JP2023517767A - 誘電体被膜 - Google Patents
誘電体被膜 Download PDFInfo
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- JP2023517767A JP2023517767A JP2022556051A JP2022556051A JP2023517767A JP 2023517767 A JP2023517767 A JP 2023517767A JP 2022556051 A JP2022556051 A JP 2022556051A JP 2022556051 A JP2022556051 A JP 2022556051A JP 2023517767 A JP2023517767 A JP 2023517767A
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- 238000000576 coating method Methods 0.000 title description 32
- 239000011248 coating agent Substances 0.000 title description 25
- 239000000203 mixture Substances 0.000 claims abstract description 128
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 90
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 60
- 239000002245 particle Substances 0.000 claims abstract description 57
- 239000002243 precursor Substances 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000003054 catalyst Substances 0.000 claims abstract description 19
- 230000002378 acidificating effect Effects 0.000 claims abstract description 16
- 238000009826 distribution Methods 0.000 claims abstract description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 30
- 239000006185 dispersion Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 22
- 238000002156 mixing Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 239000011733 molybdenum Substances 0.000 claims description 7
- 238000000137 annealing Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 6
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 5
- 150000001298 alcohols Chemical class 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 4
- 238000003980 solgel method Methods 0.000 claims description 4
- 239000003377 acid catalyst Substances 0.000 claims description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 24
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 14
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical group CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000007062 hydrolysis Effects 0.000 description 6
- 238000006460 hydrolysis reaction Methods 0.000 description 6
- 239000011669 selenium Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910000975 Carbon steel Inorganic materials 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910002808 Si–O–Si Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010962 carbon steel Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 3
- KUCGHDUQOVVQED-UHFFFAOYSA-N ethyl(tripropoxy)silane Chemical compound CCCO[Si](CC)(OCCC)OCCC KUCGHDUQOVVQED-UHFFFAOYSA-N 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 3
