JP2024002778A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of improving cooling performance.

SOLUTION: An electronic apparatus comprises: a housing having a first opening and a second opening on an outer wall; a substrate that is provided in the housing and on which a heating body is mounted; and a cooling module that is provided in the housing and absorbs heat generated by the heating body. The cooling module includes: a fan having a fan housing on which an intake port, a first exhaust port, and a second exhaust port are formed; a fin disposed between the first exhaust port and the first opening; and a plate-type thermal diffusion member that is disposed so as to face the substrate and that absorbs the heat generated by the heating body. A duct space, which communicates with the second opening and in which the heating body is disposed, is formed between the substrate and the thermal diffusion member, and the second exhaust port is opened facing the duct space.

SELECTED DRAWING: Figure 2

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to electronic equipment equipped with a cooling module.

Electronic devices such as notebook PCs are equipped with heating elements such as CPUs and GPUs. Such electronic equipment has a cooling module mounted inside the housing, absorbs heat generated by a heating element, and radiates the heat to the outside. Patent Document 1 discloses an electronic device equipped with a cooling module configured such that fins are provided between an opening formed in a housing and an exhaust port of a fan, and a plate-shaped vapor chamber and a heat pipe are connected to a heat generating element. is disclosed.

JP2022-059833A

In addition to the CPU and GPU, the electronic device described above is equipped with a large number of heat generating elements such as a power supply component that serves as a power source for these CPUs and GPUs. Since CPUs and GPUs generate a large amount of heat, they are generally configured to use heat pipes to transport heat to the fins. On the other hand, other power supply components do not have space to connect heat pipes, and are cooled essentially only by heat absorption by the vapor chamber.

However, since the vapor chamber also absorbs heat from the CPU and GPU, the power supply components cannot be sufficiently cooled, and as a result, the cooling capacity of the entire cooling module may be insufficient. In electronic devices, when the cooling capacity is insufficient, the performance of the CPU and the like deteriorates, and high-temperature areas are sometimes formed on the surface of the casing directly above and below the heating element. On the other hand, since there is a strong demand for thinner housings of such electronic devices, it is difficult to increase the cooling capacity by increasing the size of fans and vapor chambers.

The present invention has been made in consideration of the problems of the prior art described above, and an object of the present invention is to provide an electronic device that can improve cooling capacity.

An electronic device according to a first aspect of the present invention includes: a casing having a first opening and a second opening on an outer wall; a board provided within the casing and mounting a heating element; , a cooling module that absorbs heat generated by the heating element, and the cooling module includes a fan having a fan housing in which an intake port, a first exhaust port, and a second exhaust port are formed; a fin disposed between the first exhaust port and the first opening; and a plate-type heat diffusion member disposed to face the substrate and absorbing heat generated by the heating element. A duct space communicating with the second opening and in which the heating element is disposed is formed between the substrate and the heat diffusion member, and the second exhaust port has an opening facing the duct space. are doing.

According to the above aspect of the present invention, cooling capacity can be improved.

FIG. 1 is a schematic plan view looking down from above on an electronic device according to an embodiment. FIG. 2 is a bottom view schematically showing the internal structure of the casing. FIG. 3 is a bottom view of the casing 14 shown in FIG. 2 in which a vapor chamber and the like are mounted. FIG. 4 is an enlarged schematic perspective view of the adjacent portion of one fan and the vapor chamber and the surrounding portion thereof. FIG. 5 is a schematic side sectional view of the casing taken along line VV in FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic plan view looking down from above an electronic device 10 according to an embodiment. As shown in FIG. 1, the electronic device 10 is a clamshell notebook PC in which a display casing 12 and a casing 14 are connected by a hinge 16 so as to be relatively rotatable. The electronic device according to the present invention may be other than a notebook PC, such as a desktop PC, a tablet PC, a smartphone, or a game console.

The display housing 12 is a thin, flat box. A display 18 is mounted on the display housing 12. The display 18 is composed of, for example, an organic EL (OLED) or a liquid crystal.

Hereinafter, regarding the casing 14 and each element mounted thereon, the casings 12 and 14 are in an open state as shown in FIG. In the following, the width direction will be referred to as left and right, and the height direction (thickness direction of the housing 14) will be referred to as up and down.

