JP2023537438A - Detection method and detection device - Google Patents

Abstract

The present disclosure sets the anode end or cathode end of each light emitting diode in a display panel to a high impedance state, collects the end voltage of the cathode end of each light emitting diode, and changes the end voltage from the display device. and determining whether a point defect in the drive circuit or the display panel is present. In an embodiment of the present disclosure, by setting the anode end or cathode end of each light emitting diode in the display panel to a high impedance state, the position of a point defect can be accurately and quickly determined from a change in end voltage, and the display device can improve the manufacturing process. [Selection diagram] Figure 1

Description

TECHNICAL FIELD The present disclosure relates to the technical field of panel detection, and more particularly to a detection method and apparatus.

With the continuous development of science and technology, people's living standards are constantly improving, and various types of electronic devices with display functions are becoming more and more popular. However, current displays often have point defects that cause unexpected bright spots and black spots. There are various causes of point defects, and the related art cannot accurately and quickly determine the position of the point defect or the process stage in which the point defect occurs.

In view of the above, the present disclosure provides a detection method for detecting the position of a point defect and the process stage in which the point defect occurs in a display device including a drive circuit and a display panel including a plurality of light emitting diodes. There is
setting an anode terminal or a cathode terminal of each light emitting diode in the display panel to a high impedance state;
collecting the voltage across the cathode end of each light emitting diode;
and identifying whether a point defect in the display device is in the drive circuit or in the display panel from the change in the terminal voltage.

In one possible embodiment, the detection method further comprises identifying whether the point defect in the display device occurred during the manufacturing stage of the drive circuit or during the deposition stage of the display panel.

In one possible embodiment, from the change in the terminal voltage, it is determined whether the point defect in the display device is in the drive circuit or in the display panel, and the point defect in the display device is determined during the manufacturing stage of the drive circuit. or during the display panel deposition stage,
determining that the point defect in the display device is in the display panel when the terminal voltage changes higher than the first reference voltage within a first preset time; including identifying that it occurred in

In one possible embodiment, from the change in the terminal voltage, it is determined whether the point defect in the display device is in the drive circuit or in the display panel, and the point defect in the display device is determined during the manufacturing stage of the drive circuit. or during the display panel deposition stage,
If the end voltage is lower than a second reference voltage within a second preset time, identifying a point defect in the display device as being in the driving circuit, wherein the point defect in the display device occurs during the manufacturing stage of the driving circuit. including identifying that
Here, the second preset time is longer than the first preset time, and the second reference voltage is lower than the first reference voltage.

In one possible embodiment, said detection method comprises:
When it is specified that the point defect in the display device is in the drive circuit, it is further determined from the change in the terminal voltage that the point defect has occurred in the drive circuit itself or in the connection portion between the drive circuit and the display panel. It further includes identifying whether the misalignment has occurred.

In one possible embodiment, said detection method comprises:
Further comprising determining a point defect level of the display device by varying voltage values of the first reference voltage and the second reference voltage.

In one possible embodiment, said detection method comprises:
determining the magnitude of change in the end voltage per unit time;
and determining a point defect level of the display device based on the magnitude of the change in the end voltage.

According to another aspect of the present disclosure, there is provided a detection apparatus for detecting the location of a point defect and the process stage in which the point defect occurs in a display device including a driving circuit and a display panel including a plurality of light emitting diodes. hand,
a setting module for setting an anode terminal or a cathode terminal of each light emitting diode in the display panel to a high impedance state;
a collection module for collecting the end voltage of the cathode end of each light emitting diode;
an identification module connected to the collection module for identifying, from the change in the terminal voltage, whether a point defect in the display device is in the driving circuit or in the display panel. .

In one possible embodiment, said specific module comprises:
timing means for timing when the end voltage is collected;
determining that the point defect in the display device is in the display panel when the terminal voltage changes higher than the first reference voltage within a first preset time; and identifying means for identifying that the occurrence of the

In one possible embodiment, said identifying means further comprises:
If the end voltage is lower than a second reference voltage within a second preset time, identifying a point defect in the display device as being in the driving circuit, wherein the point defect in the display device occurs during the manufacturing stage of the driving circuit. identified that
Here, the second preset time is longer than the first preset time, and the second reference voltage is lower than the first reference voltage.

