JP2024037229A - Manufacturing method of laminated film - Google Patents

Abstract

To provide a manufacturing method of a laminated film which is suitable for securing a good cut end of a curable resin layer and an inorganic layer while reducing cutting chips, in a slit of a laminated film raw fabric having a temporary support film, the curable resin layer and the inorganic layer in this order.SOLUTION: A manufacturing method of a laminated film slits a film raw fabric F by a slitter device X having a support roller 10 and a two-blade unit 20. The support roller 10 has a roller part 11, a circular blade 12, a spacer 13, a circular blade 14 and a roller part 11 in this order in one direction. The two-blade unit 20 has circular blades 21 and 22. A distance between blade edges of the circular blades 21 and 22 is 5 to 20 mm. The manufacturing method slits a film raw fabric F between the circular blades 12 and 21 and the circular blades 14 and 22 while feeding the film raw fabric F by the support roller 10 in a state in which a side opposite to the inorganic layer 130 is brought into contact with the roller parts 11 and 11.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing a laminated film.

BACKGROUND ART A slitter device for slitting a long and wide film material in the length direction is known. According to the slitter device, a film having a predetermined width can be manufactured by slitting a film material. The slitter device includes, for example, a pair of rotary cutting blades at each predetermined position (slit position) in the width direction of the film. The pair of cutting blades are arranged so that they can work together to slit the film by interference between their blade edges. A method including a slitting process using such a slitter device is described, for example, in Patent Document 1 below.

JP 2015-205393 Publication

As the cutting blade of the slitter device, a single blade is preferably used from the viewpoint of the sharpness of the cutting edge. Further, as the cutting blade, a two-blade unit in which two single blades are stacked is preferably used from the viewpoint of suppressing ridges in the film after slitting. Ripping refers to local warping of the cut end of the film. FIG. 8 shows a slitter device Z as an example of a slitter device including such a two-blade unit. The slitter device Z includes a support roller 80 and a two-blade unit 90.

The support roller 80 includes a roller portion 81, a circular blade 82, a spacer 83, a circular blade 84, and a roller portion 85 in this order in one direction. The circular blade 82 is single-edged and has a blade back surface 82a that faces the spacer 83 with a gap G1 in between. The circular blade 84 is single-edged and has a blade back surface 84a that faces the spacer 83 with a gap G2 in between. Such a support roller 80 is rotatable around a rotation axis B1 extending in one direction.

The two-blade unit 90 includes circular blades 91 and 92. The circular blade 91 is a single-edged blade having a cutting edge that fits into the gap G1 (between the circular blade 82 and the spacer 83), and has a blade back surface 91a on the circular blade 82 side and a tip inclined surface 91b. The blade back surface 91a and the tip inclined surface 91b form an acute angle. The circular blade 92 is a single-edged blade having a cutting edge that fits into the gap G2 (between the circular blade 84 and the spacer 83), and has a blade back surface 92a on the circular blade 84 side and a tip inclined surface 92b. The blade back surface 92a and the tip inclined surface 92b form an acute angle. The separation distance d' between the cutting edge 91e of the circular blade 91 and the cutting edge 92e of the circular blade 92 is set to 4 mm or less. Such a two-blade unit 90 is rotatable around a rotation axis B2 extending in one direction.

In the slitter device Z, as shown in FIG. (FIG. 8) and circular blade 91, and slit by circular blade 84 (FIG. 8) and circular blade 92. With such slits, a product film 200a of a predetermined width can be obtained. Further, strips 200b (hollow portions) are formed between the product films 200a.

On the other hand, laminated films for transfer such as conductive films for transfer are known. The laminated film for transfer is, for example, a temporary support film, a cured resin layer that is in peelable contact with the temporary support film, and an inorganic layer (conductive layer in the case of a conductive film for transfer) in the thickness direction. Prepare in this order. The temporary support film is considerably thicker than the cured resin layer and the inorganic layer. Such a transfer laminated film is used as a supply material for the inorganic layer. For example, a conductive film for transfer is used as a supply material for a conductive layer in the manufacturing process of a display panel. Specifically, first, the conductive layer on the cured resin layer of the conductive film for transfer is patterned. Next, the conductor layer side of the conductive film for transfer is bonded to a film-like polarizing plate (polarizing film) via an adhesive layer. Next, in the conductive film for transfer, the temporary support film is peeled off from the cured resin layer. Thereby, the cured resin layer and the conductive layer thereon are transferred to the polarizing film as a transparent conductive film without a base material. In this way, according to the conductive film for transfer, a thin transparent conductive film without a base material can be bonded to a polarizing film.

The transfer laminated film is manufactured, for example, in the roll-to-roll method as follows. First, a cured resin layer is formed on a temporary support film serving as a long and wide base film. The temporary support film is subjected to surface modification treatment in advance so that the cured resin layer can be peeled off afterwards. The cured resin layer is a base layer for the inorganic layer. Next, an inorganic layer is formed on the cured resin layer. As a result, a long and wide roll of the raw laminated film for transfer is obtained. Next, this original film is slit in the length direction to obtain a transfer laminated film of a predetermined width (slitting step).

FIG. 10 is a partially enlarged view (in the flow direction of the original film) when the above-mentioned slitter device Z is used in a conventional slitting process for a laminated film for transfer. The original laminated film for transfer 200A shown in FIG. Prepare in this order. The transfer laminated film original 200A is passed between the support roller 80 and the two-blade unit 90 with the temporary support film 201 side in contact with the support roller 80, and the circular blades 82, 84 and the circular blades 91, 92 are formed. slit by. As a result, a transfer laminated film as a product film 200a having a predetermined width is obtained. Further, strips 200b are formed between the product films 200a.

However, in such a slitting process (conventional slitting process using a two-blade type slitter device) for the transfer laminated film original 200A, chipping occurs at the cut ends of the cured resin layer 202 and inorganic layer 203 in the strip 200b. As a result, large amounts of chips (dust) are generated. The present inventors obtained such knowledge. The chips adhere to the product film 200a and cause quality defects. Moreover, the reason why chipping is likely to occur on the end face is as follows.

In the original laminated film for transfer 200A, the cured resin layer 202 and the inorganic layer 203 on the temporary support film 201 are designed to be easily peeled off from the temporary support film 201. Since the cured resin layer 202 and the inorganic layer 203 are not strongly fixed to the temporary support film 201, the reinforcing effect of the temporary support film 201 on both layers is small. In the slitting process, the tip inclined surface 91b (92b) side of the circular blade 91 (92) that presses into the original transfer laminated film 200A in the thickness direction H, as shown in FIG. The higher the position, the greater the amount of material deformation in the plane direction. That is, the cured resin layer 202 and the inorganic layer 203 are rubbed by the tip inclined surface 91b (92b) of the circular blade 91 (92) while receiving a relatively large stress in the surface direction. Therefore, chipping is likely to occur at the cut ends of the cured resin layer 202 and the inorganic layer 203 in the strip 200b.

