification of the cone-shaped spring of 2nd Embodiment.

Embodiments of the present invention will be described in detail below with reference to the drawings. However, although the embodiments described below include technically preferable limitations for implementing the present invention, the scope of the invention is not limited to the following. Note that similar components in each drawing may be designated by the same numbers and their descriptions may be omitted.

(First embodiment)
FIG. 1 is a side view showing a pickup device according to a first embodiment. The pickup device 100 is a device for picking up the chip component 300 stuck on the dicing tape 200. The pickup device 100 includes a cone-shaped spring 10 and a spring moving means 20.

The cone-shaped spring 10 is a cone-shaped crane spring. The cone-shaped spring 10 is formed so that its outer diameter gradually decreases from the base (lower side of the paper in FIG. 1) to the tip (upper side of the paper in FIG. 1). The tip of the cone-shaped spring 10 is brought into contact with the back surface of the dicing tape 200. The base of the cone-shaped spring 10 is attached to a spring moving means 20. The cone-shaped spring 10 is housed inside a suction block 30, which will be described later. The cone-shaped spring 10 is formed such that the spring constant decreases from the outer periphery toward the center. In the cone-shaped spring 10, for example, the outer diameter of the cross section decreases from the outer periphery toward the center. This achieves the above spring constant.

For example, the cone-shaped spring 10 is formed by spirally winding a wire rod having a tapered wire diameter. Here, the tapered shape means that the wire diameter gradually changes from large to small. The cross-sectional shape of the wire is, for example, circular. Further, the overall shape of the cone-shaped spring 10 is determined by the way the wire is wound. The overall shape of the cone-shaped spring 10 is, for example, a cone, an elliptical cone, or a polygonal pyramid.

Further, the cone-shaped spring 10 can also be formed, for example, by punching out a plate-shaped spring steel. In this case, first, spring steel is punched out into a spiral shape in which the line width decreases from the outer periphery toward the center. The punched spring steel is then deformed so that the whole forms a cone. At this time, the cross section of the wire rod of the cone-shaped spring 10 becomes rectangular. Note that the ends of the punched wire may be chamfered. In this case, the cross section of the wire has a rectangular shape with a chamfer.

The spring moving means 20 is attached to a suction block 30, which will be described later, so as to be movable in the direction of the normal n to the main surface of the chip component 300. Further, the spring moving means 20 moves the cone-shaped spring 10 in the direction of the normal n to the main surface of the chip component 300. At this time, the spring moving means 20 is moved so that the center of the conical spring 10 approaches the lower surface of the dicing tape 200. When the spring moving means 20 moves the cone-shaped spring 10 in a direction approaching the dicing tape 200, the cone-shaped spring 10 presses the chip component 300 via the lower surface of the dicing tape 200. Although not shown, the spring moving means 20 is moved in the direction of the normal n to the main surface of the chip component 300 by an electric motor or the like. That is, the spring moving means 20 moves the cone-shaped spring 10 in the vertical direction in FIG.

The suction block 30 accommodates the cone-shaped spring 10 and a part of the spring moving means 20. The suction block 30 holds the spring moving means 20 so that the spring moving means 20 can move in the direction of the normal n of the main surface of the chip component 300. The dicing tape 200 to which the chip component 300 is attached is placed on the upper surface of the suction block 30. The suction block 30 suctions the back surface of the dicing tape 200. The part of the suction block 30 that corresponds to the chip component 300 to be picked up is an opening (not shown). By sucking air through this opening, the suction block 30 suctions the back surface of the dicing tape 200. In other words, the dicing tape 200 is not suctioned in the area where the pickup is to be performed.

Next, the operation of the pickup device 100 will be explained. FIG. 2 is a side view showing the first operating state of the pickup device 100 of the first embodiment. First, from the state shown in FIG. 1, the spring moving means 20 is moved in the direction of the normal line n so as to approach the lower surface of the dicing tape 200. As a result, the conical spring 10 is moved in the same direction. Then, the center portion of the cone-shaped spring 10 comes into contact with the lower surface of the dicing tape 200. FIG. 2 represents this state.

Next, the spring moving means 20 is brought closer to the lower surface of the dicing tape 200 so that the cone-shaped spring 10 is compressed. The conical spring 10 has a spring constant that decreases from the outer periphery toward the center. Therefore, in the above operation, the cone-shaped spring 10 begins to be compressed from the center, and the compression gradually spreads toward the outer periphery of the cone-shaped spring 10.