In one possible embodiment, said identifying means comprises:
a comparator having a positive input end connected to the cathode end of the light emitting diode, a negative input end receiving a reference voltage, and for comparing the end voltage with the reference voltage;
a capacitor having one end connected to the cathode end of the light emitting diode and the other end grounded.

In one possible embodiment, the display panel comprises at least one of an organic light emitting diode display panel, a quantum dot light emitting diode display panel, a mini light emitting diode display panel and a micro light emitting diode display panel.

In an embodiment of the present disclosure, the anode end or cathode end of each light emitting diode in the display panel is set to a high impedance state, the end voltage of the cathode end of each light emitting diode is collected, and from the change in the end voltage, the display By identifying whether a point defect in the device is in the drive circuit or in the display panel, the location of the point defect can be accurately and quickly determined to improve the manufacturing process of the display device.

Other features and aspects of the present disclosure will become apparent from the detailed description of illustrative examples with reference to the following drawings.

The drawings included in and forming a part of the specification, together with the specification, illustrate exemplary embodiments, features and aspects of the disclosure and are used to explain the principles of the disclosure. .
4 shows a flow chart of a detection method according to an embodiment of the present disclosure; 1 shows a block diagram of a detection device and a display device according to an embodiment of the present disclosure; FIG. 1 shows a schematic diagram of a detection device and a display device according to an embodiment of the present disclosure; FIG.

Various illustrative embodiments, features, and aspects of the present disclosure are described in detail below with reference to the drawings. In the drawings, the same reference numerals represent elements with the same or similar functions. Although the drawings illustrate various aspects of the illustrative embodiments, the drawings are not necessarily to scale unless otherwise specified.

In the description of the present disclosure, "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", " The orientations or positional relationships indicated by terms such as "top", "bottom", "inside", and "outside" are based on the orientations or positional relationships shown in the drawings for convenience and simplification of the description of the present disclosure. It is to be understood that it is not intended to express or imply that such devices or components have a particular orientation or that they must be configured or operated in a particular orientation. , should not be understood as a limitation to the present disclosure.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and either express or imply their relative importance or imply the number of technical features shown. should not be understood as specific to Thus, reference to a feature defined as "first" or "second" may either explicitly or implicitly include one or more of such features. In the description of the present disclosure, "plurality" means two or more unless otherwise specified.

In the present disclosure, terms such as "attach," "tie," "connect," and "fix" should be understood broadly, unless specifically defined or limited. For example, it may be a fixed connection, a detachable connection or an integration. Moreover, it may be a mechanical connection or an electrical connection. In addition, they may be directly connected, may be indirectly connected via an intermediate medium, may be internal communication between two elements, or may be an interaction relationship between two elements. A person skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific situation.

As used herein, the term "exemplary" means "serving as an example, example, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or superior to other embodiments.

Also, numerous specific details are set forth in the following specific embodiments in order to better describe the present disclosure. It should be understood by those skilled in the art that the present disclosure may be similarly practiced without some of the specific details. In some embodiments, detailed descriptions of methods, means, elements and circuits that are well known to those skilled in the art are not provided in order to emphasize the spirit of the present disclosure.

Referring to FIG. 1, FIG. 1 shows a flowchart of a detection method according to one embodiment of the present disclosure.

Referring to FIG. 2, FIG. 2 shows a block diagram of a detection device and a display device according to one embodiment of the present disclosure.

Referring to FIG. 3, FIG. 3 shows a schematic diagram of a detection device and a display device according to one embodiment of the present disclosure.

The detection method is a display device 5 (shown in FIG. 2) having a drive circuit 51 and a display panel 52 including a plurality of light emitting diodes 521 (shown in FIG. 3). is used to detect the process step at which the

As shown in FIG. 1, the detection method comprises:
a step S11 of setting the anode end or cathode end of each light emitting diode 521 in the display panel 52 to a high impedance state;
a step S12 of collecting the end voltage of the cathode end of each light emitting diode 521;
a step S13 of identifying whether the point defect in the display device 5 is in the drive circuit 51 or in the display panel 52 from the change in the terminal voltage.

In an embodiment of the present disclosure, the anode end or cathode end of each light emitting diode in the display panel is set to a high impedance state, the end voltage of the cathode end of each light emitting diode is collected, and from the change in the end voltage, the display By identifying whether a point defect in the device is in the drive circuit or in the display panel, the location of the point defect can be accurately and quickly determined to improve the manufacturing process of the display device.