The present invention provides a method for ensuring good cut edges of the cured resin layer and the inorganic layer while reducing chips in a slit of a laminated film material having a temporary support film, a cured resin layer, and an inorganic layer in this order. To provide a method for manufacturing a laminated film suitable for.

The present invention [1] provides a method for preparing a laminated film, which includes a preparation step of preparing a long laminated film raw material, and a slitting step of slitting the laminated film raw material in the length direction using a slitter device to obtain a laminated film. In the manufacturing method, the slitter device includes a bladed support roller and a two-blade unit, and the bladed support roller includes a first roller portion, a first circular blade, a spacer, and a second circular blade unit. A blade and a second roller portion are provided in this order in a first direction, and are rotatable around a first rotation axis extending in the first direction, and the first circular blade is provided with a first gap in the spacer. The second circular blade is a single blade having a blade back surface facing the spacer through a second gap, and the two-blade unit is a single blade having a blade back surface facing the spacer through a second gap. a second rotation axis extending in the first direction, comprising a third circular blade that slits the film in cooperation with the circular blade; and a fourth circular blade that slits the film in cooperation with the second circular blade; the third circular blade is a single-edged blade having a cutting edge that enters the first cavity, and a single-edged blade having a back surface facing the first circular blade side in the first direction; The fourth circular blade is a single-edged blade having a cutting edge that enters the second cavity, and is a single-edged blade having a back surface facing the second circular blade in the first direction, and The separation distance between the cutting edge of the third circular blade and the cutting edge of the fourth circular blade is 5 mm or more and 20 mm or less, and the laminated film original is in contact with the temporary support film in a peelable manner with respect to the temporary support film. A cured resin layer and an inorganic layer are provided in this order in the thickness direction, and in the slitting step, the side of the laminated film original fabric opposite to the inorganic layer is connected to the first roller part and the second roller part. By rotating the bladed support roller in a state of contact and sending the laminated film raw fabric in the length direction, the laminated film raw fabric is slit between the first and third circular blades, The method includes a method for manufacturing a laminated film in which slitting is performed between the second and fourth circular blades.

The present invention [2] includes the method for producing a laminated film according to the above [1], wherein the cured resin layer has a thickness of 1 μm or more and 3 μm or less.

The present invention [3] provides the production of the laminated film according to the above [1] or [2], wherein the surface of the temporary support film on the cured resin layer side has a surface free energy of 20 mN/m or more and 40 mN/m or less. Including methods.

The present invention [4] provides the production of the laminated film according to any one of [1] to [3] above, wherein the peel strength between the temporary support film and the cured resin layer is 1 N/24 mm or less. Including methods.

The present invention [5] provides the above-mentioned [1] to [4], wherein the hardness of the surface of the cured resin layer on the inorganic layer side at 25°C measured by a nanoindentation method is 0.3 GPa or more. ] The method for producing a laminated film according to any one of the above is included.

In the present invention [6], the outer circumferential surface of the first roller part and the outer circumferential surface of the first circular blade are flush with each other, and the outer circumferential surface of the second roller part and the outer circumferential surface of the second circular blade are flush with each other. includes the method for producing a laminated film according to any one of [1] to [5] above, in which the film is flush.

In the slitting step of the method for producing a laminated film of the present invention, as described above, the laminated film original fabric (including the temporary support film, the cured resin layer, and the inorganic layer) is slit by the two-blade unit having two single blades. do. Therefore, this manufacturing method is suitable for ensuring good cut edges of the cured resin layer and the inorganic layer while suppressing ridges in the laminated film after slitting.

In addition, in the slitting process, as described above, the raw laminated film is sent in the length direction with the side of the raw laminated film opposite to the inorganic layer in contact with the first roller part and the second roller part. Slitting is performed between the first and third circular blades while slitting is performed between the second and fourth circular blades. As a result, a laminated film is obtained as a product film having a predetermined width, and strips are formed between the laminated films. In this slitting process, the laminated film material is slit using a longer slitter device in which the separation distance between the cutting edges of the third and fourth circular blades in the two-blade unit is 5 mm or more than in the conventional slitting process described above. . Such a slitting process is suitable for reducing the stress acting in the plane direction on the cured resin layer and the inorganic layer in the strip, and is therefore effective in suppressing the occurrence of chips at the cut ends of both layers. Suitable. By suppressing chipping at the cut end, the amount of chips is reduced.

As described above, the method for producing a laminated film for transfer according to the present invention can reduce the amount of chips while reducing the amount of the cured resin layer in the slit of the original laminated film having the temporary support film, the cured resin layer, and the inorganic layer in this order. and suitable for ensuring a good cut edge of the inorganic layer.

It is a process diagram of one embodiment of the laminated film manufacturing method of this invention. It is a cross-sectional schematic diagram of an example of a laminated film. An example of a method for manufacturing the laminated film shown in FIG. 2 is shown. FIG. 3A shows a cured resin layer forming process, FIG. 3B shows an inorganic layer forming process, and FIG. 3C shows a protective film laminating process. 1 shows a slitter device used in an embodiment of the laminated film manufacturing method of the present invention. FIG. 5 is a partially enlarged view of the slitter device shown in FIG. 4 (in the flow direction of the original film). 5 is a partially enlarged view (in the width direction of the original film) of the slitter device shown in FIG. 4. FIG. The slitting process in one embodiment of the laminated film manufacturing method of the present invention is shown. An example of a slitter device including a two-blade unit is shown. The slitting process by the slitter apparatus shown in FIG. 8 is shown. 9 is a partially enlarged view (in the flow direction of the original film) of the slitting process using the slitter device shown in FIG. 8. FIG. 9 is a partially enlarged view (in the width direction of the original film) of the slitting process using the slitter device shown in FIG. 8. FIG. 1 is a microscopic observation image of a cut end of a strip produced by the manufacturing method of Example 1. 2 is a microscopic observation image of a cut end of a strip produced by the manufacturing method of Comparative Example 1.

An embodiment of the method for manufacturing a laminated film (method for manufacturing a laminated film) of the present invention includes a preparation step S1 and a slitting step S2, as shown in FIG. In the preparation step S1, a long laminated film original fabric F (shown in FIG. 2) is prepared. In the slitting step S2, the laminated film raw fabric F is slit in the length direction by a slitter device X (shown in FIG. 4) to obtain a laminated film 100 (shown in FIG. 7).