The housing 14 is a thin and flat box. The housing 14 includes a cover member 14A that forms an upper surface and four circumferential side surfaces, and a cover member 14B that forms a lower surface. The upper cover member 14A has a substantially bathtub shape with an open bottom surface. The lower cover member 14B has a substantially flat plate shape and serves as a lid that closes the lower opening of the cover member 14A. The cover members 14A and 14B are overlapped in the thickness direction and removably connected to each other. A keyboard 20 and a touch pad 21 are provided on the top surface of the housing 14. The housing 14 has a rear end connected to the display housing 12 using a hinge 16.

FIG. 2 is a bottom view schematically showing the internal structure of the housing 14, with a vapor chamber 36, a heat pipe 38, and fins 40 and 41, which will be described later, omitted.

As shown in FIG. 2, inside the housing 14, a cooling module 22, a motherboard 24, and a battery device 26 are provided. Inside the casing 14, various electronic components, mechanical components, etc. are further provided.

Motherboard 24 is the main board of electronic device 10 . The motherboard 24 is disposed toward the rear of the housing 14 and extends in the left-right direction. The motherboard 24 is a printed circuit board on which various electronic components such as a CPU 30, a GPU 31, DCDC converters 32 and 33, a memory (DIMM), a communication module, and connection terminals are mounted. The motherboard 24 is arranged under the keyboard 20 and is screwed to the back surface of the keyboard 20 and the inner surface of the cover member 14A. In the case of the present embodiment, the upper surface of the motherboard 24 serves as a mounting surface for the cover member 14A, and the lower surface serves as a mounting surface 24a for the CPU 30 and the like (see FIG. 5).

The CPU 30 is arranged to the left of the horizontal center of the mounting surface 24a of the motherboard 24. The CPU 30 performs calculations related to the main control and processing of the electronic device 10. The GPU 31 is arranged on the right side of the CPU 30 on the mounting surface 24a. The GPU 31 performs calculations necessary for image depiction such as 3D graphics. Reference numeral 30a in FIG. 2 is a package substrate on which the CPU (die) 30 is mounted. Similarly, the GPU 31 also has a die mounted on the package substrate 31a.

The DCDC converter 32 is a power supply component that serves as a power source for the CPU 30, and is composed of, for example, a plurality of semiconductor chips lined up immediately after the CPU 30. The DCDC converter 33 is a power supply component that serves as a power source for the GPU 31, and is composed of, for example, a plurality of semiconductor chips lined up immediately in front of the GPU 31.

The battery device 26 is a rechargeable battery that serves as a power source for the electronic device 10. The battery device 26 is arranged in front of the motherboard 24 and extends left and right along the front end of the housing 14 .

Next, the configuration of the cooling module 22 will be explained.

The CPU 30 and the GPU 31 are heating elements that generate the largest amount of heat among the electronic components mounted in the housing 14, and the DCDC converters 32 and 33 are the heating elements that generate the second largest amount of heat after the CPU 30 and the GPU 31. Therefore, the cooling module 22 can absorb and diffuse the heat generated by the CPU 30, the GPU 31, and the DCDC converters 32 and 33, and further discharge the heat to the outside of the housing 14. The cooling module 22 is stacked so as to cover a part of the mounting surface 24a of the motherboard 24, specifically, the area where the CPU 30 and the GPU 31 are mounted.

FIG. 3 is a bottom view of the casing 14 shown in FIG. 2 in which the vapor chamber 36 and the like are mounted.

As shown in FIGS. 2 and 3, the cooling module 22 includes a vapor chamber 36, a heat pipe 38, a pair of left and right fins 40, 41, a pair of left and right fans 42, 43, and a heat conduction plate 44. Be prepared.

The vapor chamber 36 is a plate-type heat transport device. The vapor chamber 36 has a sealed space 36c formed between two thin metal plates 36a and 36b (see FIG. 5), and a working fluid is sealed in the sealed space 36c. The metal plates 36a, 36b are made of a metal with high thermal conductivity such as aluminum, copper, or stainless steel. The sealed space 36c becomes a flow path through which the enclosed working fluid flows while undergoing a phase change. Examples of the working fluid include water, a fluorocarbon substitute, acetone, and butane. A wick 36d is provided in the closed space 36c to transport the condensed working fluid by capillary action (see FIG. 5). The wick 36d is formed of a porous body such as a mesh made of thin metal wires knitted in a cotton-like manner or a fine channel.

