JP2024001775A - Component mounting device and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the production capacity of a substrate.

SOLUTION: A component mounting device comprises: first and second conveyance lanes L1, L2; first and second component supply units 24A, 24B; first and second head units 26A, 26B; and a control part 4. The control part 4 executes parallel mounting of mounting a component on a substrate P at an upstream side work position W1 of the first conveyance lane L1 by the first head unit 26A for the upstream side work position W1, and mounting the component on the substrate P at the upstream side work position W1 of the second conveyance lane L2 by the second head unit 26B, and executes intersection mounting of mounting the component on the substrate P2 at a downstream side work position W2 of the first conveyance lane L1 by the second head unit 26B for the downstream side work position W2, and mounting the component of the substrate P at the downstream side work position W2 of the second conveyance lane L2 by the first head unit 26A.

SELECTED DRAWING: Figure 3

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a component mounting apparatus that includes two parallel transport lanes for transporting boards, and two head units for mounting (mounting) components on the boards transported along each transport lane. .

As a component mounting device as described above, a component mounting device disclosed in Patent Document 1, for example, is known. This component mounting apparatus includes first and second transport lanes that transport boards independently of each other, a first component supply section located outside the first transport lane, and a first component supply section located outside the second transport lane. a second component supply section, a first head unit that mounts the components supplied by the first component supply section on the board of the first conveyance lane, and a first head unit that mounts the components supplied by the second component supply section on the substrate of the second conveyance lane. and a second head unit mounted on the board.

In this component mounting apparatus, the board is transported by the first transport lane and the second transport lane, and the components are mounted on the board by both the first head unit and the second head unit in the transport order. However, when a preset priority board is conveyed, components are preferentially mounted on this priority board by both the first head unit and the second head unit. This effectively improves the production capacity of the two transport lanes for substrates.

Japanese Patent Application Publication No. 2014-103316

In the component mounting apparatus of Patent Document 1, the working position of the board in the first and second transport lanes, that is, the position where the board is placed during component mounting is each at one location. With the board positioned at this working position, components are mounted on the board by both the first and second head units.

In recent years, two work positions adjacent to each other in the board transport direction are set as a first transport lane, and similarly, two work positions adjacent to each other in the board transport direction are set as a second transport lane. A type of component mounting apparatus (sometimes referred to as a dual lane dual stage type) has been developed in which components are mounted on the board using a first head unit and/or a second head unit while the board is placed on the board. ing.

Similarly to the component mounting apparatus of Patent Document 1, it is desirable that this type of component mounting apparatus can efficiently improve the production capacity of the two transport lanes for substrates. There is no mention of a configuration in which each lane has two work positions or a method (configuration) that can improve production capacity in this configuration.

The present invention has been made in view of the above circumstances, and provides a component mounting device and components that contribute to improving the production capacity of boards placed at a plurality of work positions set in each of a plurality of transport lanes. The purpose is to provide an implementation method.

In order to solve the above problems, a component mounting apparatus according to one aspect of the present invention includes a first transport lane in which a board is transported, and in which an upstream work position and a downstream work position are set. and a second transport lane, which is arranged parallel to the first transport lane and transports the substrate independently of the first transport lane, and has an upstream working position and a downstream working position. A transport lane, a first component supply section located outside the first transport lane, a second component supply section located outside the second transport lane, and the first component supply section. a first head unit that holds components and mounts them on a board; a second head unit that holds components supplied by the second component supply section and mounts them on the board; the first head unit and the second head; A drive section that drives each unit independently, and a control section that controls the drive section, and the control section is configured to control the operation of the first conveyance lane by the first head unit at the upstream work position. Parallel mounting, in which components are mounted on a board located at the upstream working position, and the second head unit mounts the components on a board located at the upstream working position of the second transport lane. Meanwhile, regarding the downstream work position, the second head unit mounts the component on the board placed at the downstream work position of the first transport lane, and the first head unit mounts the component on the board placed at the downstream work position. The present invention is characterized in that components are mounted on a board placed at the downstream work position of the second transport lane.

According to this component mounting apparatus, the idle period of the first head unit or the second head unit is effectively reduced. That is, for example, in the case where boards are carried into the upstream working position of each transport lane at the same time, the first head unit mounts the component on the board placed at the upstream working position of the first transport lane, and the second It becomes possible to simultaneously start mounting components by the second head unit on the substrate placed at the upstream work position of the transport lane. Furthermore, even if there is a time difference between carrying the substrate to the upstream working position of the first transport lane and carrying the board to the upstream working position of the second transport lane, the board will be delivered to the upstream working position of each transport lane. It becomes possible to start mounting components by each head unit at the timing when each head unit is brought in. This reduces the idle period of the first head unit and the second head unit. Therefore, this component mounting apparatus contributes to improving the production capacity of boards placed at the upstream and downstream work positions set in each of the two transport lanes.

Note that a component mounting method in which the parallel mounting is performed on the board placed at the upstream working position and the cross mounting is performed on the board placed at the downstream working position is referred to as a first mounting method. In addition, when the control unit is defined as a lower control unit, the component mounting apparatus selects either the first mounting method or another second mounting method as the component mounting method executed by the lower control unit. The device further includes a higher-level control unit that selects a component mounting method based on board production conditions, and the lower-level control unit executes the component mounting method selected by the higher-level control unit from among the first mounting method or the second mounting method. The second mounting method is configured such that the first head unit mounts the component on the substrate placed at the upstream working position of each of the first transport lane and the second transport lane, and The component mounting method may be such that the second head unit mounts components onto a substrate placed at the downstream work position of each of the first transport lane and the second transport lane.

For example, if it is assumed that a component is to be mounted on a board placed at the downstream work position based on the first mounting method, the upper control unit may determine whether the component mounted first at the upstream work position and the In relation to the first condition that the first head unit or the second head unit interferes, and the arrangement of the components supplied by the first component supply section or the second component supply section, the first head unit or the second head unit may interfere with each other. A second condition that the second head unit cannot take out the component; and a third condition that the component cannot be mounted on the board due to the movable area of the first head unit or the second head unit. If one of the conditions is satisfied, the second mounting method is selected.

According to this component mounting apparatus, it is possible to improve board production capacity while satisfying constraints imposed by board production conditions.

In this case, if none of the first to third conditions are satisfied, the upper control unit calculates the cycle time when each of the first mounting method and the second mounting method is executed; The component mounting method may be configured to select a component mounting method with a short cycle time from among the first mounting method and the second mounting method.

According to this configuration, the component mounting method with the shortest cycle time is selected from the first mounting method and the second mounting method, so that it is possible to select the component mounting method with high reliability in improving the board production capacity. It becomes possible.