As shown in FIG. 2, the laminated film original fabric F includes a temporary support film 110, a cured resin layer 120, and an inorganic layer 130 in this order in the thickness direction H. Moreover, the laminated film raw fabric F has a sheet shape that spreads in a direction (plane direction) orthogonal to the thickness direction H. The temporary support film 110 has a first surface 111 and a second surface 112 opposite to the first surface 111. Cured resin layer 120 is placed on first surface 111 . The cured resin layer 120 is in contact with the temporary support film 110 in a peelable manner. Examples of the cured resin layer 120 include a hard coat layer and a refractive index adjustment layer. The cured resin layer 120 may be a composite functional layer that serves as both a hard coat layer and a refractive index adjusting layer. In this embodiment, the inorganic layer 130 is fixed to the cured resin layer 120 in contact with the cured resin layer 120. Such a laminated film original fabric F is an original fabric of a transfer laminated film for transferring the cured resin layer 120 and the inorganic layer 130 from the temporary support film 110 to another object. Examples of the laminated film for transfer include a conductive film for transfer (in this case, the inorganic layer 130 is a conductive layer). The conductive film for transfer is used, for example, as a supply material for a conductive layer in the manufacturing process of a display panel. Such a laminated film original fabric F can be prepared, for example, by producing as follows.

First, as shown in FIG. 3A, a cured resin layer 120 is formed on the first surface 111 of the temporary support film 110. As a result, a temporary support film 110 with a cured resin layer 120 is obtained.

The temporary support film 110 has an elongated shape so that the laminated film original fabric F can be manufactured by a roll-to-roll method. The temporary support film 110 is, for example, a flexible resin film. Examples of the material for the temporary support film 110 include polyester resin, polyolefin resin, acrylic resin, polycarbonate resin, and polystyrene resin. Examples of polyester resins include polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate. Polyolefin resins include, for example, polyethylene, polypropylene, and cycloolefin polymer (COP). Examples of the acrylic resin include polymethacrylate. From the viewpoint of balance between flexibility and strength, the material for the temporary support film 110 is preferably at least one selected from the group consisting of polyester resin and polyolefin resin, more preferably PET and COP. At least one selected from the group consisting of:

The thickness of the temporary support film 110 is preferably 10 μm or more, more preferably 30 μm or more, and even more preferably 50 μm or more, from the viewpoint of ensuring ease of handling of the laminated film raw fabric F to be manufactured. The thickness of the temporary support film 110 is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less, from the viewpoint of making the laminated film raw fabric F thinner.

The surface free energy of the first surface 111 of the temporary support film 110 is preferably 20 mN/m or more, and more It is preferably 25 mN/m or more, more preferably 28 mN/m or more, and preferably 40 mN/m or less, more preferably 35 mN/m or less, and still more preferably 32 mN/m or less. Surface free energy is measured by the method described below with respect to the Examples.

The first surface 111 of the temporary support film 110 may be subjected to a peeling treatment. Through the peeling process, the peel strength between the temporary support film 110 and the cured resin layer 120 can be adjusted. Examples of the release agent for release treatment include a release agent containing silicone resin, a release agent containing long-chain alkyl resin, and a release agent containing fatty acid amide resin.

The peel strength between the temporary support film 110 and the cured resin layer 120 is preferably 1N from the viewpoint of ensuring peelability (ease of peeling during peeling) between the temporary support film 110 and the cured resin layer 120. /24mm or less, more preferably 0.7N/24mm or less, further preferably 0.5N/24mm or less, particularly preferably 0.3N/24mm or less. The peel strength between the temporary support film 110 and the cured resin layer 120 is preferably 0.05 N/24 mm or more, more preferably 0.05 N/24 mm or more, from the viewpoint of ensuring temporary fixation of the cured resin layer 120 to the temporary support film 110. It is 1N/24mm or more, more preferably 0.2N/24mm or more. Peel strength can be measured by the method described below in connection with the Examples.

The cured resin layer 120 can be formed by applying a curable resin composition (varnish) onto the first surface 111 to form a coating film, and then drying and curing the coating film. The curable resin composition contains a curable resin and a solvent. The cured resin layer 120 is a cured product of a curable resin composition (specifically, a curable resin).

Examples of the curable resin include polyester resin, acrylic resin, urethane resin, acrylic urethane resin, amide resin, silicone resin, epoxy resin, and melamine resin. These curable resins may be used alone or in combination of two or more. From the viewpoint of ensuring the light transmittance and hardness of the cured resin layer 120, acrylic resin is preferably used as the curable resin.

Furthermore, examples of the curable resin include ultraviolet curable resins and thermosetting resins. When the curable resin composition contains an ultraviolet curable resin, the coating film is cured by ultraviolet irradiation. When the curable resin composition contains a thermosetting resin, the coating film is cured by heating. Preferably, an ultraviolet curable resin is used as the curable resin, since it can be cured without high-temperature heating and is useful for improving the production efficiency of the laminated film raw fabric F. The ultraviolet curable resin includes at least one type selected from the group consisting of an ultraviolet curable monomer, an ultraviolet curable oligomer, and an ultraviolet curable polymer. A specific example of a composition containing an ultraviolet curable resin includes a composition for forming a hard coat layer described in JP-A-2016-179686.

Examples of the solvent contained in the curable resin composition include ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, methyl isobutyl ketone, benzene, toluene, xylene, methanol, ethanol, isopropanol, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether Includes acetate, dichloromethane, and chloroform.

The curable resin composition may contain fine particles. The blending of fine particles into the curable resin composition is useful for adjusting the hardness, surface roughness, refractive index, and imparting anti-glare properties to the cured resin layer 120. Examples of fine particles include inorganic particles and organic particles. Examples of inorganic particles include metal oxide particles and glass particles. Examples of materials for the metal oxide particles include silica, alumina, titania, zirconia, calcium oxide, tin oxide, indium oxide, cadmium oxide, and antimony oxide. Examples of the material for the organic particles include polymethyl methacrylate, polystyrene, polyurethane, acrylic-styrene copolymer, benzoguanamine, melamine, and polycarbonate.

The thickness of the cured resin layer 120 is preferably 1 μm or more, more preferably 1.5 μm or more, from the viewpoint of ensuring releasability of the cured resin layer 120 from the temporary support film 110. The thickness of the cured resin layer 120 is preferably 3 μm or less, more preferably 2.5 μm or less, still more preferably 2 μm or less, from the viewpoint of suppressing the occurrence of cracks in the cured resin layer 120 in the slitting step S2 described below. The thickness is preferably 1.7 μm or less, particularly preferably 1.5 μm.

The hardness of the surface (surface 121) on the inorganic layer 130 side of the cured resin layer 120 at 25° C. measured by the nanoindentation method is preferably from the viewpoint of suppressing damage to the inorganic layer 130 after transfer. is 0.3 GPa or more, more preferably 0.4 GPa or more, even more preferably 0.5 GPa or more. The hardness of the surface 121 at 25° C. measured by the nanoindentation method ensures the flexibility of the cured resin layer 120, improves the handleability of the laminated film original F, and the resistance of the cured resin layer 120 to cracking. From the viewpoint of ensuring this, it is preferably 1.2 GPa or less, more preferably 1.0 GPa or less, and even more preferably 0.8 GPa or less. Examples of methods for adjusting the hardness of the surface 121 of the cured resin layer 120 include adjusting the amount of inorganic particles blended in the cured resin layer 120 and adjusting the curing conditions.