The vapor chamber 36 can absorb and diffuse the heat of the CPU 30, GPU 31, and DCDC converters 32, 33, and can transmit this heat to the heat pipe 38 connected to the lower surface 36e. The vapor chamber 36 is arranged substantially parallel to and facing the motherboard 24, and its upper surface 36f directly or indirectly contacts the top surfaces of the CPU 30, the GPU 31, and the DCDC converters 32 and 33. For this reason, it is preferable that the surface area of the vapor chamber 36 in plan view is large enough to cover and hide at least the CPU 30, the GPU 31, and the DCDC converters 32 and 33. For example, two vapor chambers 36 may be arranged adjacent to each other so as to cover the CPU 30, GPU 31, and the like.

The heat pipe 38 is a pipe-shaped heat transport device. The heat pipe 38 is connected to the lower surface 36e of the vapor chamber 36 at a position overlapping the CPU 30 and GPU 31 in the vertical direction. The present embodiment exemplifies a configuration in which two heat pipes 38a and 38b are arranged in parallel in pairs in the front and rear, and both ends of these are connected to left and right fins 40 and 41. One or three or more heat pipes 38 may be used. The heat pipes 38 may be configured such that, for example, two sets of two heat pipes are provided, one set is connected to the fins 40, and the other set is connected to the fins 41. The heat pipes 38a and 38b are formed by flattening a metal pipe to have an elliptical cross section, and a working fluid is sealed in a sealed space formed within the metal pipe. Examples of the working fluid include water, a fluorocarbon substitute, acetone, and butane.

The left fin 40 has a structure in which a plurality of metal plates are arranged at equal intervals in the left-right direction. Each metal plate stands up in the vertical direction and extends in the front-back direction. A gap is formed between adjacent metal plates through which air sent from the fan 42 passes. The fins 40 are made of a metal with high thermal conductivity, such as aluminum or copper. The right fin 41 is slightly different in size, etc., but its basic configuration is bilaterally symmetrical with the left fin 40, so a detailed explanation will be omitted. The fins 40 and 41 may be connected to a heat transport device other than the heat pipe 38, such as the vapor chamber 36 or a heat spreader as an alternative thereof. Alternatively, the fins 40 and 41 may be directly connected to a heating element other than the CPU 30 or the CPU 31.

As shown in FIGS. 2 and 3, the housing 14 has a pair of left and right first openings 46a and 46b formed through an outer wall 46 forming a rear edge thereof. Fins 40 and 41 face first openings 46a and 46b, respectively.

The heat conduction plate 44 is connected to the front edge of the vapor chamber 36 and protrudes forward. The thermally conductive plate 44 is a thin plate made of a material with high thermal conductivity such as metal such as aluminum or copper or graphite. The heat conduction plate 44 is provided to cover, for example, a power component mounted on the motherboard 24. The heat conduction plate 44 may be omitted.

FIG. 4 is an enlarged schematic perspective view of the adjacent portion of one fan 42 and the vapor chamber 36, and the surrounding portion thereof. FIG. 5 is a schematic side sectional view of the housing 14 taken along line VV in FIG.

As shown in FIGS. 2-5, the left fan 42 is located just in front of the fins 40. As shown in FIGS. The fan 42 includes a fan housing 42c in which a first exhaust port 42a and a second exhaust port 42b are formed, and an impeller 42d housed in the fan housing 42c. The first exhaust port 42a is formed on the rear surface of the fan 42 and opens rearward. The second exhaust port 42b is formed on a side surface 42c1 of the fan 42 facing the vapor chamber 36 side, and is open toward the vapor chamber 36 side. The fan 42 is a centrifugal fan in which an impeller 42d is rotated by a motor, and air is sucked in through intake ports 42e opened on the upper and lower surfaces of the fan housing 42c, and discharged through exhaust ports 42a and 42b.

The right fan 43 is slightly different in size, etc., but its basic configuration is bilaterally symmetrical with the left fan 42, so a detailed explanation will be omitted. That is, the fan 43 is disposed immediately in front of the fins 41 and includes a fan housing 43c in which a first exhaust port 43a and a second exhaust port 43b are formed, an impeller 43d, and an intake port 43e. The first exhaust port 43a is formed on the rear surface of the fan 43 and opens toward the rear. The second exhaust port 42b is formed on a side surface 43c1 of the fan 43 facing the vapor chamber 36 side, and is open toward the vapor chamber 36 side.