In one possible embodiment, the detection method further comprises identifying whether the point defect in the display device 5 occurred during the manufacturing stage of the drive circuit 51 or during the deposition stage of the display panel 52 .

Thus, embodiments of the present disclosure can also accurately and quickly determine the location of point defects to improve the manufacturing process of display devices.

In one example, when manufacturing a display device, the manufacturing process capabilities of the two companies are combined so that the driving circuit is first manufactured by the FAB (Fabrication, another name for chip processing factory) process, and then the light emitting diode is deposited by the panel process. need to match. Here, the drive circuit 51 may be called a pixel circuit or a backplane circuit, and is used to drive each light-emitting diode in the display panel so as to emit light.

In one example, the light emitting diodes in the display panel are LEDs (Light Emitting Diodes), MiniLEDs (Mini Light Emitting Diodes), MicroLEDs (Micro Light Emitting Diodes), OLEDs (Organic Light-Emitting Diodes). Diode, organic light emitting diode).

In one possible embodiment, setting the anode end or cathode end of each light emitting diode 521 in the display panel 52 to a high impedance state in step S11 may be realized in various ways.

In one example, the power supply generated inside the drive circuit may be set as the power supply for each light emitting diode. In this case, in the embodiments of the present disclosure, the anode end or cathode end of each light emitting diode 521 in the display panel 52 can be directly set to a high impedance state by the parameters of the configuration register.

In one example, an external power source may be set as the power source for each light emitting diode. In this case, the anode terminal itself or the cathode terminal itself of each light emitting diode 521 in the display panel 52 becomes a high impedance state.

In one example, it may be implemented with a grounded capacitor. Each light emitting diode 521 is grounded through a capacitor C, as shown in FIG. A grounded capacitor has a large impedance at low frequencies, and the lower the frequency, the larger the impedance. Therefore, the anode end or cathode end of each light emitting diode 521 in the display panel 52 can be set to a high impedance state in this way. can.

Of course, the above description of setting the anode end or cathode end of each light emitting diode 521 in the display panel 52 to a high impedance state is exemplary and considered to limit the embodiments of the present disclosure. shouldn't. In other embodiments, those skilled in the art may use other methods to set the anode end or cathode end of each light emitting diode 521 in the display panel 52 to a high impedance state.

In one possible embodiment, if there are multiple point defects in the display, the presence of the point defects will change the equivalent resistance of the display (one point defect causes one equivalent resistance). , the total equivalent resistance increases when multiple point defects occur). Point defects at different locations and at different levels will lead to large differences in equivalent resistance, which will lead to significant differences in the RC response of the display device, in which case the voltage across the cathode end will have different changing characteristics. will have. In the embodiment of the present disclosure, such a change characteristic is used to identify whether the point defect in the display device 5 is in the driving circuit 51 or the display panel 52, and the point defect in the display device 5 is identified. Identify whether the defect occurred during the manufacturing stage of the drive circuit 51 or during the deposition stage of the display panel 52 .

In one example, when the display device is normal, the equivalent unit impedance of the display device is about 0.1 GΩ to 1 GΩ, the time constant (RC time constant) R is slightly large, and VSS rises gently.

In one example, when there is a short circuit due to a point defect in the display device, the equivalent unit impedance is much smaller than the normal unit impedance, so the time constant R changes greatly, and the cathode end voltage VSS becomes VDD , and the higher the level of point defects (the larger the number), the faster the rising speed of the end voltage and the higher the end voltage value.

In one possible embodiment, in step S13, from the change in the terminal voltage, identify whether the point defect in the display device 5 is in the driving circuit 51 or the display panel 52, and detect the point defect in the display device 5. Identifying whether the defect occurred at the manufacturing stage of the drive circuit 51 or at the deposition stage of the display panel 52 is
If the terminal voltage changes higher than the first reference voltage within a first preset time, identify that the point defect in the display device 5 is in the display panel 52, and determine that the point defect in the display device 5 is in the display panel. It may include identifying that it occurred at the deposition step of 52 .