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 238000000224 chemical solution deposition Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- SPVXKVOXSXTJOY-UHFFFAOYSA-N selane Chemical compound [SeH2] SPVXKVOXSXTJOY-UHFFFAOYSA-N 0.000 description 2
- 229910000058 selane Inorganic materials 0.000 description 2
- 125000003748 selenium group Chemical group *[Se]* 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000007764 slot die coating Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- GIHPVQDFBJMUAO-UHFFFAOYSA-N tributoxy(ethyl)silane Chemical compound CCCCO[Si](CC)(OCCCC)OCCCC GIHPVQDFBJMUAO-UHFFFAOYSA-N 0.000 description 2
- GYZQBXUDWTVJDF-UHFFFAOYSA-N tributoxy(methyl)silane Chemical compound CCCCO[Si](C)(OCCCC)OCCCC GYZQBXUDWTVJDF-UHFFFAOYSA-N 0.000 description 2
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 2
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 2
- VUWVDNLZJXLQPT-UHFFFAOYSA-N tripropoxy(propyl)silane Chemical compound CCCO[Si](CCC)(OCCC)OCCC VUWVDNLZJXLQPT-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- GSVMCEUQHZAFKG-UHFFFAOYSA-N 2-triethoxysilylaniline Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1N GSVMCEUQHZAFKG-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- UEEBPQBGLVAFMF-UHFFFAOYSA-M [Al+3].[Se-2].[SeH-] Chemical compound [Al+3].[Se-2].[SeH-] UEEBPQBGLVAFMF-UHFFFAOYSA-M 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- VYKYLQRTMKIQFY-UHFFFAOYSA-N [Mo].[K] Chemical compound [Mo].[K] VYKYLQRTMKIQFY-UHFFFAOYSA-N 0.000 description 1
- QMXBEONRRWKBHZ-UHFFFAOYSA-N [Na][Mo] Chemical compound [Na][Mo] QMXBEONRRWKBHZ-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- KNYGDGOJGQXAMH-UHFFFAOYSA-N aluminum copper indium(3+) selenium(2-) Chemical compound [Al+3].[Cu++].[Se--].[Se--].[In+3] KNYGDGOJGQXAMH-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- IZRZPPPSJKAFTJ-UHFFFAOYSA-N disilanyl(propyl)silane Chemical compound CCC[SiH2][SiH2][SiH3] IZRZPPPSJKAFTJ-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- GSWAOPJLTADLTN-UHFFFAOYSA-N oxidanimine Chemical compound [O-][NH3+] GSWAOPJLTADLTN-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical class O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000012703 sol-gel precursor Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical group CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- WAAWAIHPWOJHJJ-UHFFFAOYSA-N tributoxy(propyl)silane Chemical compound CCCCO[Si](CCC)(OCCCC)OCCCC WAAWAIHPWOJHJJ-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
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Abstract
Description
- ゾル組成物の10~30重量%の、トリアルコキシシランを含む前駆体、
- ゾル組成物の10~40重量%の中央径が500nm未満の二酸化チタン粒子、
- ゾル組成物の4.5~36重量%の粒径分布D90が100nm未満のシリカ粒子、
- ゾル組成物の5~15重量%の、該前駆体を水に混和性にすることができる溶媒、