In such a cooling module 22, heat generated by the CPU 30 and the like is absorbed and diffused by the vapor chamber 36, and is transmitted to the heat pipe 38 and transported to the fins 40 and 41. Then, in the cooling module 22, the air A1 discharged from the first exhaust ports 42a, 43a of the fans 42, 43 passes through the fins 40, 41 and is cooled, and then passes through the first openings 46a, 46b to the housing. 14 is discharged outside. As a result, in the electronic device 10, the heat of the CPU 30 and GPU 31 is discharged to the outside of the housing 14 via the fins 40 and 41. An arrow A1 shown by a dashed line in FIG. 2 schematically shows the flow of air discharged from the first exhaust ports 42a and 43a.

On the other hand, the second exhaust ports 42b and 43b of the fans 42 and 43 are open facing the gap G between the mounting surface 24a of the motherboard 24 and the upper surface 36f of the vapor chamber 36 (see FIGS. 2 to 5). ). Therefore, the air discharged from the second exhaust ports 42b and 43b passes through the space (duct space DS) formed between the upper surface 36f and the mounting surface 24a.

Therefore, next, the configuration of the second exhaust ports 42b, 43b of the fans 42, 43 and the duct space S, and the effects thereof will be explained.

As shown in FIGS. 4 and 5, the vapor chamber 36 is arranged substantially parallel to the motherboard 24, and its upper surface 36f is arranged to face the mounting surface 24a with a gap G corresponding to the height of the CPU 30, etc. Ru. This gap G becomes a duct space DS through which air can flow in the front, rear, right and left directions, since the plate-shaped motherboard 24 and the vapor chamber 36 form an upper wall and a lower wall. The second exhaust ports 42b, 43b of the fans 42, 43 are open facing the duct space DS.

On the other hand, in the case 14, a second opening 46c is formed to penetrate approximately the center of the outer wall 46 forming the rear edge (see FIGS. 2 and 3). The second opening 46c faces the rear opening of the duct space DS.

Therefore, in the cooling module 22, the air A2 discharged from the second exhaust ports 42b, 43b of the fans 42, 43 flows into the duct space DS. The air A2 passes through the sides of the CPU 30, the GPU 31, and the DCDC converters 32 and 33 while circulating in the duct space DS to cool them, and also cools the upper surface 36f of the vapor chamber 36 at the same time. Thereafter, the air A2 is discharged from the rear opening of the duct space DS to the outside of the housing 14 through the second opening 46c. An arrow A2 shown by a dashed line in FIGS. 2 to 5 schematically shows the flow of air discharged from the second exhaust ports 42b and 43b.

4 and 5 representatively illustrate the configuration of the second exhaust port 42b of the fan 42 and its surrounding area, but the configuration of the second exhaust port 43b of the fan 43 and its surrounding area also differs in shape. The same or similar configurations may be used except for the slightly different arrangement (see FIGS. 2 and 3). The fans 42, 43 and the fins 40, 41 may be configured only on one side instead of as a pair on the left and right, and in this case, only the second exhaust port of one fan will ventilate the duct space DS.

As shown in FIG. 2, in the case of this embodiment, the DCDC converter 33 is located in front of the GPU 31, and faces a portion of the side surface 43c1 of the left fan 43 that is curved into an arc shape at the front end. Therefore, the fan 43 forms a second exhaust port 43b in the arcuate curved portion of the side surface 43c1, thereby making it possible to reliably deliver the air A2 around the DC/DC converter 33. Depending on the positional relationship with the GPU 31 and the DCDC converter 33, the second exhaust port 43b of the fan 43 may be provided in a straight line along the front-rear direction of the side surface 43c1, etc., similarly to the second exhaust port 42b of the fan 42. . Further, the second exhaust port 42b of the fan 42 may also be provided in an arcuate curved portion of the side surface 42c1, depending on the positional relationship with the CPU 30 and the DC/DC converter 32, instead of in the straight portion of the side surface 42c1.