In one possible embodiment, in step S13, from the change in the terminal voltage, identify whether the point defect in the display device 5 is in the driving circuit 51 or the display panel 52, and detect the point defect in the display device 5. Identifying whether the defect occurred at the manufacturing stage of the drive circuit 51 or at the deposition stage of the display panel 52 is
If the terminal voltage is lower than the second reference voltage within a second preset time, identifying that the point defect in the display device 5 is in the driving circuit 51 , and the point defect in the display device 5 is in the driving circuit 51 . including identifying that it occurred during the manufacturing stage;
Here, the second preset time may be longer than the first preset time, and the second reference voltage may be lower than the first reference voltage.

In one example, in the case of equivalent resistance due to point defects formed by deposition anomalies, the end voltage VSS is pulled up, and the pull-up charge time follows the RC rule, the smaller the R, the faster the charge and the higher the pull-up. be. In the case of manufacturing anomalies on the FAB side or misalignment of process connections, the terminal voltage VSS rises gently and is clearly different from the equivalent resistance due to deposition anomalies.

For this reason, in the embodiments of the present disclosure, a timer is used to measure the duration for which the end voltage is collected, the measured time is compared with the first preset time and the second preset time, and the end voltage is If the voltage changes higher than the first reference voltage within a period of time, the point defect in the display device 5 is identified as being in the display panel 52, and the point defect in the display device 5 is determined to have occurred during the deposition step of the display panel 52. determining that the point defect in the display device 5 is in the driving circuit 51 when the terminal voltage is lower than the second reference voltage within a second preset time, and determining that the point defect in the display device 5 is in the driving circuit 51; It can be identified as having occurred during the manufacturing stage of the circuit 51 .

In one possible embodiment, said detection method comprises:
When it is specified that the point defect in the display device 5 is in the drive circuit 51, it is further determined from the change in the terminal voltage that the point defect has occurred in the drive circuit 51 itself, or between the drive circuit 51 and the display panel. It may further include identifying whether it has occurred at a location of misalignment of the connection.

In the embodiment of the present disclosure, it is further specified from the change in the terminal voltage whether a point defect has occurred in the drive circuit 51 itself or in a misaligned portion of the connection portion between the drive circuit 51 and the display panel. Without limiting the specific implementation method, those skilled in the art may select and implement the method in the related art according to the actual situation or need.

In one possible embodiment, said detection method comprises:
The method may further include identifying a point defect level of the display device 5 by varying voltage values of the first reference voltage and the second reference voltage.

As described above, different numbers of point defects lead to different rising speeds and levels of the end voltage. . In the embodiment of the present disclosure, the point defect level can be identified by changing the voltage values of the first reference voltage and the second reference voltage and identifying the voltage level reached by the terminal voltage during the corresponding period. .

In one example, in embodiments of the present disclosure, a correspondence between point defect levels and voltages may be preset. If it is specified that the end voltage reaches the reference voltage within the unit time (eg, time constant R) or the first preset time or the second preset time, in the embodiment of the present disclosure, the reached reference voltage and the corresponding relationship A point defect level can be identified based on Of course, embodiments of the present disclosure are not so limited. For example, in the embodiment of the present disclosure, the voltage value of the end voltage within the unit time or the first preset time or the second preset time is directly specified by the voltage detection circuit, and the specified voltage value and voltage and the point defect level are A point defect level may be identified based on the correspondence.

In one possible embodiment, said detection method comprises:
determining the magnitude of change in the end voltage per unit time;
and determining a point defect level of the display device 5 based on the magnitude of the change in the terminal voltage.

In one example, the point defect levels may correspond to different numbers of point defects, such that a higher point defect level corresponds to a larger number of point defects.

Of course, the above description is exemplary and the embodiments of the present disclosure are not limiting in this respect.

In the embodiments of the present disclosure, by measuring the electrical characteristics of the end voltage VSS or the end voltage VDD and confirming the level and number of point defects in the display device, bright spots and black spots are improved, and the quality of the display device can be improved.

An exemplary description of the detection device will be given below.

According to another aspect of the present disclosure, a detection apparatus is provided for detecting the location of a point defect in the display device 5 and the process stage at which the point defect occurred.

As shown in FIG. 2, the display device 5 comprises a driving circuit 51 and a display panel 52 including a plurality of light emitting diodes 521, and the detection device comprises:
a setting module 10 for setting the anode end or cathode end of each light emitting diode 521 in the display panel 52 to a high impedance state;
a collection module 20 for collecting the end voltage of the cathode end of each light emitting diode 521;
an identification module 30 connected to the collection module 20 for identifying whether a point defect in the display device 5 is in the drive circuit 51 or in the display panel 52 from the change in the terminal voltage. .