- ゾル組成物の0.1~2重量%の酸性触媒、
残余は水である。
- ゾル組成物の10~30重量%の、トリアルコキシシランを含む前駆体、
- ゾル組成物の10~40重量%の中央径が500nm未満の二酸化チタン粒子、
- ゾル組成物の30~60重量%のシリカの水分散液であって、水分散液の15~60重量%の粒径分布D90が100nm未満のシリカ粒子を含む水分散液、
- ゾル組成物の5~15重量%の、該前駆体を水に混和性にすることができる溶媒、
- ゾル組成物の0.1~2重量%の酸性触媒。
- トリアルコキシシランは一般式R’-Si(OR)3の有機官能性トリアルコキシシランであり、R’は有機官能基であり、Rはアルキルを表し、
- トリアルコキシシランはアルキルトリアルコキシシランであり、
- トリアルコキシシランは、メチルトリアルコキシシラン、エチルトリアルコキシシラン及びプロピルトリアルコキシシランの中から選択され、
- トリアルコキシシランはメチルトリメトキシシランであり、
- 前駆体は、少なくとも1種類のテトラアルコキシシラン及び少なくとも1種類のトリアルコキシシランの混合物であり、
- 前駆体の含有率は、ゾル組成物の15~25重量%の間に含まれ、
- 溶媒はアルコール、ケトン及びそれらの混合物から選択され、
- 溶媒はアセトンであり、
- 二酸化チタン粒子の径は200~1000nmの間に含まれ、
- 二酸化チタン粒子は、TiO2粒子の2~6重量%のアルミナで被覆され、
- シリカの水分散液の含有率は、ゾル組成物の35~55重量%の間に含まれ、シリカの水分散液は水分散液の40~55重量%のシリカを含み、
- シリカの水分散液は2つの異なる径範囲、すなわち、第1の範囲は50~120nmの間、第2の範囲は3~25nmの間のシリカ粒子の混合物を含み、
- 酸性触媒はリン酸を含む。
- 誘電体層の20~70重量%の中央径が500nm未満の二酸化チタン粒子、
- 誘電体層の20~70重量%の粒径分布D90が100nm未満のシリカ粒子、
- 誘電体層の5~18重量%の重合されたトリアルコキシシラン前駆体、
- 誘電体層の0.1~2%の酸性触媒。
- 以下を供給する工程、
o 10~30重量部の、トリアルコキシシランを含む前駆体、
o 10~40重量部の中央径が500nm未満の二酸化チタン粒子、
o 30~60重量部のシリカの水分散液であって、水分散液の15~60重量%の粒径分布D90が100nm未満のシリカ粒子を含む水分散液、
o 5~15重量部の、該前駆体を水に混和性にすることができる溶媒、
o 0.1~2重量部の酸性触媒、
- 前記成分を混合する工程。
- (i) 金属基材及び以下を含むゾル組成物を供給する工程
o ゾル組成物の10~30重量%の、トリアルコキシシランを含む前駆体、
o ゾル組成物の10~40重量%の中央径が500nm未満の二酸化チタン粒子、
o ゾル組成物の30~60重量%のシリカの水分散液であって、水分散液の15~60重量%の粒径分布D90が100nm未満のシリカ粒子を含む水分散液、
o ゾル組成物の5~15重量%の、該前駆体を水に混和性にすることができる溶媒、
o ゾル組成物の0.1~2重量%の酸性触媒、
- (ii) 金属基材の少なくとも1つの表面上に該ゾル組成物を堆積させる工程、
- (iii) 該溶媒を蒸発させて誘電体層を形成する工程。
- 少なくとも20μmのゾル組成物を堆積させ、
- 工程(iii)は、金属基材のピーク金属温度が120~200℃の間に含まれ、乾燥時間が30秒~4分の間に含まれる乾燥工程からなり、
- 該方法は、さらに、300~600℃の間に含まれる金属基材のピーク金属温度で30秒~4分の間誘電体層をアニーリングする工程(iv)を含む。
- (i) その表面の少なくとも一方の少なくとも一部で以下を含む少なくとも10μmの誘電体層で被覆された金属基材を供給すること、
o 誘電体層の20~70重量%の中央径が500nm未満の二酸化チタン粒子、
o 誘電体層の20~70重量%の粒径分布D90が100nm未満のシリカ粒子、
o 誘電体層の5~18重量%の重合されたトリアルコキシシラン前駆体、
o 誘電体層の0.1~2%の酸性触媒、
- (ii) モリブデンベースの背面電極を誘電体層上に堆積させること。
CH3Si(OCH3)3+H2O→OH-Si(CH3)(OCH3)2+CH3-OH
(OCH3)2(CH3)Si-OH+OH-Si(CH3)(OCH3)2→[(OCH3)2(CH3)Si-O-Si(CH3)(OCH3)2]+H-O-H
又は
(OCH3)2(CH3)Si-OCH3+OH-Si(CH3)(OCH3)2→[(OCH3)2(CH3)Si-O-Si(CH3)(OCH3)2]+CH3-O-H
- 一方では、4重量%のアルミナで被覆された二酸化チタン粒子40g(中央粒径410nmのChemours(商標)(DuPont(商標))供給のTi-Pure(商標)R900)、100nm未満の粒径分布D90を有する50重量%のシリカを含むシリカの水分散液70g(Nouryon(R)供給のLevasil CT3PL)及びアセトン15g
- 他方では、トリメトキシメチルシラン30g及び85%水溶液としてのリン酸0.5mL。
- 一方では、4重量%のアルミナで被覆された二酸化チタン粒子40g(中央粒径410nmのChemours(商標)(DuPont(商標))供給のTi-Pure(商標)R900)、100nm未満の粒径分布D90を有する50重量%のシリカを含むシリカの水分散液60g(Nouryon(R)供給のLevasil CT3PL)及び工業用エタノール25g、
- 他方では、トリメトキシメチルシラン30g及び85%水溶液としてのリン酸0.5mL。
- 一方では、タルク/マイカ粒子36g(粒径D50が3.7μmであるYmeris Performancees Additives供給のPlastorit(R) Super)、100nm未満の粒径分布D90を有する50重量%のシリカを含むシリカの水分散液70g(Nouryon(R)供給のLevasil CT3PL)及びアセトン10g
- 他方では、トリメトキシメチルシラン25g及び85%水溶液としてのリン酸1mL。