On the other hand, a component mounting method according to one aspect of the present invention includes a first transport lane in which a board is transported, and in which an upstream work position and a downstream work position are set; a second transport lane that is arranged parallel to the lane and transports the substrate independently of the first transport lane, and has an upstream working position and a downstream working position; A first component supply section disposed outside the first conveyance lane, a second component supply section disposed outside the second conveyance lane, and a board holding the components supplied by the first component supply section. A component mounting method in a component mounting apparatus comprising: a first head unit that mounts a component on a board; and a second head unit that holds a component supplied by the second component supply section and mounts the component on a board; Regarding the side work position, the first head unit mounts the component on the board placed at the upstream work position of the first transport lane, and the second head unit mounts the component on the board placed at the upstream work position of the second transport lane. Parallel mounting is performed in which components are mounted on a board placed at a side work position, while the downstream work position is placed at the downstream work position of the first conveyance lane by the second head unit. cross-mounting is performed, in which the components are mounted on a board to be placed, and the components are mounted by the first head unit to a board placed at the downstream work position of the second transport lane. do.

According to this component mounting method, the idle period of the first head unit or the second head unit is effectively reduced. That is, for example, in the case where boards are carried into the upstream working position of each transport lane at the same time, the first head unit mounts the component on the board placed at the upstream working position of the first transport lane, and the second It becomes possible to simultaneously start mounting components by the second head unit on the substrate placed at the upstream work position of the transport lane. Furthermore, even if there is a time difference between carrying the substrate to the upstream working position of the first transport lane and carrying the board to the upstream working position of the second transport lane, the board will be delivered to the upstream working position of each transport lane. It becomes possible to start mounting components by each head unit at the timing when each head unit is brought in. This reduces the idle period of the first head unit and the second head unit. Therefore, this component mounting apparatus contributes to improving the production capacity of boards placed at the upstream and downstream work positions set in each of the two transport lanes.

In this case, the first mounting method is a component mounting method in which the parallel mounting is performed on the board placed at the upstream working position, and the cross mounting is performed on the board placed at the downstream working position. The components are mounted by the first head unit on the substrate placed at the upstream working position of each of the first transport lane and the second transport lane, while the first transport lane and the second transport lane When a component mounting method is defined as a second mounting method in which components are mounted by the second head unit on a board placed at the downstream work position of each of the transport lanes, the first mounting method is defined as a second mounting method based on the production conditions of the board. Either the mounting method or the second mounting method may be selected, and components may be mounted on the board based on the selected component mounting method.

For example, when it is assumed that components are mounted on the board based on the first mounting method, the components on the board placed at the downstream work position and the parts that were mounted first at the upstream work position and a first condition that the first head unit or the second head unit interferes during the cross-mounting, in relation to the component supply position by the first component supply unit or the second component supply unit, Mounting the component at a target position in relation to a second condition that the first head unit or the second head unit cannot take out the component and a movable area of the first head unit or the second head unit. If any one of the third conditions is satisfied, the second mounting method may be selected.

According to this component mounting method, it is possible to improve the production capacity of the board while satisfying the constraints imposed by the board production conditions.

In this case, if none of the first to third conditions are satisfied, the cycle time for each of the first mounting method and the second mounting method is calculated, and the component mounting method with the shorter cycle time is calculated. may be selected.

According to this method, the component mounting method with the shortest cycle time is selected from the first mounting method and the second mounting method, so it is possible to select a component mounting method with high reliability in improving board production capacity. becomes.

According to the present invention described above, it is possible to improve the production capacity of substrates placed at a plurality of work positions set in each of a plurality of transport lanes.

FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention. FIG. 3 is a block diagram showing a control system of the component mounting apparatus. FIG. 3 is a schematic plan view of the apparatus main body for explaining a first mounting method of the component mounting method. FIG. 7 is a schematic plan view of the apparatus main body for explaining a second mounting method of the component mounting method. 3 is a flowchart showing a component mounting method selection process. FIG. 3 is a schematic plan view of the device main body for explaining restrictions in selecting a first mounting method. 7 is a flowchart illustrating mounting control (mounting control for substrates in the first transport lane) of the control unit in the first mounting method. 7 is a flowchart showing mounting control (mounting control for the substrate on the second transport lane) by the control unit in the first mounting method. FIG. 7 is a schematic plan view of the apparatus main body showing the operation of the first mounting method when the substrates are carried into the upstream working position at the same time (first case). FIG. 7 is a schematic plan view of the apparatus main body showing the operation of the second mounting method when the substrates are carried into the upstream working position at the same time (first case). FIG. 7 is a schematic plan view of the apparatus main body showing the operation of the first mounting method when the substrates are carried into the upstream working position with a time difference (second case). FIG. 7 is a schematic plan view of the apparatus main body showing the operation of the second mounting method when the substrates are carried into the upstream working position with a time difference (second case).

Embodiments of the present invention will be described in detail below with reference to the drawings.

[Overall configuration of component mounting equipment]
FIG. 1 is a plan view showing the device main body 2 of the component mounting device 1. As shown in FIG. The component mounting device 1 is a device that produces component mounting boards in which components (Surface Mount Devices) are mounted (mounted) on a substrate P such as a printed wiring board. 2) and a management device 100 (see FIG. 2). In FIG. 1, the directional relationship is shown using XY orthogonal coordinates that are orthogonal to each other on a horizontal plane.

The apparatus main body 2 includes a main body frame 20 made of a metal structure, two substrate conveyors (a first substrate conveyor 21 and a second substrate conveyor 22) each provided on the main body frame 20, and two parts. It includes a supply unit 24 (a first component supply unit 24A and a second component supply unit 24B), two head units 26 (a first head unit 26A and a second head unit 26B), and two component recognition cameras 40. .

The first substrate conveyor 21 is disposed on the Y1 side of the main body frame 20, and the second substrate conveyor 22 is disposed on the Y2 side of the main body frame 20, and extend parallel to each other in the X direction. The board P is carried from outside the machine (X1 side) to a predetermined working position by each board transport conveyor 21, 22, and after being subjected to component mounting processing, is carried out from the working position to the outside of the machine (X2 side).

More specifically, each substrate transport conveyor 21, 22 includes upstream conveyors 21A, 22A and downstream conveyors 21B, 22B, and the substrate P is carried from outside the machine to the upstream working position W1 by the upstream conveyors 21A, 22A. After being subjected to component mounting processing at the work position W1, the parts are transferred from the upstream conveyors 21A and 22A to the downstream conveyors 21B and 22B. Then, the downstream conveyors 21B and 22B carry the workpiece to the work position W2 on the downstream side, and after a component mounting process is performed at the work position W2, the workpiece is carried out of the machine from the work position W2 by the downstream conveyors 21B and 22B.

Each of the conveyors 21A, 21B, 22A, and 22B is a belt-type conveyor, and includes a pair of conveyor belts that rotate in the X direction, a conveyor drive motor 23 (see FIG. 2) that drives the conveyor belts, and the like. Each of the substrate conveyors 21 and 22 (21A, 21B, 22A, 22B,) is configured such that the interval between the conveyor belts can be changed, thereby making it possible to produce substrates P of different sizes. Although not shown, each of the work positions W1 and W2 is equipped with a clamp mechanism, and during the component mounting process, the board P is positioned at each of the work positions W1 and W2 by the clamp mechanism.

In this example, the first substrate conveyor 21 forms a first conveyance lane L1 for conveying the substrate P, and the second substrate conveyor 22 forms a second conveyance lane L2 for conveying the substrate P. An upstream work position W1 and a downstream work position W2 are set for each of the transport lanes L1 and L2, respectively. In the following description, the upstream work position W1 may be referred to as "upstream work position W1" and the downstream work position may be referred to as "downstream work position W2."