FIG. 3 is a side view showing the second operating state of the pickup device 100 of the first embodiment. In FIG. 3, the distance between the lower surface of the dicing tape 200 and the spring moving means is the same as the wire diameter of the outer periphery of the conical spring 10. In other words, the entire cone-shaped spring 10 is compressed.

FIG. 4 is a side view showing the third operating state of the pickup device 100 of the first embodiment. The chip component 300 is pushed up in the direction of the normal line n by the restoring force of the cone-shaped spring 10. At this time, the outer periphery of the cone-shaped spring 10 is restored, and the part of the cone-shaped spring 10 closer to the center remains compressed. In this embodiment, the spring constant of the conical spring 10 is large at the outer periphery and becomes small toward the center. This is the reason for the above situation. Through this operation, the outer peripheral portion of the chip component 300 is peeled off from the dicing tape 200.

FIG. 5 is a side view showing the fourth operating state of the pickup device 100 of the first embodiment. In the fourth state, the restoration of the cone-shaped spring 10 is progressing toward the center compared to the third state. As a result, peeling of the dicing tape 200 progresses toward the center of the chip component 300 compared to the third state.

FIG. 6 is a side view showing the fifth operating state of the pickup device 100 of the first embodiment. In the fifth state, the cone-shaped spring 10 is restored more toward the center than in the fourth state. As a result, peeling of the dicing tape 200 progresses toward the center of the chip component 300 compared to the fourth state.

FIG. 7 is a side view showing the sixth operating state of the pickup device 100 of the first embodiment. In the sixth state, the restoration of the conical spring 10 is progressing toward the center compared to the fourth state. The entire cone-shaped spring 10 has been restored to its state without any external force. As a result, peeling of the dicing tape 200 progresses toward the center of the chip component 300 compared to the fourth state. In this state, most of the chip component 300 has been peeled off from the dicing tape 200. Therefore, the chip component 300 is easily picked up.

The above operation reduces the bending moment that bends the chip component 300 during peeling.

In the pickup device 100 described above, the bending moment applied to the chip component 300 during peeling from the dicing tape 200 is reduced, similar to the pickup device of Patent Document 1. The pickup device 100 has a simple configuration in which the cone-shaped spring 10 is moved up and down by the spring moving means 20. In other words, a similar operation can be realized with a simpler configuration than the pickup device 100 of Patent Document 1, which uses a plurality of actuators to control a plurality of push-up means.

The pickup device 100 and the like of this embodiment have been described above.

The pickup device 100 of this embodiment picks up the chip component 300 stuck on the dicing tape 200 from the dicing tape 200. The pickup device 100 includes a cone-shaped spring 10 and a spring moving means 20. In the conical spring 10, the spring constant decreases from the outer periphery toward the center. Then, the spring moving means 20 moves the cone-shaped spring 10 in the direction of the normal n to the main surface of the chip component 300. At this time, the dicing tape 200 is moved so that the lower surface of the dicing tape 200 is pressed by the center of the cone-shaped spring 10. Then, the lower surface of the chip component 300 is pressed through the lower surface of the dicing tape 200.

Such a configuration reduces the bending moment that bends the chip component 300 during peeling. The above-mentioned separation is realized by a simple configuration in which the spring moving means 20 only moves the cone-shaped spring 10.

Further, according to one embodiment, the cone-shaped spring 10 of the pickup device 100 is formed of a spring wire. The outer diameter of the cross section of the spring wire becomes smaller from the outer periphery toward the center. In this configuration, since the outer diameter of the cross section decreases from the outer periphery toward the center, a configuration in which the spring constant gradually decreases is realized.

Further, according to one embodiment, in the pickup device 100, the cross-sectional shape of the spring wire forming the cone-shaped spring 10 is circular. For such a configuration, for example, a wire rod having a circular cross section is used. This wire has a tapered wire diameter. A cone-shaped spring 10 is formed by spirally winding the wire with the thicker end on the outside and the thinner end in the center.

According to one embodiment, in the pickup device 100, the cross-sectional shape of the spring wire forming the cone-shaped spring 10 is rectangular. For example, a punched flat plate of spring steel 400 serves as the raw material for the cone-shaped spring 10. First, a flat plate of spring steel 400 is punched out in a pattern in which the line width becomes narrower from the outer periphery toward the center. A cone-shaped spring 10 is then formed by deforming the punched material so that the center becomes the top of the cone. If the spring steel 400 is punched vertically, the resulting product will have a rectangular cross section. In this configuration, the corners of the material may be chamfered.

