JP2023522881A - 放射遮蔽を用いる統合されたシステムインパッケージ - Google Patents

放射遮蔽を用いる統合されたシステムインパッケージ Download PDF

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JP2023522881A
JP2023522881A JP2022562930A JP2022562930A JP2023522881A JP 2023522881 A JP2023522881 A JP 2023522881A JP 2022562930 A JP2022562930 A JP 2022562930A JP 2022562930 A JP2022562930 A JP 2022562930A JP 2023522881 A JP2023522881 A JP 2023522881A
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layer
die
sip
driver
light
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JPWO2021211844A5 (zh
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スワミナサン スリドハラン ヴィヴェク
タン イキ
ダニエル マナック クリストファー
マニコン ムルガン ラジェン
ワン リアン
シュアン ニュエン ヒエプ
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テキサス インスツルメンツ インコーポレイテッド
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L2924/191—Disposition
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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