In this example, the substrate transport conveyors 21 and 22 forming the respective transport lanes L1 and L2 include upstream conveyors 21A and 22A and downstream conveyors 21B and 22B, as described above. Each may be a single conveyor.

The first component supply unit 24A and the second component supply unit 24B are unit areas that supply components to be mounted on the board P, and the first component supply unit 24A is a unit area that supplies components to be mounted on the board P. ), and the second component supply unit 24B is provided outside (Y2 side) of the second transport lane L2 (second substrate transport conveyor 22). Each component supply unit 24A, 24B is equipped with a plurality of feeders 24F arranged in parallel. The feeder 24F is, for example, a tape feeder that supplies chip-shaped parts. The component supply unit 24 may also include a feeder 24F other than the tape feeder, such as a stick feeder or a tray feeder. Note that the first component supply unit 24A corresponds to the "first component supply section" of the present invention, and the second component supply unit 24B corresponds to the "second component supply section" of the present invention.

The first head unit 26A and the second head unit 26B are units that pick parts from the feeder 24F, move to work positions W1 and W2, and mount the parts on the board P. Each of the head units 26A and 26B is provided so as to be movable in the X direction and the Y direction independently of each other by a head unit drive mechanism 30 (corresponding to the "drive section" of the present invention).

The head unit drive mechanism 30 includes a pair of fixed rails 34 each fixed to the main body frame 20 and extending in the Y direction, and first beams 32 movably supported by these fixed rails 34 and each extending in the X direction. and a second beam 33, a ball screw shaft 39A that is screwed to the first beam 32 and rotationally driven by a Y-axis motor 37A, and a ball screw shaft 39A that is screwed to the second beam 33 and rotationally driven by a Y-axis motor 37B. and a ball screw shaft 39B. The head unit drive mechanism 30 also includes a fixed rail (not shown) that is fixed to the first beam 32 and supports the first head unit 26A movably in the X direction, and a fixed rail that is fixed to the second beam 33 and supports the first head unit 26A. 26B movably in the X direction, a ball screw shaft 38A that is screwed into the first head unit 26A and rotationally driven by the X-axis motor 36A, and a ball screw shaft 38A that is screwed into the second head unit 26B. and a ball screw shaft 38B that is rotated by an X-axis motor 36B.

That is, the head unit drive mechanism 30 moves the first head unit 26A in the X direction along the first beam 32 via the ball screw shaft 38A with the X-axis motor 36A, and moves the first head unit 26A in the X direction along the first beam 32 with the X-axis motor 36B. The second head unit 26B is moved in the X direction along the second beam 33 via the second beam 33. Further, the head unit drive mechanism 30 causes the Y-axis motor 37A to move the first beam 32 in the Y direction via the ball screw shaft 39A, and the Y-axis motor 37B to move the second beam 33 via the ball screw shaft 39B. Move it in the Y direction. With this configuration, the first head unit 26A and the second head unit 26B move in the X direction and the Y direction within a certain range of the space above the main body frame 20.

Note that the first head unit 26A is arranged on the Y2 side of the first beam 32, and the second head unit 26B is arranged on the Y1 side of the second beam 33. That is, each head unit 26A, 26B is arranged inside both beams 32, 33.

Each head unit 26A, 26B is provided with a plurality of axial mounting heads 27 extending in the vertical direction and a head drive mechanism for driving these mounting heads 27. In this example, each head unit 26A, 26B is an in-line type in which a plurality of mounting heads 27 are arranged in a line along the X direction, but it is a rotary type in which a plurality of mounting heads 27 are arranged in a circle. It's okay.

The head drive mechanism includes an elevation drive mechanism in which each mounting head 27 is individually moved up and down by a Z-axis motor 28 (see FIG. 2), and a rotation drive mechanism in which each mounting head 27 is rotated around a central axis (in the R direction) by an R-axis motor 29. including. The tip of each mounting head 27 is equipped with a nozzle for picking up components. Negative pressure and positive pressure are selectively supplied to each nozzle. As a result, each mounting head 27 suction-holds the component and releases (mounts) the component onto the substrate P.

The component recognition camera 40 is a camera that images the components suctioned and held by the mounting head 27 of each head unit 26A, 26B from below. This is an integrated lighting camera that is equipped with a device. The component recognition cameras 40 are arranged facing upward between the first component supply unit 24A and the first transport lane L1, and between the second component supply unit 24B and the second transport lane L2.

[Control system of component mounting apparatus 1]
FIG. 2 is a block diagram showing a control system of the component mounting apparatus 1. As shown in FIG. The component mounting apparatus 1 includes a control section 4 as described above, and a display/input section that includes a display section that displays various information regarding component mounting processing, etc., and an input section that receives input operations for various commands to the control section 4. 5 and a management device 100.

The control section 4 includes a calculation processing section 51, a storage section 52, a motor control section 53, an image processing section 54, a communication section 55, and the like. The arithmetic processing unit 51 is configured with a CPU, ROM, RAM, peripheral circuits, etc., and the CPU controls the operation of each component of the device main body 2 by executing a control program stored in the ROM. .

The storage unit 52 stores various programs executed in the component mounting process and various data such as board data referenced when executing the programs. The board data includes data such as the type of board, the type, size, and mounting coordinates of components mounted on the board. Further, the various programs include an implementation program consisting of a plurality of sequence data. When the arithmetic processing unit 51 executes this mounting program, each component of the component mounting apparatus 1 operates, and components are mounted on the board P. The mounting program is generated by the management device 100 and stored in the storage unit 52 before the production of the board P.

The motor control unit 53 controls each motor, such as the X-axis motors 36A and 36B, the Y-axis motors 37A and 37B, the Z-axis motor 28, and the R-axis motor 29, based on instructions from the arithmetic processing unit 51. The image processing unit 54 generates a digital image of the component based on the image signal output from the component recognition camera 40. The arithmetic processing unit 51 executes processing such as recognizing the state of suction of the component by the mounting head 27 based on this digital image. The communication unit 55 comprehensively controls communication with external devices connected to the component mounting apparatus 1. A management device 100 is connected to this communication section 55 .

The management device 100 is provided, for example, at a location away from the component mounting device 1, and generates a mounting program to be executed by the component mounting device 1, and also manages various types of component mounting processing executed by the component mounting device 1. Save historical data.

The management device 100 includes a calculation processing section 101, a storage section 102, and a communication section 103. The arithmetic processing unit 101 includes a CPU, ROM, RAM, peripheral circuits, and the like. Prior to production of a board P, the arithmetic processing unit 101 executes a predetermined optimization program based on the board data of the board P, thereby reducing the time (cycle) required from the start to the end of production of one lot of the board P, for example. Generate an implementation program that takes as little time as possible. The mounting program generated by the management device 100 is transmitted to the control unit 4 through the communication unit 103 and stored in the storage unit 52 before the production of the board P.

