JP2023535754A - 銅張積層板及びその形成方法 - Google Patents
銅張積層板及びその形成方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 112
- 239000000945 filler Substances 0.000 claims abstract description 399
- 239000000463 material Substances 0.000 claims abstract description 281
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 183
- 238000000576 coating method Methods 0.000 claims abstract description 178
- 239000011248 coating agent Substances 0.000 claims abstract description 177
- 239000000919 ceramic Substances 0.000 claims abstract description 137
- 229910052802 copper Inorganic materials 0.000 claims abstract description 107
- 239000010949 copper Substances 0.000 claims abstract description 107
- 239000011889 copper foil Substances 0.000 claims abstract description 76
- 239000011159 matrix material Substances 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 239000011347 resin Substances 0.000 claims abstract description 71
- 239000002243 precursor Substances 0.000 claims description 207
- 239000002245 particle Substances 0.000 claims description 137
- 229920005548 perfluoropolymer Polymers 0.000 claims description 46
- 238000005259 measurement Methods 0.000 claims description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 36
- 239000000203 mixture Substances 0.000 claims description 30
- 239000000377 silicon dioxide Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 9
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 32
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 24
- 229920009441 perflouroethylene propylene Polymers 0.000 description 24
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 24
- 239000004810 polytetrafluoroethylene Substances 0.000 description 24
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 20
- -1 ZrTi2O6 Inorganic materials 0.000 description 18
- 229920001577 copolymer Polymers 0.000 description 17
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 16
- 229910010293 ceramic material Inorganic materials 0.000 description 14
- 229920001774 Perfluoroether Polymers 0.000 description 12
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 12
- 239000002952 polymeric resin Substances 0.000 description 12
- 229920003002 synthetic resin Polymers 0.000 description 12
- 229920001897 terpolymer Polymers 0.000 description 7
- 229910002971 CaTiO3 Inorganic materials 0.000 description 6
- 229910017676 MgTiO3 Inorganic materials 0.000 description 6
- 229910002370 SrTiO3 Inorganic materials 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000004611 spectroscopical analysis Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/18—Homopolymers or copolymers of tetrafluoroethene
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
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- Chemical & Material Sciences (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (15)
- 銅張積層板であって、
銅箔層と、前記銅箔層を覆う誘電体コーティングと、を含み、前記誘電体コーティングが、
樹脂マトリックス成分と、
セラミックフィラー成分と、を含み、
前記セラミックフィラー成分が、第1のフィラー材料を含み、前記誘電体コーティングが、約20ミクロン以下の平均厚さを有する、銅張積層板。 - 前記第1のフィラー材料が、約10ミクロン以下の平均粒径を更に含む、請求項1に記載の銅張積層板。
- 前記第1のフィラー材料が、約5以下の粒径分布スパン(PSDS)を含み、PSDSが、(D90-D10)/D50に等しく、D90が、前記第1のフィラー材料のD90粒径分布測定値に等しく、D10が、前記第1のフィラー材料のD10粒径分布測定値に等しく、D50が、前記第1のフィラー材料のD50粒径分布測定値に等しい、請求項1に記載の銅張積層板。
- 前記第1のフィラー材料が、約10m2/g以下の平均表面積を更に含む、請求項1に記載の銅張積層板。
- 前記第1のフィラー材料が、シリカ系化合物を含む、請求項1に記載の銅張積層板。
- 前記第1のフィラー材料が、シリカを含む、請求項1に記載の銅張積層板。
- 前記樹脂マトリックスが、パーフルオロポリマーを含む、請求項1に記載の銅張積層板。
- 前記樹脂マトリックス成分の含有量が、前記誘電体コーティングの総体積に対して少なくとも約50体積%かつ約63体積%以下である、請求項1に記載の銅張積層板。
- 前記セラミックフィラー成分の含有量が、前記誘電体コーティングの総体積に対して少なくとも約30体積%かつ約57体積%以下である、請求項1に記載の銅張積層板。
- 前記第1のフィラー材料の含有量が、前記セラミックフィラー成分の総体積に対して少なくとも約80体積%かつ約100体積%以下である、請求項1に記載の銅張積層板。
- 前記誘電体コーティングが、約3.5以下の誘電正接(5GHz、20%RH)を含む、請求項1に記載の銅張積層板。
- 銅張積層板を備えるプリント回路基板であって、前記銅張積層板が、
銅箔層と、前記銅箔層を覆う誘電体コーティングと、を含み、前記誘電体コーティングが、
樹脂マトリックス成分と、
セラミックフィラー成分と、を含み、
前記セラミックフィラー成分が、第1のフィラー材料を含み、
前記誘電体コーティングが、20ミクロン以下の平均厚さを有する、プリント回路基板。 - 前記第1のフィラー材料が、約10ミクロン以下の平均粒径を更に含む、請求項12に記載のプリント回路基板。
- 前記第1のフィラー材料が、約5以下の粒径分布スパン(PSDS)を含み、PSDSが、(D90-D10)/D50に等しく、D90が、前記第1のフィラー材料のD90粒径分布測定値に等しく、D10が、前記第1のフィラー材料のD10粒径分布測定値に等しく、D50が、前記第1のフィラー材料のD50粒径分布測定値に等しい、請求項12に記載のプリント回路基板。
- 銅張積層板を形成する方法であって、前記方法が、
銅箔層を提供することと、
樹脂マトリックス前駆体成分とセラミックフィラー前駆体成分とを合わせて、形成混合物を形成することと、
前記形成混合物を、前記銅箔を覆う誘電体コーティングに形成することと、を含み、
前記誘電体コーティングが、約20ミクロン以下の平均厚さを有する、方法。
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US202063057667P | 2020-07-28 | 2020-07-28 | |
US63/057,667 | 2020-07-28 | ||
PCT/US2021/070954 WO2022026990A1 (en) | 2020-07-28 | 2021-07-26 | Copper-clad laminate and method of forming the same |
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US (1) | US20220039256A1 (ja) |
EP (1) | EP4190132A1 (ja) |
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KR (1) | KR20230049640A (ja) |
TW (1) | TWI833095B (ja) |
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TW202206286A (zh) | 2020-07-28 | 2022-02-16 | 美商聖高拜塑膠製品公司 | 介電基板及其形成方法 |
US11549035B2 (en) | 2020-12-16 | 2023-01-10 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
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DE69532491T2 (de) * | 1994-07-29 | 2004-12-02 | World Properties, Inc., Lincolnwood | Fluorpolymer-Verbundmaterialien mit zwei oder mehreren keramischen Füllern zur unabhängigen Kontrolle über Dimensionsstabilität und Dielektrizitätskonstante |
US20040109298A1 (en) * | 1998-05-04 | 2004-06-10 | Hartman William F. | Dielectric material including particulate filler |
DE102004010756A1 (de) * | 2004-03-05 | 2005-09-22 | Degussa Ag | Silanisierte Kieselsäuren |
WO2011007698A1 (ja) * | 2009-07-14 | 2011-01-20 | 花王株式会社 | 低誘電樹脂組成物 |
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EP4190132A1 (en) | 2023-06-07 |
TWI833095B (zh) | 2024-02-21 |
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