According to one embodiment, in the pickup device 100, the entire shape of the cone-shaped spring 10 is a cone, an elliptical cone, or a polygonal pyramid. A conical spring is commonly used as a conical spring. However, the overall shape of the conical spring 10 is not limited to a conical shape. For example, the shape may be an elliptical cone or a polygonal pyramid. This shape is created by adjusting the way the wire is wound and the pattern in which the flat plate is punched out.

Further, the pickup device control method of the present invention controls the pickup device 100. A chip component 300 to be picked up is pasted on the dicing tape 200. Chip components 300 are picked up from dicing tape 200. The pickup device 100 includes a cone-shaped spring 10. In the conical spring 10, the spring constant decreases from the outer periphery toward the center. Then, the conical spring 10 is moved in the direction of the normal n to the main surface of the chip component 300 so as to approach the lower surface of the dicing tape 200. At this time, the movement is performed such that the center of the cone-shaped spring 10 presses the lower surface of the dicing tape 200. Then, the lower surface of the chip component 300 is pressed through the lower surface of the dicing tape 200.

In the above configuration, peeling of the dicing tape 200 starts from the outer periphery of the chip component 300. Then, the peeling gradually progresses toward the center of the chip component 300. This is because the spring constant of the conical spring 10 decreases from the outer periphery toward the center. As a result, the bending moment applied to the chip component 300 is reduced.

Further, the pickup device control program of the present invention causes the pickup device 100 to execute processing. A chip component 300 to be picked up is pasted on the dicing tape 200. Chip components 300 are picked up from dicing tape 200. The pickup device 100 includes a cone-shaped spring 10. In the conical spring 10, the spring constant decreases from the outer periphery toward the center. The control program then causes the pickup device 100 to execute a process of moving the cone-shaped spring 10. In this process, the cone-shaped spring 10 is moved in the direction of the normal n to the main surface of the chip component 300. This movement is a movement of the conical spring 10 approaching the lower surface of the dicing tape 200. At this time, the movement is performed such that the center of the cone-shaped spring 10 presses the lower surface of the dicing tape 200. Then, the lower surface of the chip component 300 is pressed through the lower surface of the dicing tape 200.

In the above configuration, peeling of the dicing tape 200 starts from the outer periphery of the chip component 300. Then, the peeling gradually progresses toward the center of the chip component 300. This is because the spring constant of the conical spring 10 decreases from the outer periphery toward the center. As a result, the bending moment applied to the chip component 300 is reduced.

(Second embodiment)
FIG. 8 is a side view showing the pickup device 101 of the second embodiment. The pickup device 101 includes a collet 90 and a collet driving means 91.

The collet 90 is provided at a position facing the top surface of the chip component 300. The collet 90 then attracts the chip component 300.

The collet driving means 91 moves the collet 90 at least in the direction of the normal line n. The collet driving means 91 can adjust the force applied to the collet. Although not shown, the position of the collet 90 is detected by collet position detection means.

Next, the operation of the pickup device 101 will be explained. FIG. 9 is a side view showing the first operating state of the pickup device 101 of the second embodiment. A collet 90 is in contact with the upper surface of the chip component 300. The collet 90 controls the chip component 300 to be picked up to be at the same height as the adjacent chip component 300. Further, the spring moving means 20 moves the cone-shaped spring 10 so as to press the cone-shaped spring 10 against the back surface of the dicing tape 200. In the first state, the cone-shaped spring 10 is compressed until it is completely collapsed.

FIG. 10 is a side view showing the second operating state of the pickup device 101 of the second embodiment. The collet 90 has moved higher than in the first state. The spring moving means 20 is held in the same position as in the first state. In this state, the outer periphery of the conical spring 10 is restored, and the central portion of the conical spring 10 remains compressed. In this embodiment, the spring constant of the cone-shaped spring 10 decreases from the outer periphery toward the center of the cone-shaped spring 10. Therefore, the cone-shaped spring 10 is in the above state. Through this operation, the outer peripheral portion of the chip component 300 is peeled off from the dicing tape 200.