As described above, in the electronic device 10, not only the CPU 30 and the GPU 31 but also the DCDC converters 32 and 33 are cooled with the air A2. At the same time, the air A2 contacts the upper surface 36f of the vapor chamber 36 over a wide area and efficiently cools it. As a result, the electronic device 10 can suppress performance deterioration of the CPU 30 and GPU 31 by improving the cooling performance of the cooling module 22. Furthermore, in the electronic device 10, by efficiently cooling the heat generating element such as the CPU 30, it is possible to suppress the cover members 14A and 14B located directly above and directly below from becoming high temperature.

In this way, in the duct space DS, if at least the motherboard 24 and the vapor chamber 36 are arranged to face each other, and the second exhaust ports 42b and 43b face there, a sufficient cooling effect can be obtained. However, if the duct space DS is closed not only on the upper and lower surfaces but also on its front, rear, left and right outer circumferential surfaces, the flow of air from the second exhaust ports 42b and 43b to the second opening 46c is rectified, resulting in an even higher cooling effect. can get.

Here, an electronic device 10 of an example including fans 42 and 43 with second exhaust ports 42b and 43b formed toward the duct space DS, and an electronic device of a comparative example using a fan without a second exhaust port. We will explain the experimental results comparing the cooling performance of

Table 1 shows the temperature of each part of the electronic device 10 of the embodiment including the fans 42, 43 with the second exhaust ports 42b, 43b and the electronic device including the conventional fan structure without the second exhaust ports 42b, 43b. The results of an experiment comparing the two are shown.

In Table 1, "without second exhaust port" indicates the experimental results of a comparative example in which the second exhaust ports 42b, 43b are not provided, and "with second exhaust port" indicates the experimental results in which the second exhaust ports 42b, 43b are provided. The experimental results are shown below. In the "Surface temperature (°C)" column, "Bottom surface of the casing" is the temperature of the bottom surface of the casing 14, "Keyboard surface" is the surface temperature of the keyboard 20, "Top rear of the casing" is the temperature of the bottom surface of the casing 14, i.e. The temperature measurement results of the portion directly above the fins 40, 41, the DCDC converter 32, etc. are shown. In the column "Each part sensor temperature (℃)", "CPU" is the surface temperature of CPU 30, "CPU DCDC" is the surface temperature of DCDC converter 32, "GPU" is the surface temperature of GPU 31, "GPU DCDC" is the surface temperature of DCDC converter 33. "DIMM" indicates the measurement result of the surface temperature of the memory mounted on the motherboard 24.

As shown in Table 1, as a result of this experiment, the temperature of the CPU 30, GPU 31, and DCDC converters 32 and 33 was higher in the example with the second exhaust port than in the comparative example with the second exhaust port. was found to be significantly reduced. Therefore, it has been confirmed that the electronic device 10 of the present embodiment improves the cooling performance of the CPU 30 and the like by including the duct space DS and the second exhaust ports 42b and 43b through which air flows.

In Table 1, the "surface temperature (° C.)" of the casing 14 was slightly higher in "with second exhaust port" than in "without second exhaust port". One of the reasons for this may be that this experiment was conducted using a prototype model in which second exhaust ports 42b and 43b were formed on an experimental basis for an existing product fan that did not have a second exhaust port. That is, the fans of the example and the comparative example are the same, and only the fan of the example was used as a prototype in which the second exhaust ports 42b and 43b were formed. For this reason, the air flow rate from the first exhaust ports 42a, 43a passing through the fins 40, 41 is lower when "with the second exhaust port" than "without the second exhaust port", and the air flow rate at the fins 40, 41 is lower. It can be assumed that the surface temperature of the casing 14 has increased directly above and below the fins 40 and 41 as a result of the decrease in cooling efficiency.

However, as is clear from the experimental results in Table 1, by providing the second exhaust ports 42b and 43b and circulating air A2 through the duct space DS between the vapor chamber 36 and the motherboard 24, the cooling performance of the CPU 30, etc. can be improved. It has been confirmed that this has improved. Therefore, in the configuration of the embodiment, the air volume of the fans 42, 43, the size of the second exhaust ports 42b, 43b, the balance of the exhaust volume between the second exhaust ports 42b, 43b and the first exhaust ports 42a, 43a, etc. Through optimization, it is fully possible to lower the surface temperature of the housing 14 than in the comparative example. In particular, the total air volume of the two fans in each example was 5.7 (CFM) in the comparative example, whereas it increased to 6.0 (CFM) in the example. Therefore, it can be said that it is fully possible to lower the surface temperature of the casing 14 by further experimenting and optimizing the air volume and balance of the fans 42 and 43 described above.