In an embodiment of the present disclosure, the anode end or cathode end of each light emitting diode in the display panel is set to a high impedance state, the end voltage of the cathode end of each light emitting diode is collected, and from the change in the end voltage, the display By identifying whether a point defect in the device is in the drive circuit or in the display panel, the location of the point defect can be accurately and quickly determined to improve the manufacturing process of the display device.

The embodiments of the present disclosure do not limit specific implementation methods of the setting module 10 and the collection module 20 .

In one possible embodiment, said identification module 30
timing means for timing when the end voltage is collected;
If the terminal voltage changes higher than the first reference voltage within a first preset time, identify that the point defect in the display device 5 is in the display panel 52, and determine that the point defect in the display device 5 is in the display panel. and identification means for identifying that the deposition step of 52 occurred.

In one example, the timing means may include a timer that starts timing and obtains the clocked time when collection of the end voltage is started.

In one possible embodiment, said identifying means further comprises:
If the terminal voltage is lower than the second reference voltage within a second preset time, identifying that the point defect in the display device 5 is in the driving circuit 51 , and the point defect in the display device 5 is in the driving circuit 51 . identified as having occurred during the manufacturing process,
Here, the second preset time may be longer than the first preset time, and the second reference voltage may be lower than the first reference voltage.

In one example, the identification module 30 may further include computing means. The computing means may comprise a processing unit. Said units may include, but are not limited to, single processors, discrete devices, or combinations thereof. The processor may comprise a command execution capable controller in an electronic device, such as one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processors (DSPDs), programmable It may be implemented by any suitable such as a logic device (PLD), field programmable gate array (FPGA), controller, microcontroller, microprocessor or other electronic components. Within the processor, such executable commands may be executed by hardware circuits such as logic gates, switches, Application Specific Integrated Circuits (ASICs), programmable logic controllers and embedded microcontrollers. .

In one example, identification module 30 may further include storage means in which each executable command and data of the present disclosure are stored. The storage means may include a computer readable storage medium. A computer-readable storage medium may be a tangible device capable of holding and storing commands for use by a command execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (non-exhaustive list) of computer readable storage media include portable computer disks, hard disks, random access memory (RAM), read only memory (ROM), erasable programmable read only memory (EPROM) or flash memory), static random access memory (SRAM), programmable read-only memory (PROM), portable compact disc read-only memory (CD-ROM), digital versatile disc (DVD), memory stick, floppy disk, e.g. are stored, mechanical encoding devices such as punch cards or in-slot protrusion structures, and any suitable combination of the above.

In one example, the computing means acquires executable commands and data in the storage means to determine, from the change in the end voltage, whether there is a point defect in the display device 5 in the drive circuit 51 or in the display panel 52. and identify whether the point defect in the display device 5 occurred during the manufacturing stage of the drive circuit 51 or during the vapor deposition stage of the display panel 52".

In one possible embodiment, as shown in Figure 3, said identifying means comprises:
a comparator CMP having a positive input terminal connected to the cathode terminal VSS of the light emitting diode 521, a negative input terminal receiving a reference voltage VREF, and comparing the terminal voltage VSS and the reference voltage VREF;
and a capacitor C, one end of which is connected to the cathode end of the light emitting diode 521 and the other end of which is grounded.

In one example, as shown in FIG. 3, each of the light emitting diodes 521 may have driving means 511 for driving the light emitting diodes 521 to emit light based on received data.

In one possible embodiment, the display panel 52 comprises at least one of an organic light emitting diode display panel, a quantum dot light emitting diode display panel, a mini light emitting diode display panel and a micro light emitting diode display panel.

The detection device is a device corresponding to the detection method, and the description of the detection method can be referred to for a specific description thereof, and redundant description will be omitted here.

In an embodiment of the present disclosure, the anode end or cathode end of each light emitting diode in the display panel is set to a high impedance state, the end voltage of the cathode end of each light emitting diode is collected, and from the change in the end voltage, the display Identifying whether the point defect in the device is in the driving circuit or in the display panel, and identifying whether the point defect in the display device occurred during the manufacturing stage of the driving circuit or during the deposition stage of the display panel. By doing so, it is possible to accurately and quickly determine the position of the point defect and the process stage in which the point defect occurs, thereby improving the manufacturing process of the display device.