Nanoindentation is a technology that measures various physical properties of a sample on a nanometer scale. In this embodiment, the nanoindentation method is performed in accordance with ISO14577. In the nanoindentation method, the process of pushing an indenter into a sample set on a stage (load application process) and the process of pulling out the indenter from the sample (unloading process) are carried out. The load acting between the indenter and the sample and the relative displacement of the indenter with respect to the sample are measured (load-displacement measurement). This makes it possible to obtain a load-displacement curve. From this load-displacement curve, it is possible to determine the physical properties of the measurement sample, such as elastic modulus and hardness based on nanometer scale measurements. To measure the load-displacement on the surface of the cured resin layer 120 by the nanoindentation method, for example, a nanoindenter (trade name "Triboindenter", manufactured by Hysitron) can be used. In the measurement, the measurement mode was single indentation measurement, the measurement temperature was 25°C, the indenter used was a Berkovich (triangular pyramid) type diamond indenter, and the maximum indentation depth of the indenter into the measurement sample during the load application process (maximum The displacement H1) is 20 nm, the indentation speed of the indenter is 2 nm/sec, and the withdrawal speed of the indenter from the measurement sample during the unloading process is 2 nm/sec. Based on the load-displacement curve obtained by this measurement, for example, the maximum load Pmax (the load acting on the indenter at the maximum displacement H1), the projected contact area Ap (the projection of the contact area between the indenter and the sample at the maximum load), area), contact stiffness S (the slope of the tangent to the load-displacement curve (unloading curve) at the start of the unloading process), and the amount of plastic deformation H2 on the sample surface after the unloading process (the slope when the indenter is removed from the sample surface). The depth of the recess that is later maintained on the sample surface) can be obtained. Then, the hardness of the sample surface (=Pmax/Ap) can be calculated from the maximum load Pmax and the projected contact area Ap.

The surface 121 of the cured resin layer 120 (the surface on which the inorganic layer 130 is laminated) is subjected to a surface modification treatment if necessary. Examples of surface modification treatments include plasma treatment, corona treatment, and ozone treatment. From the viewpoint of ensuring high adhesion between the cured resin layer 120 and the inorganic layer 130, the surface 121 is preferably subjected to plasma treatment. When the surface 121 is subjected to plasma treatment, for example, argon gas is used as an inert gas in the plasma treatment. Further, the discharge power in the plasma treatment is, for example, 10 W or more and, for example, 10,000 W or less.

Next, as shown in FIG. 3B, an inorganic layer 130 is formed on the cured resin layer 120. Specifically, a material is formed into a film on the cured resin layer 120 in the temporary support film 110 (work film) with the cured resin layer 120 by sputtering, for example, to form the inorganic layer 130. The inorganic layer 130 thus formed is a sputtered film.

In the sputtering method of this step, for example, a sputter film-forming apparatus that can perform a film-forming process in a roll-to-roll manner is used. Specifically, in the sputtering method, a sputtering gas (inert gas) is introduced under vacuum conditions into a film forming chamber equipped with a sputter film forming apparatus, and a negative voltage is applied to a target placed on a cathode in the film forming chamber. Apply. As a result, a glow discharge is generated to ionize gas atoms, the gas ions are made to collide with the target surface at high speed, the target material is ejected from the target surface, and the ejected target material is transferred to the temporary support film with the cured resin layer 120. The cured resin layer 120 at 110 is deposited on top of the cured resin layer 120 .

Examples of the material of the target placed on the cathode in the film forming chamber (that is, the material of the inorganic layer 130) include metals and conductive oxides. Examples of metals include copper, silver, and alloys thereof. The conductive oxide is, for example, at least one metal selected from the group consisting of In, Sn, Zn, Ga, Sb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W. Alternatively, a metal oxide containing a metalloid may be mentioned. Specifically, the conductive oxide includes an indium-containing conductive oxide and an antimony-containing conductive oxide. Examples of indium-containing conductive oxides include indium tin composite oxide (ITO), indium zinc composite oxide (IZO), indium gallium composite oxide (IGO), and indium gallium zinc composite oxide (IGZO). It will be done.

The atmospheric pressure inside the film formation chamber during film formation by sputtering (sputter film formation) is, for example, 0.02 Pa or more and, for example, 1 Pa or less.

Examples of power sources for applying voltage to the target include DC power sources, AC power sources, MF power sources, and RF power sources. As the power source, a DC power source and an RF power source may be used together. The absolute value of the discharge voltage during sputter film formation is, for example, 50V or more and, for example, 500V or less.

In the manner described above, the laminated film raw fabric F can be manufactured. The laminated film original fabric F includes a temporary support film 110, a cured resin layer 120, and an inorganic layer 130 in this order in the thickness direction H. The cured resin layer 120 and the inorganic layer 130 form a substrate-less transparent conductive film 100. That is, in the laminated film original fabric F, the transparent conductive film 100 without a base material is temporarily supported by the temporary support film 110.

A protective film 140 for protecting the laminated film raw fabric F may be bonded to the second surface 112 of the temporary support film 110 of the laminated film raw fabric F, as shown in FIG. 3C. The protective film 140 is, for example, a film with a single-sided adhesive layer that includes a base film and an adhesive layer (not shown) on the base film, and is bonded to the second surface 112 on the adhesive layer side. . The base film is, for example, a flexible resin film. Examples of the material for the base film include the materials described above as the material for the temporary support film 110. The thickness of the base film is, for example, 10 μm or more, preferably 25 μm or more, and is, for example, 200 μm or less, preferably 150 μm or less. The adhesive layer contains a base polymer that exhibits adhesiveness. Examples of the base polymer include acrylic polymers, rubber-based polymers, polyester-based polymers, urethane-based polymers, polyether-based polymers, silicone-based polymers, polyamide-based polymers, and fluorine-based polymers. The thickness of the adhesive layer is, for example, 5 μm or more, preferably 10 μm or more, and, for example, 100 μm or less, preferably 75 μm or less.

As shown in FIG. 4, the slitter device X includes a support roller 10 (a support roller with blades) and a two-blade unit 20. In this embodiment, the slitter device X includes two two-blade units 20A and 20B.

In this embodiment, the support roller 10 includes a roller portion 11 (11A), a circular blade 12 (12A), a spacer 13 (13A), a circular blade 14 (14A), a roller portion 11 (11B), and a circular blade 12 (12A). The blade 12 (12B), the spacer 13 (13B), the circular blade 14 (14B), and the roller portion 11 (11C) are provided in this order in the first direction D1. The roller portion 11 (11A, 11B, 11C), the circular blade 12 (12A, 12B), the spacer 13 (13A, 13B), and the circular blade 14 (14A, 14B) are attached to the rotation axis 15 that the slitter device X further includes. It is being The rotation axis 15 is rotatable around a first rotation axis A1 extending in the first direction D1. As the rotation axis 15 rotates around the first rotation axis A1, the roller portion 11, the circular blade 12, the spacer 13, and the circular blade 14 rotate integrally around the first rotation axis A1. That is, the support roller 10 (roller portion 11, circular blades 12, 14, and spacer 13) is rotatable around a first rotation axis A1 extending in the first direction D1. Moreover, the roller part 11, the circular blade 12, the spacer 13, the circular blade 14, and the roller part 11 that are arranged next to each other in the first direction D1 are the first roller part, the first circular blade, the spacer, and the second circular blade in the present invention. It corresponds to the blade and the second roller part.