FIG. 11 is a side view showing the third operating state of the pickup device 101 of the second embodiment. In the third state, the collet 90 has moved higher than in the first state. Further, the spring moving means 20 is held at the same position as in the second state. Due to this control, the restoration of the cone-shaped spring 10 is progressing toward the center compared to the second state. The entire cone-shaped spring 10 has been restored to its state without any external force. In this state, most of the chip component 300 has been peeled off from the dicing tape 200. The height of the collet 90 in the third state is stored in advance in the pickup device 100. Then, the collet driving means 91 moves the collet 90 further upward. As a result, the chip component 300 is completely peeled off from the dicing tape 200, and the pickup is completed.

The above operation reduces the bending moment that bends the chip component 300 during pickup.

Next, a specific example of the cone-shaped spring 10 will be described. FIG. 12 is a plan view showing an example of a method for manufacturing the cone-shaped spring 10 of the second embodiment. The cone-shaped spring 10 is formed, for example, by punching a plate-shaped spring steel 400 into a predetermined pattern. This predetermined pattern is a spiral pattern as shown in FIG. In the example of FIG. 12, the width is wide at the outer periphery and decreases toward the center. To form the cone-shaped spring 10, first, spring steel 400 is punched out in a pattern shown at 10a in FIG. 12. Next, the wire is deformed so that the central portion of the punched pattern 10a is pulled upward from the surface of FIG. As a result, the spring material is formed into a conical shape.

Next, a modification of the cone-shaped spring 10 will be described. FIG. 13 is a plan view showing a first modification of the conical spring 10 of the second embodiment. The conical spring 10 of the first modification has an elliptical spiral shape when viewed from above. The width becomes narrower from the outer periphery toward the center. In other words, the entire shape of the cone-shaped spring 10 becomes an elliptic cone shape.

FIG. 14 is a plan view showing a second modification of the cone-shaped spring 10 of the second embodiment. The conical spring 10 of the second modified example has a planar shape of a nearly square spiral when viewed from above. The width becomes narrower from the outer periphery toward the center. In the second modification, the pyramid-shaped spring 10 has a square pyramid shape.

The pickup device 101 and the like of this embodiment have been described above.

The pickup device 101 of this embodiment picks up the chip component 300 stuck on the dicing tape 200 from the dicing tape 200. The pickup device 100 includes a conical spring 10, a spring moving means 20, a collet 90, and a collet driving means 91. In the conical spring 10, the spring constant decreases from the outer periphery toward the center. Then, the spring moving means 20 moves the cone-shaped spring 10 in the normal n direction of the main surface of the chip component 300. At this time, the dicing tape 200 is moved so that the lower surface of the dicing tape 200 is pressed by the center of the conical spring 10. Then, the lower surface of the chip component 300 is pressed through the lower surface of the dicing tape 200. A collet 90 is provided at a position facing the top surface of the chip component 300. The collet 90 attracts the chip component 300. The collet driving means 91 moves the collet 90 at least in the direction of the normal line n.

In this configuration, the collet 90 controls the position of the top surface of the chip component 300. Thereby, the amount of compression of the cone-shaped spring 10 can be freely controlled. Here, the spring constant of the cone-shaped spring 10 decreases from the outer periphery toward the center. Therefore, the dicing tape 200 starts to peel off from the outer periphery of the chip component 300. Then, the peeling gradually progresses toward the center of the chip component 300. As a result, the bending moment that bends the chip component 300 during peeling is reduced.

Further, the method for controlling the pickup device 101 of this embodiment controls the pickup device 101. A chip component 300 to be picked up is pasted on the dicing tape 200. Chip components 300 are picked up from dicing tape 200. The pickup device 100 includes a conical spring 10, a collet 90, and a collet driving means 91. In the conical spring 10, the spring constant decreases from the outer periphery toward the center. Then, the conical spring 10 is moved in the direction of the normal n so as to approach the lower surface of the dicing tape 200. At this time, the movement is performed such that the center of the cone-shaped spring 10 presses the lower surface of the dicing tape 200. Then, the lower surface of the chip component 300 is pressed through the lower surface of the dicing tape 200. A collet 90 is provided at a position facing the top surface of the chip component 300. The collet 90 attracts the chip component 300. The collet driving means 91 moves the collet 90 at least in the direction of the normal line n. Here, the normal n is the normal to the main surface of the chip component 300. In the method for controlling the pickup device 101, the collet driving means 91 brings the collet 90 into contact with the upper surface of the chip component 300. Further, the collet driving means 91 applies a force to the collet 90 to compress the cone-shaped spring 10. Further, the collet driving means 91 moves the collet 90 in a direction away from the conical spring 10. Due to this movement, the restoring force of the cone-shaped spring 10 is applied to the lower surface of the chip component 300.