- 一方では、4重量%のアルミナで被覆された二酸化チタン粒子40g(中央粒径410nmのChemours(商標)(DuPont(商標))供給のTi-Pure(商標)R900)、100nm未満の粒径分布D90を有する50重量%のシリカを含むシリカの水分散液70g(Nouryon(R)供給のLevasil CT3PL)及びアセトン15g
- 他方では、トリメトキシメチルシラン60g及び85%水溶液としてのリン酸0.5mL。
- 一方では、4重量%のアルミナで被覆された二酸化チタン粒子40g(中央粒径410nmのChemours(商標)(DuPont(商標))供給のTi-Pure(商標)R900)、100nm未満の粒径分布D90を有する50重量%のシリカを含むシリカの水分散液70g(Nouryon(R)供給のLevasil CT3PL)及びアセトン15g
- 他方では、トリメトキシメチルシラン30g及び30%のアンモニア1mL(塩基性触媒)。
- 中央径が500nm未満の二酸化チタン粒子以外の粒子を有するゾル組成物は電子用途に適合する粗さに到達できず(ゾル組成物3)、
- 前駆体のレベルが30%より高いゾル組成物は、微小なひび割れ及び多孔性のために適切な電気絶縁性に到達できず(ゾル組成物4)、
- 塩基性触媒を有するゾル組成物は不安定で偏析する。
Claims (15)
- 金属基材上に誘電体層を生成するためのゾル組成物であって、以下:
- 前記ゾル組成物の10~30重量%の、トリアルコキシシランを含む前駆体、
- 前記ゾル組成物の10~40重量%の、中央径が500nm未満の二酸化チタン粒子、
- 前記ゾル組成物の4.5~36重量%の、粒径分布D90が100nm未満のシリカ粒子、
- 前記ゾル組成物の5~15重量%の、前記前駆体を水に混和性にすることができる溶媒、
- 前記ゾル組成物の0.1~2重量%の酸性触媒、
を含み、
残余は水である、ゾル組成物。 - 前記トリアルコキシシランが、メチルトリアルコキシシラン、エチルトリアルコキシシラン及びプロピルトリアルコキシシランの中から選択される、請求項1に記載のゾル組成物。
- 前記前駆体が、少なくとも1種のテトラアルコキシシラン及び少なくとも1種のトリアルコキシシランの混合物である、請求項1又は2に記載のゾル組成物。
- 前記前駆体の含有率が、ゾル組成物の15~25重量%の間に含まれる、請求項1~3のいずれか一項に記載のゾル組成物。
- 前記溶媒が、アルコール、ケトン及びそれらの混合物の中から選択される、請求項1~4のいずれか一項に記載のゾル組成物。
- 前記二酸化チタン粒子の前記径が、200nm~1000nmの間に含まれる、請求項1~5のいずれか一項に記載のゾル組成物。
- 前記二酸化チタン粒子が、TiO2粒子の2~6重量%のアルミナにより被覆されている、請求項1~6のいずれか一項に記載のゾル組成物。
- 前記シリカ粒子が、2つの異なる径範囲、すなわち、50~120nmの間の第1の範囲、及び3~25nmの間の第2の範囲のシリカ粒子の混合物の形態である、請求項1~7のいずれか一項に記載のゾル組成物。
- その表面の少なくとも一つの少なくとも一部上が、以下を含む少なくとも10μmの誘電体層で被覆された金属基材:
- 前記誘電体層の20~70重量%の、中央径が500nm未満の二酸化チタン粒子、
- 前記誘電体層の20~70重量%の、粒径分布D90が100nm未満のシリカ粒子、
- 前記誘電体層の5~18重量%の、シロキサン結合の三次元ネットワーク、
- 前記誘電体層の0.1~2%の酸性触媒。 - 以下の工程を含む、ゾル組成物を製造する方法:
- 以下を供給する工程:
o 10~30重量部の、トリアルコキシシランを含む前駆体、
o 10~40重量部の、中央径が500nm未満の二酸化チタン粒子、
o 30~60重量部のシリカの水分散液であって、水分散液の15~60重量%の、粒径分布D90が100nm未満のシリカ粒子を含む水分散液、
o 5~15重量部の、前記前駆体を水に混和性にすることができる溶媒、
o 0.1~2重量部の酸性触媒、
- 前記成分を混合する工程。 - 以下の工程を含む、金属基材上に誘電体層を製造するゾル-ゲル法:
- (i) 前記金属基材及び以下を含むゾル組成物を供給する工程:
o 前記ゾル組成物の10~30重量%の、トリアルコキシシランを含む前駆体、
o 前記ゾル組成物の10~40重量%の、中央径が500nm未満の二酸化チタン粒子、
o 前記ゾル組成物の4.5~36重量%の、粒径分布D90が100nm未満のシリカ粒子、
o 前記ゾル組成物の5~15重量%の、前記前駆体を水に混和性にすることができる溶媒、
o 前記ゾル組成物の0.1~2重量%の酸性触媒、
残余は水である、
- (ii) 前記金属基材の少なくとも1つの表面上に前記ゾル組成物を堆積させる工程、
- (iii) 前記溶媒を蒸発させて誘電体層を形成する工程。 - 少なくとも20μmのゾル組成物を堆積させる、請求項11に記載の方法。
- 工程(iii)が、前記金属基材のピーク金属温度が120~200℃の間に含まれ、乾燥時間が30秒~4分の間に含まれる乾燥工程から構成される、請求項11又は12に記載の方法。
- 300~600℃の間に含まれる前記金属基材のピーク金属温度で、30秒~4分間前記誘電体層をアニーリングする工程(iv)をさらに含む、請求項11~13のいずれか一項に記載の方法。
- 以下を含む、太陽電池を製造する方法:
- (i) その表面の少なくとも1つの少なくとも一部上が、以下を含む少なくとも10μmの誘電体層で被覆された金属基材供給すること:
o 前記誘電体層の20~70重量%の、中央径が500nm未満の二酸化チタン粒子、
o 前記誘電体層の20~70重量%の、粒径分布D90が100nm未満のシリカ粒子、
o 前記誘電体層の5~18重量%の、シロキサン結合の三次元ネットワーク、
o 前記誘電体層の0.1~2%の酸性触媒、
- (ii) モリブデンベースの背面電極を前記誘電体層上に堆積させること。
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