The roller portion 11 (11A, 11B, 11C) has a cylindrical shape. The outer diameter of the roller portion 11 is, for example, 50 to 100 mm. The length of each roller portion 11 in the first direction D1 is, for example, 200 to 500 mm, depending on the design dimensions of the laminated film 100 (shown in FIG. 7) obtained by the slitting step S2. The roller portion 11 has an outer peripheral surface 11a. The outer peripheral surfaces 11a are flush with each other. Moreover, the roller part 11 is made of metal. Examples of the material for the roller portion 11 include SKD11 (dice steel).

The circular blade 12A is arranged between the roller portion 11A and the spacer 13A. The circular blade 12B is arranged between the roller portion 11B and the spacer 13B. Each circular blade 12 (12A, 12B) is a disk-shaped single edge, and has a blade back surface 12a and an outer peripheral surface 12b. The outer diameter of the circular blade 12 is substantially the same as the outer diameter of the roller portion 11, and is, for example, 50 to 100 mm. The blade back surface 12a faces the adjacent spacer 13 via the gap G1. The length of the gap G1 in the first direction D1 is preferably 1.3 mm or more, more preferably 1.5 mm or more, from the viewpoint of suppressing the ridges of the cut workpiece and ensuring the appearance quality (gap G2 described below). The same applies to The length of the gap G1 in the first direction D1 is preferably 10 mm or less, more preferably 5 mm or less, from the viewpoint of ensuring the effective width of the product in the original fabric (the same applies to the gap G2 described below). The circular blade 12 contacts the adjacent roller portion 11 on the side opposite to the blade back surface 12a. The blade back surface 12a and the outer peripheral surface 12b form an acute angle or a right angle. The blade back surface 12a and the outer circumferential surface 12b preferably form a right angle (the case where they form a right angle is illustrated) from the viewpoint of appropriately guiding the laminated film raw fabric F (object to be slit) by the support roller 10. That is, the outer circumferential surface 12b of the circular blade 12 is preferably flush with the outer circumferential surface 11a of the roller portion 11. When the blade back surface 12a and the outer peripheral surface 12b form an acute angle, the acute angle is preferably 45° or more, more preferably 60° or more, still more preferably 75° or more, and particularly preferably 80° or more, Further, for example, the angle is less than 90°. The circular blade 12 has an edge (cutting edge) at the boundary between the blade back surface 12a and the outer peripheral surface 12b. Further, the circular blade 12 is made of metal. Examples of the material for the circular blade 12 include SKD11 (dice steel).

The spacer 13A is arranged between the circular blade 12A and the circular blade 14A. Spacer 13B is arranged between circular blade 12B and circular blade 14B. Each spacer 13 (13A, 13B) has a disk shape. Spacer 13 has an outer peripheral surface 13a. From the viewpoint of appropriately guiding the laminated film original fabric F (object to be slit) by the support roller 10, preferably, the outer diameter of the spacer 13 is substantially the same as the outer diameter of the roller part 11, and the outer diameter of the roller part 11 is preferably The surface 11a and the outer peripheral surface 13a of the spacer 13 are flush with each other. The length of each spacer 13 in the first direction D1 is smaller than the distance between adjacent circular blades 21 and 22, which will be described later, and is, for example, 1 to 10 mm. Further, the spacer 13 is made of metal. Examples of the material of the spacer 13 include SKD11 (dice steel).

The circular blade 14A is arranged between the spacer 13A and the roller portion 11B. The circular blade 14B is arranged between the roller part 11B and the spacer 13B. Each circular blade 14 (14A, 14B) is a disk-shaped single edge, and has a blade back surface 14a and an outer peripheral surface 14b. The outer diameter of the circular blade 14 is substantially the same as the outer diameter of the roller portion 11, and is, for example, 50 to 100 mm. The blade back surface 14a faces the adjacent spacer 13 via the gap G2. The circular blade 14 contacts the adjacent roller portion 11 on the side opposite to the blade back surface 14a. The blade back surface 14a and the outer peripheral surface 14b form an acute angle or a right angle. The blade back surface 14a and the outer circumferential surface 14b preferably form a right angle (the case where they form a right angle is illustrated) from the viewpoint of appropriately guiding the laminated film raw fabric F (object to be slit) by the support roller 10. That is, the outer circumferential surface 14b of the circular blade 14 is preferably flush with the outer circumferential surface 11a of the roller portion 11. When the blade back surface 14a and the outer circumferential surface 14b form an acute angle, the angle of the acute angle is preferably 45° or more, more preferably 60° or more, still more preferably 75° or more, particularly preferably 80° or more, Further, for example, the angle is less than 90°. The circular blade 14 has an edge (cutting edge) at the boundary between the blade back surface 14a and the outer peripheral surface 14b. Further, the circular blade 14 is made of metal. Examples of the material for the circular blade 14 include SKD11 (dice steel).

In the support roller 10, the above-mentioned outer peripheral surfaces 11a, 12b, 13a, and 14b are flush with each other from the viewpoint of appropriately guiding the laminated film original fabric F (object to be slit) by the support roller 10.

Each two-blade unit 20 (20A, 20B) includes a circular blade 21 (third circular blade) and a circular blade 22 (fourth circular blade). The circular blades 21 and 22 are spaced apart in the first direction D1. The two-blade unit 20A is arranged corresponding to the circular blades 12A and 14A on the support roller 10. Specifically, the circular blades 12A, 21 can work together to slit the film by interference of their cutting edges, and the circular blades 14A, 22 can work together to slit the film by interference of their cutting edges. , the two-blade unit 20A is arranged with respect to the support roller 10. The two-blade unit 20B is arranged corresponding to the circular blades 12B and 14B on the support roller 10. Specifically, the circular blades 12B and 21 can work together to slit the film by interference of their cutting edges, and the circular blades 14B and 22 can work together to slit the film by interference of their cutting edges. , the two-blade unit 20B is arranged with respect to the support roller 10. Such two-blade units 20A, 20B are separated from each other in the first direction D1. Each two-blade unit 20 is attached to a rotation axis 25 that the slitter device X further includes. The rotation axis 25 is rotatable around a second rotation axis A2 extending in the first direction D1. The second rotation axis A2 and the above-mentioned first rotation axis A1 are parallel to each other and are separated from each other in a second direction D2 that is orthogonal to the first direction D1. As the rotation axis 25 rotates around the second rotation axis A2, the two-blade units 20A, 20B rotate integrally around the second rotation axis A2. That is, the two-blade units 20A and 20B are rotatable around a second rotation axis A2 extending in the first direction D1.