The storage unit 102 stores various programs and various data referred to when executing the programs. The various data include the board data and machine data. Machine data is data regarding the configuration of each part of the device main body 2, and includes head data, which is data regarding each head unit 26A, 26B used for component mounting processing, and feeder data, which is data regarding each component supply unit 24A, 24B. is included. The head data is information such as the type, size, arrangement, and lifting stroke of the mounting head 27, and the feeder data is information such as the type and arrangement of the feeder 24F in each component supply unit 24A, 24B. It is.

In this example, the control unit 4 corresponds to the "lower control unit" of the present invention, and the management device 100 corresponds to the "upper control unit" of the present invention. Note that the control unit 4 may be configured to have both the functions of a “lower control unit” and a “higher control unit”.

[Selection of component mounting method and generation of mounting program]
The component mounting method of this component mounting apparatus 1 is so-called asynchronous transfer mounting, in which the board P is transferred independently between each transfer lane L1 and L2, and component mounting processing is sequentially performed on each board P. It is a method. In this example, a first mounting method and a second mounting method are applied as this asynchronous transport mounting method, and the mounting method is based on the board data, the machine data, etc. of the board P produced in each transport lane L1, L2. One of the methods is selected.

FIG. 3 is a schematic plan view of the device main body 2 for explaining the first mounting method. In the first mounting method, for the upstream work position W1, the first head unit 26A mounts the component on the board P placed at the upstream work position W1 of the first transport lane L1, and the second head unit 26B mounts components on the board P placed at the upstream work position W1 of the second transport lane L2 (corresponding to "parallel mounting" of the present invention). Further, regarding the downstream work position W2, the second head unit 26B mounts the component on the board P placed at the downstream work position W2 of the first transport lane L1, and the first head unit 26A Components are mounted on the board P placed at the work position W2 on the downstream side of the lane L2 (corresponding to "cross mounting" in the present invention).

In this case, the first head unit 26A picks only the parts supplied by the first parts supply unit 24A, and the second head unit 26B picks only the parts supplied by the second parts supply unit 24B. In FIG. 3, white arrows indicate the mounting of components by the first head unit 26A, and black arrows indicate the mounting of components by the second head unit 26B. The same applies to FIGS. 4 and 6 to 10, which will be described later.

FIG. 4 is a schematic plan view of the device main body 2 for explaining the second mounting method. In the second mounting method, regarding the upstream work position W1, the first head unit 26A mounts the component on the board P placed at the upstream work position W1 of both transport lanes L1 and L2, and the second head unit 26B mounts components on the substrate P placed at the downstream work position W2 of both transport lanes L1 and L2.

Also in the case of the second mounting method, the first head unit 26A picks only the components supplied by the first component supply unit 24A, and the second head unit 26B picks only the components supplied by the second component supply unit 24B. to pick.

Both the first component mounting method and the second component mounting method are methods that can perform component mounting processing efficiently as an asynchronous transfer mounting method, but as described later, the first mounting method is more efficient than the second mounting method. Thus, the idle period of each head unit 26A, 26B can be further reduced. Therefore, in this example, the first mounting method is selected preferentially, and if it is determined that the first mounting method is not suitable due to the production conditions of the board P, or the second mounting method is selected over the first mounting method. The second mounting method is selected only if it is determined that the cycle time is shorter with that method.

This selection of component mounting method is performed by the management device 100 (arithmetic processing unit 101) based on the board data and machine data of the board P produced in each transport lane L1, L2. This component mounting method selection process will be described below.

FIG. 5 is a flowchart showing a component mounting method selection process performed by the arithmetic processing unit 101. This component mounting method selection process is performed together with the mounting program generation process. First, the arithmetic processing unit 101 determines in steps S1 to S5 whether or not there are physical constraints on the selection of the first mounting method based on the production conditions of each board P produced in each transport lane L1 and L2. Each determination is made in each process. The production conditions for the board P include the board data of the board P to be produced, the head data of each of the head units 26A and 26B used for component mounting processing on the board P, and the above of each component supply unit 24A and 24B. Contains feeder data.

Specifically, the arithmetic processing unit 101 first determines, based on board data and head data, whether or not there are restrictions due to component size when selecting the first mounting method (step S1). If it is determined to be Yes here, the arithmetic processing unit 101 moves the process to step 17, selects the second mounting method as the component mounting method, and executes the optimization process described below to select the second mounting method as the component mounting method. Finish the selection process.

For example, as shown in FIG. 6(a), a component mounted on a board P produced in the second transport lane L2 is a component that can only be mounted by the mounting head 27 of the second head unit 26B, and the component height is the highest. If a component C whose height is higher than the tip height of the mounting head 27 of the one head unit 26A is included, the arithmetic processing unit 101 determines Yes in the process of step S1. This means that when the component C is mounted on the board P at the upstream work position W1 of the second transport lane L2, the first head unit 26A This is because the mounting head 27 interferes with the component C. In such a case, the arithmetic processing unit 101 determines Yes in the process of step S1, selects the second mounting method in the process of step S17, and executes the optimization process. The optimization process is performed by executing a predetermined optimization program based on the board data of the boards P produced in each transport lane L1 and L2, so that the boards P produced in each transport lane L1 and L2 are manufactured based on the second mounting method. This process generates a mounting program that shortens the cycle time of the board P as much as possible. As the cycle time, for example, the time required from the start to the end of production of one lot of substrates P (cycle time) is applied.

If the determination in step S1 is No, the arithmetic processing unit 101 determines, based on the board data and feeder data, whether or not there is a restriction on the component supply position when selecting the first mounting method, that is, whether or not there is a restriction on the component supply position. Accordingly, it is determined whether there are any parts that cannot be picked by the first head unit 26A or the second head unit 26B (step S3).

For example, as shown in FIG. 6(b), when the components to be mounted on the board P at the upstream work position W1 of the second transport lane L2 are supplied only by the first component supply unit 24A, the calculation processing The unit 101 determines Yes in the process of step S3. This is because in the first mounting method, the second head unit 26B mounts components on the substrate P at the upstream work position W1 of the second transport lane L2, so the second head unit 26B mounts the components on the substrate P at the upstream work position W1 of the second transport lane L2. This is because access to 24A is not possible. Specifically, a tray feeder is disposed only in the first component supply unit 24A as the feeder 24F, and package components such as BGA (Ball Grid Array) supplied by the tray feeder are transferred to the upstream side of the second transport lane L2. If it is necessary to mount the substrate P at the position W1, the arithmetic processing unit 101 determines Yes in step S1, and moves the process to step S17.

If the determination in step S3 is No, the arithmetic processing unit 101 determines whether or not there are restrictions due to component mounting coordinates when selecting the first mounting method based on the board data, head data, and feeder data ( Step S5).

For example, as shown in FIG. 6(c), as the mounting coordinate Pc (target position) of the board P produced in the second transport lane L2, components can be mounted by the first head unit 26A at the upstream work position W1. However, if there is a mounting coordinate Pc that is impossible at the downstream work position W2, the arithmetic processing unit 101 determines Yes in the process of step S5. Such a case may occur due to the relationship between the position of the feeder 24F that supplies the component to be mounted at the component mounting coordinate Pc and the position of the mounting head 27 that picks the component (arrangement in the first head unit 26A). In such a case, the arithmetic processing unit 101 determines Yes in step S5, and moves the process to step S17.

