JP2023531194A5 - - Google Patents

Info

Publication number
JP2023531194A5
JP2023531194A5 JP2022577535A JP2022577535A JP2023531194A5 JP 2023531194 A5 JP2023531194 A5 JP 2023531194A5 JP 2022577535 A JP2022577535 A JP 2022577535A JP 2022577535 A JP2022577535 A JP 2022577535A JP 2023531194 A5 JP2023531194 A5 JP 2023531194A5
Authority
JP
Japan
Prior art keywords
approximately
crystalline material
formula
value
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022577535A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023531194A (ja
JP7745573B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2021/066028 external-priority patent/WO2021254989A1/en
Publication of JP2023531194A publication Critical patent/JP2023531194A/ja
Publication of JP2023531194A5 publication Critical patent/JP2023531194A5/ja
Application granted granted Critical
Publication of JP7745573B2 publication Critical patent/JP7745573B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022577535A 2020-06-17 2021-06-15 固有強誘電性Hf-Zr含有膜 Active JP7745573B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063040097P 2020-06-17 2020-06-17
US63/040,097 2020-06-17
PCT/EP2021/066028 WO2021254989A1 (en) 2020-06-17 2021-06-15 Inherently ferroelectric hf-zr containing films

Publications (3)

Publication Number Publication Date
JP2023531194A JP2023531194A (ja) 2023-07-21
JP2023531194A5 true JP2023531194A5 (https=) 2024-06-17
JP7745573B2 JP7745573B2 (ja) 2025-09-29

Family

ID=77050958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022577535A Active JP7745573B2 (ja) 2020-06-17 2021-06-15 固有強誘電性Hf-Zr含有膜

Country Status (8)

Country Link
US (1) US20230089523A1 (https=)
EP (1) EP4168606A1 (https=)
JP (1) JP7745573B2 (https=)
KR (1) KR20230028323A (https=)
CN (1) CN115516130A (https=)
IL (1) IL298113A (https=)
TW (1) TW202216606A (https=)
WO (1) WO2021254989A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220352379A1 (en) * 2021-04-29 2022-11-03 Taiwan Semiconductor Manufacturing Company Limited Ferroelectric memory devices having improved ferroelectric properties and methods of making the same
WO2023191981A1 (en) * 2022-03-29 2023-10-05 Tokyo Electron Limited Bilayer stack for a ferroelectric tunnel junction and method of forming
US12274068B2 (en) * 2022-05-09 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming ferroelectric memory device
EP4541155A1 (en) * 2022-07-20 2025-04-23 Versum Materials US, LLC Optimization of bottom electrode for the enhancement of ferroelectric performance in hafnia-based oxide with back-end-of-line (beol) compatible process
CN116133514A (zh) * 2023-03-03 2023-05-16 湘潭大学 一种改善叠层氧化铪基铁电薄膜性能的方法及其叠层铁电薄膜
TWI902171B (zh) * 2024-03-14 2025-10-21 國立成功大學 利用具極化場之基板的鐵電薄膜生產方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2432363B (en) 2005-11-16 2010-06-23 Epichem Ltd Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition
WO2007140813A1 (en) * 2006-06-02 2007-12-13 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method of forming high-k dielectric films based on novel titanium, zirconium, and hafnium precursors and their use for semiconductor manufacturing
DE102007002962B3 (de) * 2007-01-19 2008-07-31 Qimonda Ag Verfahren zum Herstellen einer dielektrischen Schicht und zum Herstellen eines Kondensators
CN107134487B (zh) * 2017-06-06 2020-07-14 湘潭大学 一种基于氧化铪的铁电栅结构及其制备工艺
WO2018231210A1 (en) * 2017-06-14 2018-12-20 Intel Corporation Thin film ferroelectric materials and methods of fabrication thereof
US10833150B2 (en) * 2018-07-11 2020-11-10 International Business Machines Corporation Fast recrystallization of hafnium or zirconium based oxides in insulator-metal structures
TWI809158B (zh) * 2018-07-26 2023-07-21 日商東京威力科創股份有限公司 針對半導體元件形成晶體穩定的鐵電性鉿鋯基膜的方法
US10707320B2 (en) * 2018-10-19 2020-07-07 Taiwan Semiconductor Manufacturing Co., Ltd. Field effect transistors with ferroelectric dielectric materials
JP7582672B2 (ja) * 2019-04-26 2024-11-13 国立大学法人東京科学大学 強誘電性膜の製造方法、強誘電性膜、及びその用途

Similar Documents

Publication Publication Date Title
JP2023531194A5 (https=)
JP4293359B2 (ja) 酸化膜の原子層堆積方法
TW516168B (en) Dielectric interface films and methods therefor
Niinistö et al. Atomic layer deposition of high‐k oxides of the group 4 metals for memory applications
JP6916297B2 (ja) 強誘電体材料としてのケイ素ドープ酸化ハフニウムの堆積のための新規配合物
TWI558719B (zh) 用於矽基薄膜的低溫ald之矽前驅物
JP5003978B2 (ja) アルカリ土類金属β‐ジケチミナート前駆体を用いた原子層堆積
JP7745573B2 (ja) 固有強誘電性Hf-Zr含有膜
US7772132B2 (en) Method for forming tetragonal zirconium oxide layer and method for fabricating capacitor having the same
JP2020511796A (ja) 強誘電体材料としてのケイ素ドープ酸化ハフニウムの堆積のための新規配合物
Rahtu et al. In situ mass spectrometry study on atomic layer deposition from metal (Ti, Ta, and Nb) ethoxides and water
JP2005537639A (ja) アルコールを用いて金属酸化物を形成するシステムおよび方法
Chang et al. Atomic tailoring of low-thermal-budget and nearly wake-up-free ferroelectric Hf0. 5Zr0. 5O2 nanoscale thin films by atomic layer annealing
JP5248508B2 (ja) ルテニウム含有膜の堆積方法
Choi et al. Reaction mechanism and film properties of the atomic layer deposition of ZrO2 thin films with a heteroleptic CpZr (N (CH3) 2) 3 precursor
Song et al. The effect of ozone concentration during atomic layer deposition on the properties of ZrO2 films for capacitor applications
Lee et al. Enhanced physical and electrical properties of HfO2 deposited by atomic layer deposition using a novel precursor with improved thermal stability
Park et al. Novel deuterated cyclopentadienyl zirconium/hafnium precursors for atomic layer deposition of high-performance ZrO2/HfO2 thin films
Choi et al. Improvement in dielectric properties of ZrO2 thin film by employing a Zr precursor with enhanced thermal stability in high-temperature atomic layer deposition
Nishida et al. Atomic Layer Deposition of HfO2 Films Using Tetrakis (1-(N, N-dimethylamino)-2-propoxy) hafnium [Hf (dmap) 4] for Advanced Gate Dielectrics Applications
CN118647624A (zh) 用于沉积含铋膜的前体
An et al. ZrO2 film prepared by atomic layer deposition using less viscous cocktail CpZr [N (CH3) 2] 3/C7H8 precursor and ozone
KR20120034166A (ko) 용액계 전구체
Kukli et al. Atomic layer deposition rate, phase composition and performance of HfO2 films on noble metal and alkoxylated silicon substrates
KR20200135547A (ko) 붕소 핵생성 층을 이용하는 저온 몰리브데넘 막 증착