The circular blade 21 is a disk-shaped single blade, and has a blade back surface 21a, a tip inclined surface 21b, and a cutting edge 21e. The blade back surface 21a faces the circular blade 12 side in the first direction D1. The blade back surface 21a and the tip inclined surface 21b form an acute angle. The acute angle is preferably 30° or more, more preferably 45° or more, and still more preferably 50° or more, from the viewpoint of forming a good cut edge at the cutting location in the laminated film raw fabric F, and The angle is preferably 80° or less, more preferably 70° or less, and still more preferably 60° or less. The cutting edge 21e is an edge formed at the boundary between the blade back surface 21a and the tip inclined surface 21b. The cutting edge 21e enters the gap G1 (between the circular blade 12 and the spacer 13). The outer diameter of such a circular blade 21 is, for example, 50 to 150 mm. The length of the circular blade 21 in the first direction D1 (the thickness of the circular blade 21) is, for example, 1 to 3 mm. The thickness of the circular blade 21 is preferably smaller than the length of the gap G1 in the first direction D1. Further, the circular blade 21 is made of metal, and examples of the material for the circular blade 21 include SKH2 (high speed steel) (the same applies to the circular blade 22 described later).

The circular blade 22 is a disk-shaped single blade, and has a blade back surface 22a, a tip inclined surface 22b, and a cutting edge 22e. The blade back surface 22a faces the circular blade 14 side in the first direction D1. That is, the blade back surfaces 21a, 22a of the circular blades 21, 22 face opposite sides in the first direction D1. The blade back surface 22a and the tip inclined surface 22b form an acute angle. The acute angle is preferably 30° or more, more preferably 45° or more, and still more preferably 50° or more, from the viewpoint of forming a good cut edge at the cutting location in the laminated film raw fabric F, and The angle is preferably 80° or less, more preferably 70° or less, and still more preferably 60° or less. The cutting edge 22e is an edge formed at the boundary between the blade back surface 22a and the tip inclined surface 22b. The cutting edge 22e enters the gap G2 (between the spacer 13 and the circular blade 14). The outer diameter of such a circular blade 22 is substantially the same as the outer diameter of the circular blade 21, and is, for example, 50 to 150 mm. The length of the circular blade 22 in the first direction D1 (thickness of the circular blade 22) is, for example, 1 to 3 mm. The thickness of the circular blade 22 is preferably smaller than the length of the gap G2 in the first direction D1.

In the two-blade unit 20, the separation distance d in the first direction D1 between the cutting edge 21e of the circular blade 21 and the cutting edge 22e of the circular blade 22 reduces stress acting in the planar direction on the strip 100', which will be described later. From the viewpoint of this, the length is 5 mm or more, preferably 7 mm or more, and more preferably 9 mm or more. The separation distance d is 20 mm or less, preferably 15 mm or less, and more preferably 12 mm or less, from the viewpoint of ensuring the effective width of the product in the original fabric.

In the slitting step S2, the laminated film original fabric F is slit using the slitter device X as described above. Specifically, it is as follows.

A long roll-shaped laminated film raw fabric F is attached in advance to a feeding roller (not shown). The laminated film raw fabric F is fed out from the roll of the laminated film raw fabric F toward between the support roller 10 and the two-blade unit 20 in the slitter device X. The unwinding tension (tension per unit length in the film width direction) of the laminated film original fabric F is, for example, 40 to 200 N/m.

As shown in FIG. 5, in the slitter device Then, the laminated film original F is fed in the length direction. The support roller 10 can be rotationally driven by applying a driving force to the rotation axis 15 from the outside. The two-blade units 20A and 20B rotate following the rotational drive of the support roller 10. Thereby, the laminated film original fabric F is slit between the circular blades 12 and 21 and between the circular blades 14 and 22. Specifically, the laminated film raw fabric F is slit between the circular blade 12A and the circular blade 21 of the two-blade unit 20A, and between the circular blade 14A and the circular blade 22 of the two-blade unit 20A. Then, slitting is performed between the circular blade 12B and the circular blade 21 of the two-blade unit 20B, and slitting is performed between the circular blade 14B and the circular blade 22 of the two-blade unit 20B.

By slitting the laminated film original fabric F in the slitting step S2, as shown in FIG. 7, a laminated film 100 as a product film having a predetermined width is obtained. Further, strips 100' (hollow portions) are formed between the laminated films 100 (product films). The strip 100' is formed between the circular blades 12A, 21 and 14A, 22 and between the circular blades 12B, 21 and 14B, 22 in the slitting step S2. Laminated film 100 and strip 100' are wound onto a take-up roller (not shown). The winding tension (tension per unit length in the width direction of the film) of the film by the winding roller is, for example, 20 to 320 N/m.

The traveling speed of the laminated film original fabric F in this step is preferably 7 m/min or more, more preferably 10 m/min or more from the viewpoint of production efficiency. The running speed of the laminated film original F is preferably 15 m/min or less, more preferably 12 m/min or less, from the viewpoint of ensuring the appearance quality of the cut product.

The laminated film 100 can be manufactured as described above. The laminated film 100 includes a temporary support film 110, a cured resin layer 120, and an inorganic layer 130 in this order in the thickness direction H. When the laminated film original fabric F (FIG. 1C) in which the protective film 140 is bonded to the second surface 112 of the temporary support film 110 is used, the manufactured laminated film 100 includes the protective film 140, the temporary support film 110, A cured resin layer 120 and an inorganic layer 130 are provided in this order in the thickness direction H. The laminated film 100 has a shape that spreads in a direction (plane direction) perpendicular to the thickness direction H.

In the slitting step S2, as described above, the laminated film original fabric F (temporary support film 110, cured resin layer 120, and inorganic layer 130) is cut by the two-blade unit 20 having two circular blades 21 and 22 (single-blade). slitting). Therefore, this manufacturing method is suitable for ensuring good cut edges of the cured resin layer 120 and the inorganic layer 130 while suppressing ridges in the laminated film 100 after slitting.

In addition, in the slitting step S2, as described above, the laminated film raw fabric F is lengthened with the side opposite to the inorganic layer 130 in contact with the roller portion 11 (11A, 11B, 11C). It is fed in the horizontal direction and slit between the circular blades 12 and 21 while slitting between the circular blades 14 and 22. In such a slitting process S2, the slitter device X is longer than the conventional slitting process described above, with the separation distance d between the cutting edges 21e and 22e of the circular blades 21 and 22 in the two-blade unit 20 being 5 mm or more, The laminated film original fabric F is slit. Such slitting step S2 is suitable for reducing the stress acting in the planar direction on the cured resin layer 120 and the inorganic layer 130 in the strip 100', and therefore prevents chipping from occurring at the cut ends of both layers. suitable for suppressing Chips are reduced by suppressing chipping at the cut end.

As described above, in the method for manufacturing a laminated film, in the slit of the laminated film raw fabric F having the temporary support film 110, the cured resin layer 120, and the inorganic layer 130 in this order, the cured resin layer 120 is removed while reducing chips. And it is suitable for ensuring a good cut edge of the inorganic layer 130.