If it is determined No in step S5, that is, if it is determined that the first mounting method can be selected, the arithmetic processing unit 101, based on the board data of the board P produced in each transport lane L1, L2, Optimization processing of the mounting program is executed for both the first mounting method and the second mounting method (step S7). That is, by executing a predetermined optimization program based on the board data, a mounting program is generated for each method so that the cycle time of the boards P produced in each of the transport lanes L1 and L2 is as short as possible. .

Next, the arithmetic processing unit 101 calculates the cycle time based on the implementation program for each method generated in step S7, and compares the results (step S9). It is determined whether the cycle time is shorter than the cycle time of the mounting method (step S11). If Yes, the arithmetic processing unit 101 selects the first mounting method as the component mounting method (Step S13), and if No, selects the second mounting method (Step S15). Thereafter, the selection process for the component mounting method is ended.

When the component mounting method selection process is completed, the arithmetic processing unit 101 selects the production log of the component mounting method (first mounting method or second mounting method) selected in step S13 or step S15, specifically, step S7. The mounting program generated in step S17 or the mounting program generated in step S17 is sent to the control unit 4. As a result, the mounting program for the board P is stored in the storage section 52. Note that the mounting program may be configured to be generated by the arithmetic processing unit 101 based on the result after the component mounting method selection process.

[Control of component mounting process]
Next, control of component mounting by the control unit 4 will be described using the first mounting method as an example with reference to FIGS. 7 and 8. FIG. 7 is a flowchart showing mounting control for the substrate P in the first transport lane L1, and FIG. 8 is a flowchart showing mounting control for the substrate P in the second transport lane L2.

When the substrate P is carried into the upstream work position W1 of the first transport lane L1 (FIG. 7(a)), the control section 4 (arithmetic processing section 51) causes the first head unit 26A to move to the upstream work position W1 of the second transport lane L2. It is determined whether the component mounting process on the board P is in progress (step S21). In the case of Yes here, the control unit 4 waits for the component mounting process to be completed, and when it is completed (No in step S21), the control unit 4 moves the board P at the upstream work position W1 of the first transport lane L1. Then, component mounting processing is executed by the first head unit 26A (step S23). In this case, the control unit 4 executes the component mounting process based on the mounting program generated by the management device 100. This point also applies to each component mounting process in steps S33, S43, and S53, which will be described later.

When the substrate P is carried into the downstream work position W2 of the first transport lane L1 (FIG. 7(b)), the control unit 4 causes the first head unit 26A or the second head unit 26B to move to the downstream work position W2 of the second transport lane L2. It is determined whether the component mounting process on the board P is in progress (step S31). If Yes here, the control unit 4 waits for the component mounting process to end, and when it ends (No in step S31), the control unit 4 moves the board P at the downstream work position W2 of the first transport lane L1. Then, the second head unit 26B executes component mounting processing (step S33).

Further, when the substrate P is carried into the upstream work position W1 of the second transport lane L2 (FIG. 8(a)), the control unit 4 causes the second head unit 26A to move the parts to the substrate P in the first transport lane L1. It is determined whether the mounting process is in progress (step S41). If Yes here, the control unit 4 waits for the component mounting process to end, and when it ends (No in step S41), the control unit 4 moves the board P at the upstream work position W1 of the second transport lane L2. Then, the second head unit 26B executes component mounting processing (step S43).

Further, when the substrate P is carried into the downstream work position W2 of the second transport lane L2 (FIG. 8(b)), the control unit 4 controls the first head unit 26A or the second head unit 26B to move to the first transport lane L2. It is determined whether the component mounting process on the board P of L1 is in progress (step S51). If Yes here, the control unit 4 waits for the component mounting process to end, and when it ends (No in step S51), the control unit 4 moves the board P at the downstream work position W2 of the second transport lane L2. Then, component mounting processing is executed by the first head unit 26A (step S53).

[Operation of component mounting process based on each component mounting method]
Next, the operation of component mounting processing based on each component mounting method (first mounting method and second mounting method) will be described with reference to FIGS. 9 to 12. 9 and 10 show the operation when the substrates P are simultaneously carried into the upstream work position W1 of each transport lane L1 and L2 (referred to as the first case), and FIGS. The operation is shown when the substrates P are carried into the side work position W1 with a time difference (referred to as the second case). In this example, the board P in the first transport lane L1 (referred to as the board P1 as appropriate) is smaller in size than the board P in the second transport lane L2 (referred to as the board P2 as appropriate) and the component mounting processing time is shorter. shall also be short.

Note that the symbol T in each figure is a pie chart showing the progress rate of the component mounting process on each board P, and the black part shows the progress rate. In this example, the substrates P in each of the transport lanes L1 and L2 undergo 50% processing at the upstream work position W1 and the remaining 50% processing at the downstream work position W2, assuming that the overall processing is 100%.

1) Operation of the first mounting method in the first case (a) to (e) in FIG. 9 show the progress of component mounting processing for each board P1 and P2 in the case of the first mounting method in chronological order. FIG. 9A shows the point in time when the substrates P1 and P2 are simultaneously carried into the upstream work position W1 of each transport lane L1.

When the boards P1 and P2 are carried into each upstream work position W1, as shown in the figure, the first head unit 26A performs a component mounting process on the board P1 in the first transport lane L1, and the component mounting process in the second transport lane L2 is performed. The component mounting process by the second head unit 26B on the board P2 is started almost simultaneously.

Since the mounting processing time for the board P1 is shorter than that for the board P2, the board P1 in the first transport lane L1 is transported from the upstream work position W1 to the downstream work position W2 before the board P2. In synchronization with this, the following substrate P1 is carried into the upstream work position W1 of the first transport lane L1. That is, substantially at the same time as the preceding board P1 (referred to as the preceding board P1) is carried into the downstream working position W2, the succeeding board P1 (referred to as the succeeding board P1) is carried into the upstream working position W1. When the preceding board P1 is carried into the downstream working position W2, component mounting processing by the second head unit 26B is started on the board P1, and when the succeeding board P1 is carried into the upstream working position W1, the mounting process on the board P1 starts. Component mounting processing by the first head unit 26A for the first head unit 26A is started. Therefore, in the first transport lane L1, as shown in FIG. 9(b), the component mounting process on the preceding board P1 and the component mounting process on the succeeding board P1 are performed in parallel. During this time, in the second transport lane L2, as shown in the figure, the board P2 (referred to as the preceding board P2) is transported toward the downstream work position W2, and the subsequent board P1 (subsequent board P2) is transported to the upstream work position W2. It is transported toward W1.

Thereafter, as shown in FIG. 9C, in the second transport lane L2, the preceding substrate P2 is carried to the downstream working position W2, and the succeeding substrate P2 is carried to the upstream working position W1, respectively, almost simultaneously. As shown in the figure, at this point, the component mounting process by the second head unit 26B is performed on the preceding board P1 of the first transport lane L1, and the component mounting process is performed by the first head unit 26A on the succeeding board P1. continuing. Therefore, each substrate P2 on the second transport lane L2 is in a waiting state (standby state) for processing.