In the above configuration, the position of the top surface of the chip component 300 is controlled by the collet 90. Thereby, the amount of compression of the cone-shaped spring 10 can be freely controlled. Here, the spring constant of the cone-shaped spring 10 decreases from the outer periphery toward the center. Then, by raising the collet 90, the compression of the cone-shaped spring 10 is gradually released. At this time, the restoration starts from the outer periphery of the cone-shaped spring 10. This is because the spring constant of the conical spring 10 decreases from the outer periphery toward the center. Therefore, the dicing tape 200 starts to peel off from the outer periphery of the chip component 300. Then, as the collet 90 rises, the cone-shaped spring 10 is restored. Along with this, peeling gradually progresses toward the center of the chip component 300. As a result, the bending moment that bends the chip component 300 during peeling is reduced.

The scope of the present invention also includes a program that causes a computer to execute the processes of the first and second embodiments described above, and a recording medium that stores the program. As the recording medium, for example, a magnetic disk, magnetic tape, optical disk, magneto-optical disk, semiconductor memory, etc. can be used.

The present invention has been described above using the above-described embodiment as an exemplary example. However, the present invention is not limited to the above embodiments. That is, the present invention can apply various aspects that can be understood by those skilled in the art within the scope of the present invention.

10 Cone-shaped spring 20 Spring moving means 30 Adsorption block 90 Collet 91 Collet driving means 100, 101 Pick-up device 200 Dicing tape 300 Chip parts 400 Spring steel

Claims (10)

A pickup device for picking up chip components stuck on a dicing tape from the dicing tape, the pickup device comprising:
A cone-shaped spring whose spring constant decreases from the outer periphery to the center,
Spring movement for moving the cone-shaped spring in the direction of the normal to the main surface of the chip component so that the chip component is pressed by the center of the cone-shaped spring through the lower surface of the dicing tape. means and
A pickup device comprising: The outer diameter of the cross section of the spring wire constituting the cone-shaped spring is:
The pickup device according to claim 1, wherein the pickup device becomes smaller from the outer peripheral portion toward the center portion. The cross-sectional shape of the spring wire is
circular,
The pickup device according to claim 2, characterized in that: The cross-sectional shape of the spring wire is
It is rectangular,
The pickup device according to claim 2, characterized in that: The overall shape of the conical spring is
Conical, elliptical or polygonal pyramidal;
The pickup device according to any one of claims 1 to 4. a collet that is provided at a position facing the top surface of the chip component and that sucks the chip component;
collet driving means for moving the collet at least in the direction of the normal;
The pickup device according to any one of claims 1 to 4, characterized in that it has: a collet that is provided at a position facing the top surface of the chip component and that sucks the chip component;
collet driving means for moving the collet at least in the direction of the normal;
The pickup device according to claim 5, characterized in that it has: A method for controlling a pickup device for picking up chip components stuck on a dicing tape from the dicing tape, the method comprising:
The pickup device includes:
A cone-shaped spring whose spring constant decreases from the outer periphery to the center.
Equipped with
The pickup device is
moving the cone-shaped spring in a direction normal to the main surface of the chip component so that the chip component is pressed by the center of the cone-shaped spring through the lower surface of the dicing tape;
A method for controlling a pickup device, characterized in that: The pickup device includes:
a collet that is provided at a position facing the top surface of the chip component and that sucks the chip component;
collet driving means for moving the collet at least in the direction of the normal;
Equipped with
The pickup device is
bringing the collet into contact with the top surface of the chip component;
applying a force to the collet to compress the conical spring;
moving the collet in a direction away from the cone-shaped spring so that the restoring force of the cone-shaped spring is applied to the lower surface of the chip component;
9. The method of controlling a pickup device according to claim 8. A control program for a pickup device for picking up chip components stuck on a dicing tape from the dicing tape, the program comprising:
The pickup device includes:
A cone-shaped spring whose spring constant decreases from the outer periphery to the center.
Equipped with
The control program for the pickup device includes:
A process of moving the cone-shaped spring in a direction normal to the main surface of the chip component so that the chip component is pressed by the center of the cone-shaped spring through the lower surface of the dicing tape. ,
A control program for a pickup device, which is executed by the pickup device.

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