The present invention will be specifically described below with reference to Examples. However, the present invention is not limited to the examples. In addition, the specific numerical values such as the blending amount (content), physical property values, and parameters described below are the corresponding blending amounts (content) described in the above-mentioned "Detailed Description". content), physical property values, parameters, etc. can be replaced by an upper limit (a numerical value defined as "less than" or "less than") or a lower limit (a numerical value defined as "more than" or "more than").

[Example 1]
A laminated film was manufactured by performing a laminated film original preparation process and a slitting process as described below.

<Preparation process of laminated film base>
First, a long polyethylene terephthalate (PET) film (product name "Panapeel TP-01", thickness 50 μm, manufactured by Panac Corporation) whose surface had been subjected to a peeling treatment was prepared as a temporary support film (first step).

Next, a cured resin layer was formed on the temporary support film (second step). Specifically, first, a resin composition as a curable resin composition was applied onto one surface (first surface) of the temporary support film using a gravure coater to form a coating film. The resin composition is a mixture of 100 parts by mass of an ultraviolet curable resin composition (product name "TYZ72-A12", manufactured by Toyo Chem Co., Ltd.) and 3 parts by mass of a leveling agent (product name "Grandic PC4100", manufactured by DIC Corporation). It is. Next, the coating film on the temporary support film was dried by heating and then cured by UV irradiation. The heating temperature was 80°C, and the heating time was 60 seconds. For ultraviolet irradiation, a high-pressure mercury lamp was used as a light source, ultraviolet rays with a wavelength of 365 nm were used, and the cumulative amount of irradiation light was 230 mJ/cm ² . As described above, a cured resin layer with a thickness of 1 μm was formed on the temporary support film.

Next, a Cu layer as an inorganic layer was formed on the cured resin layer (third step). Specifically, a Cu layer with a thickness of 200 nm was formed on the cured resin layer of the temporary support film with a cured resin layer by a sputtering method. In the sputtering method, a roll-to-roll type sputtering film forming apparatus (winding type DC magnetron sputtering apparatus) was used. The sputter film-forming apparatus includes a film-forming chamber that can carry out a film-forming process while running a temporary support film with a cured resin layer in a roll-to-roll manner. The conditions for sputtering film formation are as follows.

After the film forming chamber of the sputter film forming apparatus was evacuated, Ar as a sputtering gas was introduced into the film forming chamber, and the atmospheric pressure inside the film forming chamber was set to 0.4 Pa. The flow rate of argon gas was 300 sccm. A copper target was used as the target. A DC power source was used as a power source for applying voltage to the target. The discharge voltage was 250V.

Next, a protective film was bonded to the other surface (second surface) of the temporary support film using a roll-to-roll bonding machine (fourth step). The protective film includes a base film (product name "Diafoil T100C38", thickness 38 μm, manufactured by Mitsubishi Chemical Corporation) and an acrylic adhesive layer (thickness 23 μm). The acrylic adhesive layer is formed on one side of the base film. In this step, the acrylic adhesive layer side of the protective film was bonded to the second surface of the temporary support film. As a result, a long laminated film original fabric was obtained. The laminated film original fabric includes a protective film, a temporary support film, a cured resin layer, and a Cu layer as an inorganic layer in this order in the thickness direction.

<Slitting process of laminated film base>
The above laminated film original was slit using a slitter device. As the slitter device, a slitter device X (equipped with a support roller 10 and a two-blade unit 20) shown in FIG. 4 was used. Each blade angle (acute angle formed by the blade back surface and the tip inclined surface) of the circular blades 21 and 22 of the two-blade unit 20 in the slitter device X was 60°. The separation distance d in the first direction D1 between the cutting edge 21e of the circular blade 21 and the cutting edge 22e of the circular blade 22 was 10 mm. In this step, a long roll-shaped laminated film original was attached to a feeding roller in advance. Then, the laminated film raw fabric was fed out from the roll of the laminated film raw fabric toward between the support roller 10 and the two-blade unit 20 in the slitter device X. The unwinding tension of the laminated film material was 80 N/m. In the slitter device X, the support roller 10 was driven to rotate with the side opposite to the Cu layer of the laminated film original in contact with the roller portion 11 and the spacer 13 of the support roller 10 to send the laminated film original in the length direction. . The running speed of the original laminated film was 15 m/min. Thereby, the laminated film original fabric was slit between the circular blades 12 and 21 of the support roller 10 and the two-blade unit 20, and between the circular blades 14 and 22. In this way, the laminated film of Example 1 was manufactured. The laminated film was wound up using a winding roller. The winding tension of the film by the winding roller was 160 N/m.

[Comparative example 1]
A preparation step and a slitting step were carried out in the same manner as in Example 1 except for the following, and a laminated film of Comparative Example 1 was manufactured. In the slitting process, the same slitter device as the slitter device X used in Example 1 was used, except that the distance between the cutting edges of the two circular blades of the two-blade unit was 4 mm.

<Observation of cut end>
The cut ends of the strips (hollow portions) produced in each slitting process of Example 1 and Comparative Example 1 were observed. Specifically, the cut end of the strip was observed from the inorganic layer (Cu layer) side of the strip in camera mode using a laser microscope (product name "VK-X1000", manufactured by Keyence). Observed images are shown in FIG. 12 (Example 1) and FIG. 13 (Comparative Example 1). The observed image in FIG. 12 is an image obtained by observing the strip 100' (hollowed portion) shown in FIG. 6 from above in the figure after the slitting process. In FIG. 12, the plan view image (bright part) of the inorganic layer is located on the right side of the observed image. The observed image in FIG. 13 is an image obtained by observing the strip 200b (hollow portion) shown in FIG. 11 from above in the figure after the slitting process. In FIG. 13, the plan view image (bright part) of the inorganic layer is located on the right side of the observed image.

As shown in the observation image of FIG. 12, at the cut end of the strip in Example 1, no chipping occurred in the cured resin layer and the inorganic layer (Cu layer). Therefore, in the slitting process in Example 1, generation of chips was suppressed. On the other hand, as shown in the observation image of FIG. 13, at the cut end of the strip in Comparative Example 1, chipping occurred in the cured resin layer and the inorganic layer (Cu layer). Therefore, in the slitting process in Comparative Example 1, a large amount of chips were generated.