The component mounting process for each board P1 on the first transport lane L1 ends almost simultaneously. When the component mounting process on each board P1 is completed, the component mounting process by the first head unit 26A is performed on the preceding board P2 at the downstream work position W2 in the second transport lane L2, and then on the subsequent board P2 at the upstream work position W1. On the other hand, component mounting processing by the second head unit 26B is started almost simultaneously. Therefore, in the second transport lane L2, as shown in FIG. 9D, the component mounting process on the preceding board P2 and the component mounting process on the succeeding board P2 are performed in parallel. During this time, in the first transport lane L1, the preceding substrate P1 is transported out of the machine from the downstream work position W2. Further, in synchronization with this, the succeeding board P1 is transported toward the downstream working position W2, and a new succeeding board P1 is transported toward the upstream working position W1.

Thereafter, as shown in FIG. 9E, in the first transport lane L1, the subsequent substrate P1 is carried to the downstream working position W2, and a new succeeding substrate P1 is carried to the upstream working position W1 almost simultaneously. As shown in the figure, at this point, the first head unit 26A is performing component mounting processing on the preceding board P2 of the second transport lane L2, and the component mounting processing is being performed on the succeeding board P2 by the second head unit 26B. continuing. Therefore, each board P1 on the first transport lane L1 is in a waiting state for processing, and when the component mounting process on each board P2 on the second transport lane L2 is completed, the mounting process on each board P1 on the first transport lane L1 is completed. They will start almost at the same time.

Thereafter, the operations shown in FIGS. 9(c) to 9(e) are repeated to proceed with the component mounting process on the boards P1 and P2 of each transport lane L1 and L2.

2) Operation of the second mounting method in the first case (a) to (f) in FIG. 10 show the progress of component mounting processing for each board P1 and P2 in the case of the second mounting method in chronological order. 10(a) shows the point in time when the substrates P1 and P2 are simultaneously carried into the upstream work position W1 of each transport lane L1.

When the boards P1 and P2 are carried into each upstream work position W1, as shown in the figure, only the component mounting process by the first head unit 26A on the board P1 in the first transport lane L1 is started. The substrate P2 in the second transport lane L2 is in a waiting state for processing. Note that the reason why the board P1 is placed in advance is because the mounting processing time for components is shorter than that of the board P2.

When the component mounting process on the board P1 in the first transport lane L1 is completed, the component mounting process by the first head unit 26A on the board P2 in the second transport lane L2 is started. Then, as shown in FIG. 10(b), during the component mounting process on this board P2, the board P1 (preceding board P1) in the first transport lane L1 is transported toward the downstream work position W2, and The substrates P1 are conveyed toward the upstream working position W1, and these substrates P1 are carried almost simultaneously to the respective working positions W1 and W2 of the first conveying lane L1.

Each board P1 is in a standby state until the first head unit 26A completes the component mounting process on the board P2. During this time, the second head unit 26B is in an idle state. When the component mounting process on the board P2 is completed, as shown in FIG. 10(c), the second head unit 26B performs the component mounting process on the preceding board P1 of the first transport lane L1, and the first head unit performs the component mounting process on the succeeding board P1. 26A starts almost simultaneously. Therefore, in the first transport lane L1, component mounting processing on the preceding board P1 and component mounting processing on the succeeding board P1 are performed in parallel.

As shown in the figure, during the component mounting process on each board P1, the board P2 (preceding board P2) in the second transport lane L2 is transported toward the downstream work position W2, and the subsequent board P2 is transported toward the downstream work position W2. These substrates P2 are transported toward the upstream working position W1, and as shown in FIG. 10(d), these substrates P2 are carried into the working positions W1 and W2 almost simultaneously.

As shown in the figure, at this point, the component mounting process by the second head unit 26B on the preceding board P1 of the first transport lane L1 and the component mounting process by the first head unit 26A on the succeeding board P1 are continuing. . Therefore, each substrate P2 on the second transport lane L2 is in a waiting state for processing.

The component mounting process on the preceding board P1 and the succeeding board P1 in the first transport lane L1 is completed almost simultaneously. When the component mounting process is completed, the component mounting process by the second head unit 26B on the preceding board P2 of the second transport lane L2 and the component mounting process by the first head unit 26A on the succeeding board P2 are started almost simultaneously. Therefore, in the second transport lane L2, the component mounting process on the preceding board P2 and the component mounting process on the succeeding board P2 are performed in parallel.

Then, as shown in FIG. 10(e), during the component mounting process on each board P2, the preceding board P in the first transport lane L1 is transported toward the outside of the machine. Further, in synchronization with this, the succeeding board P1 is transported toward the downstream working position W2, and a new succeeding board P1 is transported toward the upstream working position W1.

Thereafter, as shown in FIG. 10(f), in the first transport lane L1, the subsequent substrate P1 is carried to the downstream working position W2, and a new succeeding substrate P1 is carried to the upstream working position W1 almost simultaneously. As shown in the figure, at this point, the component mounting process by the first head unit 26A on the preceding board P2 of the second transport lane L2 and the component mounting process by the second head unit 26B on the succeeding board P2 are continuing. There is. Therefore, each board P1 on the first transport lane L1 is in a processing waiting state, and when the component mounting process on each board P2 on the second transport lane L2 is completed, the component mounting process on each board P1 on the first transport lane L1 is completed. will start almost at the same time.

Thereafter, the operations shown in FIGS. 10(c) to 10(f) are repeated to proceed with the component mounting process on the boards P1 and P2 of each transport lane L1 and L2.

3) Operation of the first mounting method in the second case (a) to (f) in FIG. 11 show the progress of component mounting processing for each board P1 and P2 in chronological order in the case of the first mounting method. In FIG. 11(a), the substrate P1 is carried into the upstream working position W1 of the first transport lane L1, and the substrate P2 is transported toward the upstream working position W1 in the second transport lane L2. It shows the point in time.

When the board P1 is carried into the upstream work position W1 of the first transport lane L1, as shown in the figure, component mounting processing by the first head unit 26A on the board P1 of the first transport lane L1 is started. Thereafter, when the substrate P2 is carried into the upstream work position W1 of the second transport lane L2, from that point on, as shown by the broken line arrow (black) in the figure, the second head unit 26B moves the parts to the substrate P2. The implementation process begins.

When the component mounting process on the board P1 in the first transport lane L1 is completed, as shown in FIG. 11(b), the board P1 (preceding board P1) is transported toward the downstream work position W2, and The subsequent substrate P1 is transported toward the work position W1. Then, as shown in 9(c), the succeeding board P1 is carried into the upstream working position W1 at substantially the same time as the preceding board P1 is carried into the downstream working position W2. When the subsequent board P1 is carried into the upstream work position W1, the component mounting process on the board P1 by the first head unit 26A is started, as indicated by the dashed arrow (white) in the figure. At this point, as shown in the figure, the component mounting process by the second head unit 26B continues on the preceding board P2 on the second transport lane L2. Therefore, the preceding substrate P1 in the first transport lane L1 is in a waiting state for processing.

When the component mounting process on the preceding board P2 in the second transport lane L2 is completed, as shown in FIG. Component mounting processing begins. During this time, the substrate P2 (preceding substrate P2) in the second conveyance lane L2 is conveyed toward the downstream work position W2, and the subsequent substrate P2 is conveyed toward the upstream work position W1.