The electronic device 10 of this embodiment may include a heat spreader made of a metal plate made of copper or the like similar to the heat conduction plate 44 instead of the vapor chamber 36. Also in this case, cooling performance is improved by forming the duct space DS between the plate-shaped heat spreader and the motherboard 24.

However, the vapor chamber 36 has the advantage of having significantly higher thermal conductivity than a heat spreader such as a simple copper plate. Furthermore, as described above, when the duct space DS is formed in the vapor chamber 36, the gas phase working fluid flowing through the closed space 36c after receiving heat can be efficiently cooled by the air A2 flowing through the duct space DS, and its condensation can be prevented. The heat transfer efficiency of the vapor chamber 36 can be further improved. As a result, the electronic device 10 uses the vapor chamber 36 instead of the heat spreader, thereby making it possible to obtain an effect of improving the cooling capacity more than the difference in thermal conductivity between the two.

Next, a configuration example for rectifying the air A2 in the duct space DS will be described.

As shown in FIGS. 2 to 5, the electronic device 10 opens the front opening of the duct space DS opposite to the rear opening of the duct space DS facing the second opening 46c, that is, facing the battery device 26 side. It may also be configured to be closed with a side wall member 50. The side wall member 50 forms a part of a side wall that closes the duct space DS on the side opposite to the second opening 46c. The side wall member 50 is a rectifying member for smoothly guiding the air A2 from the second exhaust ports 42b, 43b to the second opening 46c within the duct space DS.

The side wall member 50 is, for example, a flexible sponge or rubber that extends in a band shape and stands between the upper surface 36f of the vapor chamber 36 and the mounting surface 24a of the motherboard 24, and is in close contact with both surfaces 36f and 24a. Note that when removing the cooling module 22 for maintenance or the like, the side wall member 50 needs to be smoothly separated from the upper surface 36f or the mounting surface 24a. Therefore, it is preferable that the side wall member 50 is adhesively fixed to only one of the upper surface 36f or the mounting surface 24a, and is tightly attached to the other by taking advantage of its flexibility.

As shown in FIG. 2, the side wall member 50 extends from a first end 50a adjacent to the front edge of the second exhaust port 43b of the fan 43 to a first end 50a adjacent to the front edge of the second exhaust port 42b of the fan 42. It extends left and right to the second end 50b. The side wall member 50 is arranged in front of the CPU 30, the GPU 31, and the DCDC converters 32 and 33. The side wall member 50 of this embodiment extends left and right while being slightly cranked, depending on the shape of the vapor chamber 36 and the components mounted on the motherboard 24.

As described above, the duct space DS has a configuration in which the CPU 30, the GPU 31, and the DCDC converters 32 and 33 are accommodated between the side wall member 50 and the second opening 46c. As a result, the air A2 flows more smoothly from the second exhaust ports 42b, 43b to the second opening 46c while passing through the sides of each heat generating element such as the CPU 30. Although the shape and arrangement of the side wall member 50 are not limited, at least the CPU 30, which is a heating element to be cooled in the duct space DS, is located between the second opening 46c and the second exhaust port 42b of the fans 42, 43. 43b is preferably placed between them.

Reference numerals 52a and 52b in FIG. 5 are airtight materials provided to surround the outer peripheral edges of the upper and lower surfaces of the fan housing 42c to prevent backflow of exhaust gas to the intake port 42e, and are made of, for example, sponge. be. The airtight materials 52a and 52b are similarly installed in the fan housing 43c. Further, reference numeral 53 in FIG. 5 is a heat receiving plate provided to improve the adhesion between the top surface of the CPU 30 and the top surface 36f of the vapor chamber 36, and is, for example, a copper block. The heat receiving plate 53 is similarly provided between the GPU 31 and the vapor chamber 36.

