JP2023546194A5 - - Google Patents

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Publication number
JP2023546194A5
JP2023546194A5 JP2023524076A JP2023524076A JP2023546194A5 JP 2023546194 A5 JP2023546194 A5 JP 2023546194A5 JP 2023524076 A JP2023524076 A JP 2023524076A JP 2023524076 A JP2023524076 A JP 2023524076A JP 2023546194 A5 JP2023546194 A5 JP 2023546194A5
Authority
JP
Japan
Prior art keywords
optical
substrate
waveguide
assembly according
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023524076A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023546194A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2021/058599 external-priority patent/WO2022084767A1/en
Publication of JP2023546194A publication Critical patent/JP2023546194A/ja
Publication of JP2023546194A5 publication Critical patent/JP2023546194A5/ja
Pending legal-status Critical Current

Links

JP2023524076A 2020-10-20 2021-09-21 縁部結合のための光相互接続 Pending JP2023546194A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063093984P 2020-10-20 2020-10-20
US63/093,984 2020-10-20
PCT/IB2021/058599 WO2022084767A1 (en) 2020-10-20 2021-09-21 Optical interconnect for edge coupling

Publications (2)

Publication Number Publication Date
JP2023546194A JP2023546194A (ja) 2023-11-01
JP2023546194A5 true JP2023546194A5 (https=) 2024-09-30

Family

ID=77951775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023524076A Pending JP2023546194A (ja) 2020-10-20 2021-09-21 縁部結合のための光相互接続

Country Status (4)

Country Link
US (1) US20240019638A1 (https=)
JP (1) JP2023546194A (https=)
CN (1) CN116324550A (https=)
WO (1) WO2022084767A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11693169B2 (en) * 2021-03-08 2023-07-04 Mellanox Technologies, Ltd. Silicon photonics collimator for wafer level assembly
US20260099017A1 (en) * 2022-09-28 2026-04-09 3M Innovative Properties Company Stacked Ferrules for On-Board Optical Interconnects
CN119335651A (zh) * 2023-07-18 2025-01-21 联华电子股份有限公司 硅光子结构及其制造方法
US20250102737A1 (en) * 2023-09-22 2025-03-27 Mellanox Technologies, Ltd. Connector for optical waveguide arrays
WO2026047470A1 (en) * 2024-08-29 2026-03-05 3M Innovative Properties Company Unitary optical ferrule and optical assembly

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62298940A (ja) * 1986-06-18 1987-12-26 Seiko Epson Corp 光ピツクアツプ
JP3357979B2 (ja) * 1997-03-10 2002-12-16 日本航空電子工業株式会社 光波長合分波器
US7050678B1 (en) * 1998-08-28 2006-05-23 Fujikura Ltd. Optical module, optical element attachment method, and receptacle-fitted optical module
GB2379748B (en) * 2001-06-22 2003-09-10 Bookham Technology Plc An optical chip with an optically conductive element
JP3791394B2 (ja) * 2001-11-01 2006-06-28 日本電気株式会社 光導波路基板
WO2006035499A1 (ja) * 2004-09-29 2006-04-06 Hitachi Chemical Co., Ltd. 光電気集積回路素子およびそれを用いた伝送装置
WO2007076888A1 (en) * 2005-12-30 2007-07-12 Fci Optical coupling device
JP2008015224A (ja) * 2006-07-06 2008-01-24 Namiki Precision Jewel Co Ltd 光接続装置と実装方法
JP4764373B2 (ja) * 2007-04-13 2011-08-31 日本電信電話株式会社 光導波回路およびその作製方法
EP2508925B1 (de) * 2011-04-07 2013-06-12 Rosenberger-OSI GmbH & Co. OHG Optisches Kopplungssystem für zwei Lichtwellenleiter
US10146009B2 (en) * 2013-07-04 2018-12-04 Mellanox Technologies, Ltd. Silicon photonics connector
US9223099B2 (en) * 2013-09-27 2015-12-29 Alcatel Lucent Optical device
JP6728639B2 (ja) * 2015-11-10 2020-07-22 富士通株式会社 光配線接続構造、及び光配線接続方法
CN107346053A (zh) * 2016-05-08 2017-11-14 迈络思科技有限公司 硅光子连接器
US10209452B1 (en) * 2018-03-12 2019-02-19 Cloud Light Technology Limited Method for fabricating silicon photonics package, active alignment method for light coupling, and silicon photonics package
IT201800005891A1 (it) * 2018-05-31 2019-12-01 Procedimento per realizzare un dispositivo per accoppiamento adiabatico, dispositivo e sistema corrispondenti
US11644618B2 (en) * 2018-06-22 2023-05-09 Apple Inc. Discrete optical unit on a substrate of an integrated photonics chip
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JP7528213B2 (ja) * 2020-06-26 2024-08-05 京セラ株式会社 光導波路パッケージ、発光装置および投影システム

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