Thereafter, as shown in FIG. 11E, in the second transport lane L2, the preceding substrate P2 is carried to the downstream working position W2, and the succeeding substrate P2 is carried to the upstream working position W1, respectively, almost simultaneously. As shown in the figure, at this point, the component mounting process by the second head unit 26B is performed on the preceding board P1 of the first transport lane L1, and the component mounting process is performed by the first head unit 26A on the succeeding board P1. continuing. Therefore, each substrate P2 on the second transport lane L2 is in a waiting state for processing.

When the component mounting process on the preceding board P1 in the first transport lane L1 is completed, as shown in FIG. Component mounting processing by the second head unit 26B for P2 starts almost simultaneously. Therefore, in the second transport lane L2, the component mounting process on the preceding board P2 and the component mounting process on the succeeding board P2 are performed in parallel. During this time, in the first transport lane L1, the preceding substrate P1 is transported out of the machine from the downstream work position W2. Further, in synchronization with this, the succeeding board P1 is transported toward the downstream working position W2, and a new succeeding board P1 is transported toward the upstream working position W1.

Thereafter, the operations shown in FIGS. 11(d) to 11(f) are repeated to proceed with the component mounting process on the boards P1 and P2 of each transport lane L1 and L2.

4) Operation of the second mounting method in the second case (a) to (f) in FIG. 12 show the progress of component mounting processing for each board P1 and P2 in chronological order in the case of the second mounting method. In FIG. 12(a), the substrate P1 is carried into the upstream working position W1 of the first transport lane L1, and the substrate P2 is transported toward the upstream working position W1 in the second transport lane L2. It shows the point in time.

When the board P1 is carried into the upstream work position W1 of the first transport lane L1, as shown in the figure, component mounting processing by the first head unit 26A on the board P1 of the first transport lane L1 is started. Thereafter, the substrate P2 is carried into the upstream work position W1 of the second transport lane L2, but at this point, the substrate P2 is in a waiting state for processing.

When the component mounting process on the board P1 in the first transport lane L1 is completed, as shown in FIG. Begins. Also, during this component mounting process, the board P1 (preceding board P1) in the first transport lane L1 is transported toward the downstream work position W2, and the subsequent board P1 is transported toward the upstream work position W1. Ru.

FIG. 12C shows the point in time when the preceding substrate P1 of the first transport lane L1 is carried into the downstream working position W2, and the succeeding substrate P1 is carried into the upstream working position W1. At this point, as shown in the figure, the component mounting process by the first head unit 26A continues on the substrate P2 at the upstream work position W1 in the second transport lane L2. Therefore, each substrate P1 on the first transport lane L1 is in a waiting state for processing. Note that the reason why the preceding board P1 is in the waiting state is because the head units 26A and 26B interfere with each other when the component mounting process is performed on the preceding board P1.

When the component mounting process on the board P1 (preceding board P1) of the second transport lane L2 is completed, as shown in FIG. The mounting process is started, and almost at the same time, the component mounting process by the first head unit 26A is started on the subsequent board P1. Therefore, in the first transport lane L1, component mounting processing on the preceding board P1 and component mounting processing on the succeeding board P1 are performed in parallel.

Also, during this component mounting process, the board P2 (preceding board P2) in the second transport lane L2 is transported toward the downstream work position W2, and the succeeding board P2 is transported toward the upstream work position W1. As shown in FIG. 12(e), the succeeding board P2 is carried into the upstream working position W1 at approximately the same time as the preceding board P2 is carried into the downstream working position W2. At this point, as shown in the figure, component mounting processing by the head units 26A and 26B continues on each board P1 in the first transport lane L1. Therefore, each substrate P2 on the second transport lane L2 is in a waiting state for processing.

When the component mounting process on each of the boards P1 and P2 on the first transport lane L1 is completed, as shown in FIG. The component mounting process by the first head unit 26A on the subsequent board P2 is started almost simultaneously. Therefore, in the second transport lane L2, the component mounting process on the preceding board P2 and the component mounting process on the succeeding board P2 are performed in parallel.

As shown in the figure, during the component mounting process on each board P2 in the second transport lane L2, in the first transport lane L1, the preceding board P1 is transported from the downstream work position W2 to the outside of the machine. . Further, in synchronization with this, the succeeding board P1 is transported toward the downstream working position W2, and a new succeeding board P1 is transported toward the upstream working position W1.

Thereafter, according to the second mounting method, the operations shown in FIGS. 12(d) to 12(f) are repeated to proceed with the component mounting process on the boards P1 and P2 of each transport lane L1 and L2.

[effect]
According to the component mounting apparatus 1 as described above, component mounting processing is performed using either the first mounting method or the second mounting method as the component mounting method, as described above. According to these component mounting methods, when the board P1 is carried into the upstream work position W1 and the downstream work position W2 of the first transport lane L1, and the board P2 is being transported in the second transport lane L2, ( 9(b), FIG. 10(c), FIG. 11(d), and FIG. 12(d)), components are mounted on one side of the two boards P1 by the first head unit 26A. , components are mounted on the other side substrate P1 by the second head unit 26B. Similarly, if the substrate P2 is simultaneously carried into the upstream working position W1 and the downstream working position W2 of the second carrying lane L2, and the substrate P1 is being carried in the first carrying lane L1 (see FIG. 9(d) , FIG. 10(e), FIG. 11(f), FIG. 12(f)), components are mounted by the first head unit 26A on one side of the two boards P2, and the components are mounted on the other board P2. Components are mounted on P2 by the second head unit 26B. Therefore, component mounting processing is efficiently performed by the two head units 26A and 26B.

In particular, according to this component mounting apparatus 1, the first mounting method is preferentially selected as the component mounting method, except when there are restrictions as described using FIGS. 6(a) to 6(c). According to the first mounting method, the idle period of the first head unit 26A and the second head unit 26B is reduced compared to the second mounting method. That is, when the substrates P1 and P2 are simultaneously carried into the upstream working position W1 of each transport lane L1 and L2 (the above-mentioned first case), the substrates at the upstream working position W1 of the first transport lane L1 The component mounting process by the first head unit 26A on P1 and the component mounting process by the second head unit 26B on the board P2 at the upstream work position W1 in the second transport lane L2 are started almost simultaneously (FIG. 9(a) ). Further, if there is a time difference between carrying the substrate P1 to the upstream work position W1 of the first transport lane L1 and carrying the board P2 to the upstream work position W1 of the second transport lane L2 (the above-mentioned second case) However, the component mounting process by the first head unit 26A and the component mounting process by the second head unit 26B are started at the timing when the boards P1 and P2 are respectively carried into the respective upstream work positions W1 (FIG. 11). a)).

On the other hand, in the second mounting method, when the substrates P1 and P2 are simultaneously carried into the upstream work position W1 of each transport lane L1 and L2 (the above first case), the second mounting method The substrate P2 is in a waiting state for processing (FIG. 10(a)). In other words, the second head unit 26B is in an idle state. Also, there may be a time difference between carrying the substrate P1 to the upstream working position W1 of the first carrying lane L1 and carrying the substrate P2 to the upstream working position W1 of the second carrying lane L2 (in the above-mentioned second case). ), the board P2 that was brought in late is placed in a waiting state until the parts mounting process for the board P1 that was brought in first is completed (FIGS. 12(a) and 12(b)). In other words, the second head unit 26B is in an idle state.