In the above description, it has been stated that the fans 42 and 43 may be composed of only one side instead of a pair of left and right fans. However, as shown in FIGS. 2 and 3, it is preferable that the electronic device 10 includes fans 42 and 43 on the left and right sides of the vapor chamber 36, respectively. Then, in the left and right fans 42 and 43, the side surfaces 42c1 and 43c1 of the respective fan housings 42c and 43c form part of the side wall that closes the left and right side openings of the duct space DS. In other words, the left and right fan housings 42c and 43c function as rectifying members that more smoothly guide the air A2 flowing through the duct space DS from the second exhaust ports 42b and 43b to the second opening 46c. As a result, it is not necessary to attach a large amount of side wall members 50 along the side opening of the duct space DS, and manufacturing efficiency is improved.

As shown in FIGS. 2 to 4, the cooling module 22 includes fins 40 and 41 immediately after the first exhaust ports 42a and 43a of the fans 42 and 43, respectively. The side surfaces of the fins 40 and 41 also form part of the side walls that close the left and right openings of the duct space DS by continuing to the rear of the fan housings 42c and 43c.

As shown in FIG. 2, in a configuration in which the electronic device 10 includes fans 42 and 43 on the left and right sides of the duct space DS, the electronic device 10 may further include a partition member 54 that partitions the inside of the duct space DS into left and right sides. The partition member 54 is made of the same or similar material as the side wall member 50. The partition member 54 extends in a band shape in the front-rear direction from approximately the left-right center of the side wall member 50 toward the second opening 46c. The partition member 54 stands between the upper surface 36f of the vapor chamber 36 and the mounting surface 24a of the motherboard 24, and is in close contact with both surfaces 36f and 24a.

The partition member 54 can partition the duct space DS into a first space S1 where the CPU 30 and the DCDC converter 32 are arranged, and a second space S1 where the GPU 31 and the DCDC converter 33 are arranged. As a result, in the duct space DS, the air A2 discharged from the second exhaust ports 42b and 43b of the left and right fans 42 and 43 collide with each other and the flow is disturbed, or the high temperature air A2 that has cooled the high temperature GPU 31 It is possible to suppress the occurrence of inconveniences such as an increase in temperature of the CPU 30.

Note that the present invention is not limited to the embodiments described above, and it goes without saying that changes can be made freely without departing from the spirit of the present invention.

10 Electronic equipment 14 Housing 22 Cooling module 24 Motherboard 30 CPU
31 GPU
32, 33 DCDC converter 36 vapor chamber 42, 43 fan 42a, 43a first exhaust port 42b, 43b second exhaust port 46 outer wall 46a, 46b first opening 46c second opening 50 side wall member 54 partition member DS duct space

Claims (6)

An electronic device,
a casing having a first opening and a second opening in an outer wall;
a board provided within the housing and mounting a heating element;
a cooling module that is provided within the housing and absorbs heat generated by the heating element;
Equipped with
The cooling module includes:
a fan having a fan housing in which an intake port, a first exhaust port, and a second exhaust port are formed;
a fin disposed between the first exhaust port and the first opening;
a plate-type heat diffusion member disposed to face the substrate and absorbing heat generated by the heating element;
has
A duct space is formed between the substrate and the heat diffusion member, which communicates with the second opening and in which the heating element is disposed;
The electronic device, wherein the second exhaust port opens facing the duct space. The electronic device according to claim 1,
Furthermore, a side wall member that stands up between the substrate and the heat diffusion member, forms a part of the side wall of the duct space, and guides air discharged from the second exhaust port to the second opening. An electronic device characterized by: The electronic device according to claim 2,
The electronic device is characterized in that the side wall member is made of a flexible sponge or rubber that is fixed to one of the substrate and the heat diffusion member and comes into contact with the other. The electronic device according to any one of claims 1 to 3,
An electronic device characterized in that the heat diffusion member is a vapor chamber in which a sealed space is formed between two metal plates and a working fluid is sealed in the sealed space. The electronic device according to claim 4,
The heating element includes first and second heating elements mounted at different positions on the substrate,
The fan includes first and second fans arranged to straddle the vapor chamber and the first and second heating elements,
The electronic device, wherein the fan housings of the first and second fans form part of a side wall of the duct space. The electronic device according to claim 5,
Furthermore, by standing between the substrate and the heat diffusion member, the duct space can be divided into a first space where the first heating element is arranged and a second space where the second heating element is arranged. An electronic device characterized by comprising a partition member that partitions the device into two parts.

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