While embodiments of the present disclosure have been described above, the above description is illustrative only and is not intended to be exhaustive or limited to the embodiments shown. Various modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of each described embodiment. The terms chosen herein are used to suitably interpret the principles, practical applications, or technical improvements in the market of each embodiment, or to allow others skilled in the art to understand each embodiment presented herein. belongs to.

Claims (12)

A detection method for detecting the position of a point defect and the process stage in which the point defect occurs in a display device including a driving circuit and a display panel including a plurality of light emitting diodes,
setting an anode terminal or a cathode terminal of each light emitting diode in the display panel to a high impedance state;
collecting the voltage across the cathode end of each light emitting diode;
and identifying whether a point defect in the display device is in the drive circuit or in the display panel from the change in the terminal voltage. 2. The detection method as claimed in claim 1, further comprising identifying whether the point defect in the display device is generated during the manufacturing stage of the driving circuit or during the deposition stage of the display panel. From the change in the terminal voltage, it is determined whether the point defect in the display device is in the driving circuit or in the display panel, and whether the point defect in the display device occurred in the manufacturing stage of the driving circuit or the display panel. Identifying what occurred during the deposition stage of
determining that the point defect in the display device is in the display panel when the terminal voltage changes higher than the first reference voltage within a first preset time; 3. The detection method of claim 2, comprising determining that the From the change in the terminal voltage, it is determined whether the point defect in the display device is in the driving circuit or in the display panel, and whether the point defect in the display device occurred in the manufacturing stage of the driving circuit or the display panel. Identifying what occurred during the deposition stage of
If the end voltage is lower than a second reference voltage within a second preset time, identifying a point defect in the display device as being in the driving circuit, wherein the point defect in the display device occurs during the manufacturing stage of the driving circuit. including identifying that
4. The method of claim 3, wherein the second preset time is longer than the first preset time, and the second reference voltage is lower than the first reference voltage. When it is specified that the point defect in the display device is in the drive circuit, it is further determined from the change in the terminal voltage that the point defect has occurred in the drive circuit itself or in the connection portion between the drive circuit and the display panel. 5. The detection method according to claim 4, further comprising identifying whether a misalignment has occurred. 5. The detection method of claim 4, further comprising identifying a point defect level of the display device by varying voltage values of the first reference voltage and the second reference voltage. determining the magnitude of change in the end voltage per unit time;
2. The detection method of claim 1, further comprising identifying a point defect level of the display device based on the magnitude of the change in the terminal voltage. A detection device for detecting the position of a point defect and the process stage in which the point defect occurs in a display device comprising a driving circuit and a display panel including a plurality of light emitting diodes,
a setting module for setting an anode terminal or a cathode terminal of each light emitting diode in the display panel to a high impedance state;
a collection module for collecting the end voltage of the cathode end of each light emitting diode;
a specific module connected to the collection module for identifying whether a point defect in the display device is in the drive circuit or in the display panel from the change in the terminal voltage. detection device. The specific module is
timing means for timing when the end voltage is collected;
determining that the point defect in the display device is in the display panel when the terminal voltage changes higher than the first reference voltage within a first preset time; 9. The detection device according to claim 8, comprising identification means for identifying that the occurrence of the . The identifying means further includes:
If the end voltage is lower than a second reference voltage within a second preset time, identifying a point defect in the display device as being in the driving circuit, wherein the point defect in the display device occurs during the manufacturing stage of the driving circuit. identified that
10. The detection device of claim 9, wherein the second preset time is longer than the first preset time, and the second reference voltage is lower than the first reference voltage. The specifying means is
a comparator having a positive input end connected to the cathode end of the light emitting diode, a negative input end receiving a reference voltage, and for comparing the end voltage with the reference voltage;
11. The detection device according to claim 9 or 10, comprising a capacitor having one end connected to the cathode end of the light emitting diode and the other end grounded. 9. The sensing device of claim 8, wherein the display panel comprises at least one of an organic light emitting diode display panel, a quantum dot light emitting diode display panel, a mini light emitting diode display panel and a micro light emitting diode display panel. .

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