<Hardness of cured resin layer>
Load-displacement measurements were performed on the surfaces of the cured resin layers (Cu side surfaces) in the laminated films of Example 1 and Comparative Example 1 using the nanoindentation method. Specifically, first, a measurement sample (10 mm x 10 mm) was cut out from a temporary support film with a cured resin layer obtained in the process of producing a laminated film. Next, using a nanoindenter (trade name "Triboindenter", manufactured by Hysitron), load-displacement measurements on the surface of the cured resin layer in the measurement sample were performed in accordance with ISO 14577, and a load-displacement curve was obtained. In this measurement, the measurement mode was single indentation measurement, the measurement temperature was 25℃, the indenter used was a Berkovich (triangular pyramid) type diamond indenter, and the maximum indentation depth of the indenter into the measurement sample during the load application process (maximum The displacement H1) was 20 nm, the indentation speed of the indenter was 2 nm/sec, and the withdrawal speed of the indenter from the measurement sample during the unloading process was 2 nm/sec. Based on the obtained load-displacement curve, maximum load Pmax (load acting on the indenter at maximum displacement H1), projected contact area Ap (projected area of contact area between indenter and sample at maximum load), contact Stiffness S (the slope of the tangent to the load-displacement curve (unloading curve) at the start of the unloading process), and the amount of plastic deformation H2 on the sample surface after the unloading process (the slope of the sample surface after the indenter is released from the sample surface) The depth of the recess maintained at Then, the hardness (=Pmax/Ap) of the surface of the cured resin layer was calculated from the maximum load Pmax and the projected contact area Ap. Its hardness was 0.77 GPa.

<Surface free energy of temporary support film surface>
The surface free energy of the surface of the temporary support film (the surface on the cured resin layer side) in the laminated films of Example 1 and Comparative Example 1 was determined as follows.

First, under conditions of 23° C. and 55% relative humidity, water (H ₂ O), methylene iodide (CH ₂ I ₂ ) and 1- The contact angle was measured for each droplet (approximately 1 μL) of bromonaphthalene using a contact angle meter. For this measurement, a contact angle meter (product name: "CA-X type contact angle meter", manufactured by Kyowa Interface Science Co., Ltd.) was used. Next, using the measured values of the contact angle θw of water, the contact angle θi of methylene iodide, and the contact angle θb of 1-bromonaphthalene, γ ^d , γ ^p , and γ ^h in the equation γ = γ ^d + γ ^p + γ ^h were determined by solving three-dimensional simultaneous equations according to the method described in J.D.-141 (1972) (Kitazaki-Hata theory). γ ^d in the formula is the dispersive component of the surface free energy, γ ^p is the polar component of the surface free energy, and γ ^h is the hydrogen bond component of the surface free energy. Then, the value (γ) obtained by summing γ ^d , γ ^p , and γ ^h was determined as the surface free energy of the surface to be identified. Its surface free energy was 29.6 mN/m.

<Releasability>
Regarding the laminated films of Example 1 and Comparative Example 1, the peel strength between the temporary support film and the cured resin layer was examined in the following manner. in particular,

First, a sample film for a peel test was created. Specifically, first, the first to third steps described above were carried out to create a laminated film comprising a temporary support film, a cured resin layer, and an inorganic layer (Cu layer) in this order in the thickness direction. . Next, a sample film (24 mm x 100 mm) was cut out from the laminated film.

Next, a glass plate was bonded to the inorganic layer side of the sample film via a strong adhesive. In the bonding process, the sample film was pressure-bonded to the glass plate by moving a 2 kg roller back and forth once (the same applies to the bonding process described later). Next, a 24 mm x 150 mm adhesive tape was attached to the temporary support film side of the sample film on the glass plate in alignment with the sample film. The adhesive tape (24 mm x 150 mm) after this bonding has an unbonded portion (24 mm x 50 mm). Then, a test was conducted in which the temporary support film was peeled from the cured resin layer on the glass plate, and the peel strength between the temporary support film and the cured resin layer was measured. For this measurement, a tensile tester (product name: "Peeling Analyzer VPA-2", manufactured by Kyowa Kaimen Kagaku Co., Ltd.) was used. In this measurement, the peel angle was 90°, the tensile speed was 100 mm/min, and the peel force required for peeling between 20 mm and 80 mm at a peel length (length at which interfacial cleavage occurred) was measured as peel strength. As a result, the peel strength was 0.05N/24mm.

F Original film 110 Temporary support film 120 Cured resin layer 130 Inorganic layer H Thickness direction X, Z Slitter device D1 First direction D2 Second direction 10 Support roller (support roller with blades)
11, 11A, 11B Roller part 12 Circular blade (first circular blade)
12a, 14a Back side of blade 13 Spacer 14 Circular blade (second circular blade)
G1, G2 Gap A1 First rotation axis 20, 20A, 20B 2-blade unit 21 Circular blade (third circular blade)
21a, 22a Back side of blade 22 Circular blade (4th circular blade)
A2 Second rotation axis center

Claims (6)

A preparation process of preparing a long laminated film original fabric,
A slitting step of obtaining a laminated film by slitting the raw laminated film in the longitudinal direction using a slitter device, the method for producing a laminated film,
The slitter device includes a bladed support roller and a two-blade unit,
The bladed support roller includes a first roller section, a first circular blade, a spacer, a second circular blade, and a second roller section in this order in a first direction, and a first roller section extending in the first direction. It can rotate around the axis of one rotation,
The first circular blade is a single blade having a back surface facing the spacer through a first gap,
The second circular blade is a single blade having a back surface facing the spacer through a second gap,
The two-blade unit includes a third circular blade that slits the film in cooperation with the first circular blade, and a fourth circular blade that slits the film in cooperation with the second circular blade, and rotatable around a second rotation axis extending in the first direction;
The third circular blade is a single-edged blade having a cutting edge that enters the first cavity, and is a single-edged blade having a blade back surface facing the first circular blade side in the first direction,
The fourth circular blade is a single-edged blade having a cutting edge that enters the second cavity, and is a single-edged blade having a blade back surface facing the second circular blade side in the first direction,
A separation distance between the cutting edge of the third circular blade and the cutting edge of the fourth circular blade in the first direction is 5 mm or more and 20 mm or less,
The laminated film original fabric includes a temporary support film, a cured resin layer that is in peelable contact with the temporary support film, and an inorganic layer in this order in the thickness direction,
In the slitting step, the bladed support roller is rotationally driven in a state where the side of the laminated film original fabric opposite to the inorganic layer is in contact with the first roller part and the second roller part, and the laminated film original fabric is slit. A method for producing a laminated film, wherein the raw laminated film is slit between the first and third circular blades while being slit between the second and fourth circular blades by feeding the raw laminated film in the longitudinal direction. The method for producing a laminated film according to claim 1, wherein the cured resin layer has a thickness of 1 μm or more and 3 μm or less. The method for producing a laminated film according to claim 1, wherein the surface of the temporary support film on the cured resin layer side has a surface free energy of 20 mN/m or more and 40 mN/m or less. The method for producing a laminated film according to claim 1, wherein the peel strength between the temporary support film and the cured resin layer is 1 N/24 mm or less. The method for producing a laminated film according to claim 1, wherein the hardness of the surface of the cured resin layer on the inorganic layer side at 25° C. measured by a nanoindentation method is 0.3 GPa or more. The outer peripheral surface of the first roller part and the outer peripheral surface of the first circular blade are flush with each other, and the outer peripheral surface of the second roller part and the outer peripheral surface of the second circular blade are flush with each other. A method for producing a laminated film according to any one of claims 1 to 5.

Images