Therefore, according to the first mounting method, the idle period of the first head unit or the second head unit is reduced compared to the second implementation method, and the asynchronous transport mounting in which situations like the first case and the second case are likely to occur is avoided. Therefore, according to this component mounting apparatus 1, the production capacity of the substrates P placed at the upstream work position W1 and the downstream work position W2 set in each of the two transport lanes L1 and L2 is effective. This greatly contributes to the improvement of

Furthermore, in this component mounting apparatus 1, when the selection of the first mounting method is restricted based on the production conditions of the board P, component mounting processing is performed on the board P based on the second mounting method. Therefore, component mounting processing can be performed using a component mounting method suitable for the production conditions of the board P.

Moreover, even if the first mounting method is possible, the first mounting method is not uniformly selected, but the cycle time for each mounting method is calculated in advance, and the component mounting method with the shortest cycle time is ultimately selected. Once selected, component mounting processing is performed based on the selected component mounting method. Therefore, according to this component mounting apparatus 1, the reliability of the selected component mounting method is high, and this also contributes to improving the production capacity of the board P.

It should be noted that the component mounting apparatus 1 and the above-described component mounting method performed by the component mounting apparatus 1 described above are examples of preferred embodiments of the component mounting apparatus and component mounting method according to the present invention. , the specific structure and method thereof can be changed as appropriate without departing from the gist of the present invention.

1 Component mounting device 4 Control section (lower control section)
21 First board transfer conveyor 22 Second board transfer conveyor 24A First component supply unit (first component supply section)
24B Second parts supply unit (second parts supply section)
26A First head unit 26B Second head unit 30 Head unit drive mechanism (drive section)
51 Arithmetic processing unit 52 Storage unit 53 Motor control unit 54 Image processing unit 55 Communication unit 100 Management device (upper control unit)
L1 1st transport lane L2 2nd transport lane

Claims (8)

a first transport lane in which the substrate is transported, and in which an upstream work position and a downstream work position are set;
A second transport lane that is arranged parallel to the first transport lane and transports the substrate independently of the first transport lane, and has an upstream work position and a downstream work position. and,
a first component supply section located outside the first transport lane;
a second component supply section located outside the second transport lane;
a first head unit that holds components supplied by the first component supply section and mounts them on a board;
a second head unit that holds the components supplied by the second component supply section and mounts them on the board;
a drive unit that independently drives the first head unit and the second head unit;
A control unit that controls the drive unit,
The control unit includes:
Regarding the upstream work position, the first head unit mounts the component on the board placed at the upstream work position of the first transport lane, and the second head unit mounts the component on the board located at the upstream work position of the first transport lane. While performing parallel mounting in which components are mounted on a board placed at the upstream working position,
Regarding the downstream work position, the second head unit mounts the component on the board placed at the downstream work position of the first transport lane, and the first head unit mounts the component on the board located at the downstream work position of the second transport lane. A component mounting apparatus, characterized in that the component is mounted on a board placed at the downstream work position, and performs cross mounting. The component mounting apparatus according to claim 1,
A component mounting method in which the parallel mounting is performed on the board disposed at the upstream working position and the cross mounting is performed on the board disposed at the downstream working position is defined as a first mounting method. In addition, when the control unit is defined as a lower control unit,
The component mounting apparatus further includes a higher control unit that selects either the first mounting method or a second mounting method other than the first mounting method as the component mounting method executed by the lower control unit based on production conditions of the board,
The lower control unit is configured to execute a component mounting method selected by the upper control unit from the first mounting method or the second mounting method,
In the second mounting method, the first head unit mounts a component on a board placed at the upstream working position of each of the first transport lane and the second transport lane; A component mounting apparatus characterized in that the component mounting system employs a component mounting method in which the second head unit mounts components onto a substrate placed at the downstream work position of each of the second transport lanes. The component mounting apparatus according to claim 2,
When it is assumed that the upper control unit mounts the component on the board based on the first mounting method,
A component on the board placed at the downstream working position and which was mounted first at the upstream working position interferes with the first head unit or the second head unit during the cross mounting. The first condition is to
a second condition that the first head unit or the second head unit cannot take out the component in relation to a component supply position by the first component supply section or the second component supply section;
If any one of the third conditions that the component cannot be mounted at the target position is satisfied in relation to the movable area of the first head unit or the second head unit, the second mounting A component mounting device characterized by selecting a method. The component mounting apparatus according to claim 3,
If none of the first to third conditions are satisfied, the upper control unit calculates the cycle time when each of the first mounting method and the second mounting method is executed, and determines that the cycle time is short. A component mounting device characterized by selecting a component mounting method. A first transport lane in which a substrate is transported and in which an upstream work position and a downstream work position are set; and a first transport lane that is arranged parallel to the first transport lane. A second transport lane that independently transports substrates and has an upstream work position and a downstream work position, and a first component supply section that is disposed outside the first transport lane. a second component supply section disposed outside the second transport lane; a first head unit that holds and mounts the components supplied by the first component supply section on the board; and the second component supply section. A component mounting method in a component mounting apparatus, comprising: a second head unit that holds components supplied by a section and mounts them on a board;
Regarding the upstream work position, the first head unit mounts the component on the board placed at the upstream work position of the first transport lane, and the second head unit mounts the component on the board located at the upstream work position of the first transport lane. While performing parallel mounting in which components are mounted on a board placed at the upstream working position,
Regarding the downstream work position, the second head unit mounts the component on the board placed at the downstream work position of the first transport lane, and the first head unit mounts the component on the board located at the downstream work position of the second transport lane. A component mounting method comprising: mounting a component on a board placed at the downstream work position, performing cross mounting. In the component mounting method according to claim 5,
A component mounting method in which the parallel mounting is performed on a board located at the upstream working position and the cross mounting is performed on a board located at the downstream working position is defined as a first mounting method. ,
Each of the first transport lane and the second transport lane mounts a component on a board disposed at the upstream working position by the first head unit, while each of the first transport lane and the second transport lane When a component mounting method in which components are mounted by the second head unit on a board disposed at the downstream work position is defined as a second mounting method,
A component mounting method comprising: selecting either the first mounting method or the second mounting method based on production conditions of the board, and mounting components on the board based on the selected component mounting method. In the component mounting method according to claim 6,
Assuming that components are mounted on the board based on the first mounting method,
A component on the board placed at the downstream working position and which was mounted first at the upstream working position interferes with the first head unit or the second head unit during the cross mounting. The first condition is to
a second condition that the first head unit or the second head unit cannot take out the component in relation to a component supply position by the first component supply section or the second component supply section;
If any one of the third conditions that the component cannot be mounted at the target position is satisfied in relation to the movable area of the first head unit or the second head unit, the second mounting A component mounting method characterized by selecting a method. In the component mounting method according to claim 7,
If none of the first to third conditions are satisfied, calculate the cycle time when executing each of the first mounting method and the second mounting method, and select the component mounting method with the shortest cycle time. , a component mounting method characterized by: