JP2023515347A - Resin composition excellent in adhesiveness and electrical conductivity and its molded article - Google Patents

Abstract

A resin composition with excellent adhesiveness and electrical conductivity and a molded product thereof, which is a conventional method of coating an adhesive to impart adhesiveness or adding an antistatic agent to impart conductivity. In contrast, the carbon filler is included in the adhesive resin that can provide high surface friction, thereby providing low surface resistance and excellent electrical conductivity. [Selection drawing] Fig. 1

Description

The present invention provides a resin composition having excellent adhesiveness and electrical conductivity and a molded product thereof, which is coated with an adhesive to impart adhesiveness or added with an antistatic agent to impart conductivity. The present invention relates to a technology that provides low surface resistance and excellent electrical conductivity by including a carbon filler in an adhesive resin that can provide high surface friction unlike conventional methods.

In modern society, the use of electronic products such as mobile phones, televisions, and computers is indispensable, and the pace of their development is rapidly changing. A variety of electronic components are used to manufacture such electronic products, and most are advanced through automated processes for rapid mass production of electronic products. Trays for transporting electronic components used in such automated processes are usually vacuum-formed from conductive polyethylene terephthalate (PET), polystyrene (PS), acrylonitrile butadiene styrene (ABS) resin compositions. ing. These are relatively simple in process and low in unit cost of production, making them economical. However, during the transportation of electronic components, the sliding phenomenon of the components caused by low surface friction causes scratches on the surface of the components, which leads to loss of conductivity. Problems such as connection static electricity and scratches on the film surface may cause defects. In addition, a phenomenon in which electronic components are displaced due to slipping during transportation poses a problem in the quality of the final product produced in the automated process.

To solve these problems, automated production processes mainly use mats or pads to prevent slippage. In this case, in most cases, the surface of the mat or pad is coated with an adhesive paint to provide an anti-slip function. As a technique related to this, see Patent Document 1, which discloses a technique relating to a coating composition having excellent frictional resistance reduction performance. Ester compounds and silyl acrylate-based monomers as binder resins are added as radically polymerizable unsaturated monomers to adjust the molecular weight and hydrophilic-lipophilic balance, thereby exhibiting a uniform wear rate for a long period of time and antifouling and antifouling properties. It discloses one having excellent frictional resistance reduction performance. However, when coating with a coating composition as in the above patent, there is a problem that the adhesiveness of the coating is weakened or the coating is peeled off over time.

On the other hand, antistatic agents are mainly used to provide the necessary antistatic function as well as slip prevention in the automated process for the production of electronic parts. As a technique related to this, Patent Document 2 discloses a sheet excellent in antistatic function. The sheet body includes a hybrid coating liquid coating layer on the upper and lower parts of the sheet body, and the hybrid coating liquid consists of solvent, polyurethane resin, anti-blocking agent, abrasion resistance improver, anti-slip agent, anti-foaming agent and anti-static agent. characteristic. However, when an antistatic agent or an antistatic agent is used as in the above patent, the surface resistance is as high as 10 ¹⁰ Ω/sq or more, so there is some limitation in providing excellent antistatic performance.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above problems and provide a simpler process to improve workability. In addition, the present invention was completed after extensive research to provide a resin composition having low surface resistance and excellent conductivity in addition to adhesive resin having excellent surface friction after molding.

Korean Patent Publication No. 10-2016-0007099 (2016.01.20) Korean Patent Publication No. 10-2017-0033986 (2019.03.28)

SUMMARY OF THE INVENTION An object of the present invention is to solve all the problems mentioned above.

An object of the present invention is to provide a resin composition that can provide high surface friction after molding.

An object of the present invention is to provide a resin composition that can provide a low surface resistance value after molding and impart excellent electrical conductivity.

SUMMARY OF THE INVENTION An object of the present invention is to simplify the processability of molded articles to improve productivity.

The characteristic configuration of the present invention for achieving the above object of the present invention and realizing the characteristic effects of the present invention to be described later is as follows.

According to one embodiment of the present invention, the maximum static friction coefficient of the resin molded product is tan θ value of 1 to 20 based on ASTM D4521, the hardness is 80 or less based on Shore A, and the surface resistance value is based on ASTM D257. A resin composition is provided that provides 10 ³ to 10 ⁹ Ω/sq as a standard.

According to one embodiment of the present invention, the resin composition may include 0.1 to 20 parts by weight of the carbon filler based on 100 parts by weight of the adhesive resin.

In this case, the adhesive resin is at least one selected from ethylene-vinyl acetate copolymer (EVA), polyolefin elastomer (POE), olefin block copolymer (OBC) and ethylene-propylene-diene monomer (EPDM). and the carbon filler may be provided including at least one or more selected from carbon black and carbon nanotubes (CNT).

According to one embodiment of the present invention, there is provided a molded article containing the above resin composition.

In this case, the molded article is provided as at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays.

Molded articles made from the resin according to the present invention can provide high surface friction and provide excellent anti-slip properties even after long-term use.

Molded articles made with resins according to the present invention can provide low surface resistance to provide excellent electrical conductivity.

When the resin according to the present invention is applied and molded, the processing method is simpler than the conventional method, and the efficiency of workability and productivity can be improved.

When the molded article according to the present invention is applied to a tray used in the manufacturing process of electronic parts, it can protect electronic parts and materials by providing non-slip effect and low surface resistance during the process of moving parts.

FIG. 2 is a diagram showing the anti-slip and anti-static properties of molded articles (sheets) containing the resin composition according to the present invention.

Hereinafter, the configuration and operation of the present invention will be described in more detail through preferred embodiments of the present invention. However, this is presented as a preferred example of the present invention and cannot be construed as limiting the present invention in any way.

Since the content not described here can be technically inferred by a person skilled in the relevant technical field, the description thereof will be omitted.

<Example 1: Production of resin composition>

5 parts by weight of carbon black (Carbon black, Chezacarb AC-60) and carbon nanotubes (CNT, Nanocyl NC7000) are added to 100 parts by weight of ethylene vinyl acetate copolymer (EVA 1834 manufactured by Hanwha Solutions Co., Ltd.), which is an adhesive resin. A resin composition containing 1 part by weight was prepared. After filling the cavity of the mold with this, after applying pressure with a press, it was cooled and solidified to produce a molded product (sheet).

<Example 2>

After preparing a resin composition by using 10 parts by weight of carbon black for 100 parts by weight of ethylene vinyl acetate copolymer (EVA 1834 manufactured by Hanwha Solutions Co., Ltd.) as an adhesive resin, the resin composition was prepared in Example 1. Moldings were produced in the same manner as

<Example 3>

Example 2 was repeated except that 12 parts by weight of carbon black was used.

<Example 4>

Example 2 was repeated except that 15 parts by weight of carbon black was used.

<Example 5>

The procedure of Example 1 was repeated except that 12 parts by weight of carbon black was used for 100 parts by weight of polyolefin elastomer (Engage 8137 POE manufactured by Dow).

<Example 6>

The procedure of Example 1 was repeated except that 12 parts by weight of carbon black was used for 100 parts by weight of the adhesive resin olefin block copolymer (Infuse 9807 OBC manufactured by Dow).

<Example 7>

The procedure of Example 1 was repeated except that 12 parts by weight of carbon black was used for 100 parts by weight of adhesive resin ethylene-propylene-diene monomer (Nordel 4725P manufactured by Dow).

<Comparative Example 1>

A commercially available conductive PET sheet was provided.

<Comparative Example 2>

The sheet was provided with an antistatic coating on a commercially available PET resin layer.

<Experimental Example 1: Surface Friction Measurement>

The maximum tilt angle (θ) of the molded pads according to the examples and comparative examples was measured using a Slip Angle Type Friction Tester manufactured by Toyoseiki, and the maximum coefficient of static friction was determined according to ASTM D4521. shown in

Maximum static friction coefficient = tan θ

<Experimental Example 2: Surface resistance measurement>

The surface resistance of the moldings of Examples and Comparative Examples was measured by the ASTM D257 method. The results are shown in [Table 1].

<Experimental Example 3: Hardness measurement>

The surface resistance of the molded articles of Examples and Comparative Examples was measured by Shore A. The results are shown in [Table 1].

According to the results of Table 1, the tan θ value of the product molded by providing the resin composition according to the present invention is 1 to 20, preferably 1 to 10, based on the maximum static friction coefficient ASTM D4521. Confirmed that it can be provided. It was confirmed that the molded article of the resin composition according to the present invention can provide a higher surface friction force than the values of the comparative examples. In particular, it was confirmed that high frictional force can be provided when carbon black is provided in an amount of 5 to 15 parts by weight.

In addition, a product molded by providing the resin composition according to the present invention may have a hardness of 80 or less based on Shore A. It was confirmed that the value was remarkably lower than the value of the comparative example, and it was confirmed that the molded article could provide excellent resistance and impact reinforcement effect against external deformation.

In addition, in the case of a product molded by providing the resin composition according to the present invention, the surface resistance value can be provided in the range of 10 ³ to 10 ⁹ Ω/sq, compared to the conventional product of the comparative example exceeding 10 ¹⁰ Therefore, it was confirmed that a resin with excellent electrical conductivity can be provided by providing low surface resistance and excellent antistatic function.

Therefore, in the case of the present invention, when applied to a tray used in the manufacturing process of electronic parts, it provides non-slip effect and low surface resistance during the process of moving parts to protect electronic parts and materials. can be done. In addition, since the adhesive resin itself provides a frictional force without requiring a separate process, the manufacturing method is easy and the processing method is simple, so that the efficiency of workability and productivity can be improved. .

Although the present invention has been described in terms of specific items such as specific components and limited examples, this is merely provided to facilitate a more general understanding of the present invention. However, the present invention is not limited to the above embodiments, and a person having ordinary knowledge in the field to which the present invention belongs can make various modifications and variations based on the above description.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and should not be limited to the scope of the claims described below, as well as any modifications equivalent to or equivalent to the scope of the claims. belongs to the concept of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers, by way of illustration, to specific embodiments in which the invention may be practiced. These embodiments are described in detail to enable those skilled in the art to fully practice the invention. It should be understood that various embodiments of the invention are different from each other and need not be mutually exclusive. For example, the specific shapes, structures and features described herein may be embodied in one embodiment without departing from the spirit and scope of the invention. Also, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Therefore, the detailed description set forth below is not to be taken in a limiting sense, and the scope of the invention, if properly described, is to be followed, along with the full range of equivalents claimed by the claims. limited only by the following claims.

Hereinafter, preferred embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention.

Anti-slip performance means that a high surface friction force can be provided, and the friction force maximizes the contact area between the load-bearing surface of the product and the surface to reduce the force that hinders the movement generated on the contact surface. means to give. In an automated process for producing electronic products, a tray for transferring electronic components is extremely vulnerable to external forces generated during movement, so it is essential to move stably without slipping. Accordingly, the present invention seeks to provide a resin composition that imparts excellent electrical conductivity along with high surface friction applicable in such processes.

According to one embodiment of the present invention, the maximum static friction coefficient of the resin molded product is tan θ value of 1 to 20 based on ASTM D4521, the hardness is 80 or less based on Shore A, and the surface resistance value is based on ASTM D257. A resin composition is provided that provides 10 ³ to 10 ⁹ Ω/sq as a standard.

According to one embodiment of the present invention, the resin composition is provided by including a carbon filler in an adhesive base resin having excellent surface friction. and contains 0.1 to 20 parts by weight of a carbon filler.

According to one embodiment of the present invention, the base resin that imparts tackiness to provide high surface friction force and provide anti-slip effect is very low density polyethylene (VLDPE), polyolefin elastomer ( POE), olefin block copolymer (OBC), ethylene vinyl acetate copolymer (EVA), ethylene-propylene-diene monomer (EPDM), ethylene butyl acrylate (EBA), ethylene propylene diene rubber (EPDM), styrene butadiene rubber (SBR), styrene-butadiene-styrene copolymer (SBS), styrene-ethylene-butadiene-styrene copolymer (SEBS), ether block amide copolymer (PEBA), thermoplastic urethane (TPU), polyester thermoplastic elastomer (TPEE) , silicone rubber, natural rubber (NR), isoprene rubber (IR), butyl rubber (IIR), butadiene rubber (BR), acrylic rubber (ACM), nitrile butadiene rubber (NBR) and chloroprene rubber (CR). of resin can be provided. Preferably, the adhesive resin is one or more selected from ethylene-vinyl acetate copolymer (EVA), polyolefin elastomer (POE), olefin block copolymer (OBC) and ethylene-propylene-diene monomer (EPDM). can be provided including

Ethylene-vinyl acetate copolymer (EVA) provided for the adhesive resin means a polymer obtained by copolymerizing ethylene and vinyl acetate monomer, and is generally made of ethylene monomer. The properties of vinyl acetate are added to the basic properties of polyethylene products. Compared to ethylene monomers, vinyl acetate monomers contain acetoxy groups, and the higher the content, the more polar properties are provided. As the content of vinyl acetate increases, optical properties (glossiness) improve and density increases, but crystallinity decreases and flexibility increases. In the case of the ethylene vinyl acetate copolymer (EVA), it exhibits slipperiness, but as the vinyl acetate content increases, the coefficient of friction increases and becomes less slippery. Accordingly, the ethylene-vinyl acetate copolymer (EVA) of the present invention is characterized by having a vinyl acetate (VA) content of 10 to 50% by weight. If the content is less than 10% by weight, processing is difficult, and if it exceeds 50% by weight, the crystallinity is disadvantageous. Therefore, it is possible to provide an excellent non-slip effect by providing the above range of 10 to 50% by weight. Moreover, the melt index (MI) of ethylene vinyl acetate copolymer (EVA) is provided at 2.16 Kg at 190° C. from 0.01 to 1 g/10 min based on ASTM D1238. Also, the ethylene vinyl acetate copolymer (EVA) has a weight average molecular weight of 10,000 to 800,000 g/mol.

The polyolefin elastomer (POE) provided for the adhesive resin means a polymer obtained by copolymerizing ethylene and alpha olefin, and has characteristics that basic properties vary depending on the type and content of the alpha olefin comonomer. As the alpha-olefin content increases, the degree of crystallinity decreases, the density decreases, and the optical properties and flexibility increase. Accordingly, the polyolefin elastomer (POE) of the present invention is characterized by copolymerizing butene and octene with alpha olefins and having a crystallinity of 34% or less. Preferably a polyolefin elastomer (POE) having a crystallinity of 13 to 24% and a range of 0.85 to 0.88 g/cm ³ and a melt index (MI) of 0 at 190°C and 2.16 Kg based on ASTM D1238. .01 to 1 g/10 min. Also, the polyolefin elastomer (POE) has a weight average molecular weight of 10,000 to 800,000 g/mol.

The olefin block copolymer (OBC) provided in the adhesive resin is a crystalline hard block in which ethylene is copolymerized with a small amount of 1-octene and a relatively large amount of 1-octene. It is a multi-block copolymer composed of soft blocks. Olefin block copolymer has a lower glass transition temperature and a higher melting point than ethylene-vinyl acetate copolymer (EVA), so it maintains flexibility and excellent impact resilience over a relatively wide temperature range, while its specific gravity is relatively low. has a low strength in Also, the decrease in impact resilience and the generation of permanent deformation due to repeated deformation are smaller than those of ethylene-vinyl acetate copolymer (EVA). Therefore, it is used in place of or mixed with ethylene-vinyl acetate copolymer (EVA) to compensate for its shortcomings. The melt index (MI) of olefin block copolymers (OBC) is provided at 2.16 Kg at 190° C. from 0.01 to 1 g/10 min based on ASTM D1238. Also, the olefin block copolymer (OBC) is provided with a weight average molecular weight of 10,000 to 800,000 g/mol and a density range of 0.860 to 0.890 g/cc.

The ethylene-propylene-diene monomer (EPDM) provided for the adhesive resin is composed of a terpolymer of ethylene, propylene, and a non-conjugated diene, and is the third component of the terpolymer (EPDM Terpolymer). Certain non-conjugated dienes provide crosslink points for Sulfur Crosslink, the most common method of rubber crosslinking. In this case, Ethylidene Norbornene (ENB) is used as the third component. Therefore, the present invention provides ethylene, propylene and ethylidenenorbornene (ENB), more specifically 40 to 80% by weight of ethylene, 10 to 50% by weight of propylene and 0.5 to 10% by weight of ethylidenenorbornene. An ethylene-propylene-diene monomer (EPDM) is provided. Therefore, it is possible to provide a resin excellent in kneading workability and compression deformation.

As mentioned above, the adhesive resin of the present invention is selected from ethylene vinyl acetate copolymer (EVA), polyolefin elastomer (POE), olefin block copolymer (OBC) and ethylene-propylene-diene monomer (EPDM). It can be melt-kneaded including any one or more, where the melt-kneading can be performed using an extruder, a kneader, a roll mill, etc. at a temperature of 80 ° C. to 150 ° C. Usually, It can be performed within the appropriate processing range that can be performed by the technician. Therefore, the melt index (MI) of the adhesive resin is 0.01 to 1 g/10 min at 190° C. and 2.16 kg based on ASTM D1238. In terms of specific gravity, it is provided between 0.85 and 1.2 g/cc. Since the lower the specific gravity, the more sticky the resin is, so in the present invention, the specific gravity of the tacky resin is provided as described above to help improve the anti-slip properties. Also, the adhesive resin has a weight average molecular weight of 10,000 to 800,000 g/mol.

According to one embodiment of the present invention, the carbon filler is at least one selected from carbon nanotube (CNT), graphite, carbon black, carbon fiber and graphene. or one or more. Carbon black and carbon nanotubes (CNT) may preferably be provided. Relatively high surface resistance values are provided when the antistatic effect is provided by the loading of conventional antistatic agents, whereas lower surface resistance values are provided when the antistatic effect is provided by the conductive carbon filler. can thus provide better electrical conductivity. In addition, physical properties such as tensile elongation and gloss of the final product can be improved, and an improved impact reinforcement effect can be provided.

According to an embodiment of the present invention, 0.1 to 20 parts by weight of the carbon filler is provided with respect to 100 parts by weight of the adhesive resin. In this case, the carbon filler is melted and kneaded into the basic resin, which itself can provide high surface friction without performing a separate process on the surface of the molded article, thereby providing excellent antistatic performance at the same time. In particular, the present invention has the advantage of simplifying the processing process by simply including a conductive carbon filler in a resin having a high frictional force.

More specifically, the carbon filler may be 5 to 15 parts by weight of carbon black or 0.1 to 2 parts by weight of carbon nanotubes (CNT), or a mixture thereof, based on 100 parts by weight of the adhesive resin. . For example, when carbon black is provided in the range of 5 to 15 parts by weight, electrical conductivity above a predetermined level can be maintained even when the internal structure changes due to resin flow during processing. In light of the results shown in Table 1 below, it can be confirmed that when the carbon black is provided within the above range, excellent surface frictional force and electrical conductivity are provided. Also, 0.1 to 2 parts by weight of carbon nanotube (CNT) as a carbon filler may be included with respect to 100 parts by weight of the adhesive resin. Therefore, it is possible to maintain the adhesion properties of the resin and provide a high surface friction force while providing excellent electrical conductivity for a low carbon content. In addition, carbon black and carbon nanotube (CNT) may be mixed to improve electrical conductivity, if necessary.

According to one embodiment of the present invention, the resin composition may optionally contain a compatibilizer to improve compatibility between the base resin and the carbon filler. In the case of a compatibilizer, when a polymer is used in combination, it can provide compatibility to the bond between polymer resins, thereby improving physical properties such as strength, tensile strength, and elongation. In the case of compatibilizers, 0.1 to 20 parts by weight are provided, preferably comprising 3 to 15 parts by weight. If the amount is less than 3 parts by weight, it is difficult to expect a compatibilizing effect, and if it exceeds 15 parts by weight, it is inefficient in terms of cost. Therefore, the inclusion of 3 to 15 parts by weight provides excellent processing fluidity and molding, and provides favorable compatibilizing effect.

The compatibilizer is ethylene-ethylene anhydride-acrylic acid copolymer, ethylene-ethyl acrylate copolymer, ethylene-alkyl acrylate-acrylic acid copolymer, maleic anhydride-modified (grafted) high-density polyethylene, maleic anhydride-modified From (graft) linear low density polyethylene, ethylene-alkyl methacrylate-methacrylic acid copolymer, ethylene-butyl acrylate copolymer, ethylene-vinyl acetate copolymer and maleic anhydride modified (graft) ethylene-vinyl acetate copolymer It includes at least one or more selected. Furthermore, it is not limited to this as long as it can provide the aforementioned compatibilizing effect.

According to one embodiment of the present invention, the maximum static friction coefficient of the resin molded article including the resin composition is provided with a tan θ value of 1 to 20 based on ASTM D4521. Therefore, the high frictional force on the surface can help support the placed object so that it does not move due to an external impact.

In addition, the hardness of the resin molded product is 80 or less, preferably in the range of 60 to 80, based on Shore A. Thus, the molded article can provide excellent resistance and impact reinforcement against external deformation.

In addition, the surface resistance value of the resin molded product is 10 ³ to 10 ⁹ Ω/sq based on ASTM D257, which provides a relatively low surface resistance value and provides excellent antistatic properties, protecting electronic components and materials. can. In particular, conventional anti-slip mats or pads provide surface resistance values greater than 10 ¹⁰ Ω/sq when manufactured with antistatic agents to impart antistatic functionality, whereas Therefore, in the case of the present invention, the surface resistance value can be reduced to 10 ³ to 10 ⁹ Ω/sq by including the carbon filler.

According to one embodiment of the present invention, there is provided a molded article manufactured including the above resin composition. Injection molding, injection blow molding, vacuum molding, or an extrusion sheet molding method using a T-die can be provided for manufacturing the molded product. The material is heated and melted and injected into a pre-closed mold cavity and then cooled and solidified to obtain a molded product, or the molding material is placed in a mold and then heated and then vacuumed to form a mold. It can proceed by a method of close contact molding in a mold. Moreover, it goes without saying that modifications can be made within an appropriate range that a normal engineer can carry out.

According to one embodiment of the present invention, the molded article is at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays. and preferably applied to electronic component manufacturing trays, but not limited thereto.

According to an embodiment of the present invention, at least one selected from a stabilizer, an antioxidant and a colorant may be added to or removed from the resin composition as needed, but the present invention is not limited thereto.

According to one embodiment of the invention, the stabilizer may be provided as a thermal or UV stabilizer. It may be included in an amount of 0.1 to 3 parts by weight based on 100 parts by weight of the adhesive resin.

In the case of the thermal stabilizer, a metallic thermal stabilizer and a non-metallic thermal stabilizer can be used. Examples of the metallic thermal stabilizer include organotin thermal stabilizers and mercaptide organotin thermal stabilizers. carboxylate-based organotin heat stabilizers, carboxylic acid metal salt-based heat stabilizers may be provided. Epoxy compounds and organic phosphites can be provided as non-metallic heat stabilizers.

Examples of the organic phosphorous acid-based heat stabilizer include triphenyl phosphite, diphenyl isodecyl phosphite, phenyl diisodecyl phosphite, trinonyl phenyl phosphite. phosphate).

The UV stabilizer may include at least one selected from benzotriazole-based, oxanilide-based, and hindered amine light stabilizers (HALS). In particular, the above HALS is a radical scavenger that scavenges radicals, and is used to treat and compensate for polymer radicals that are generated when 100% UV blocking is not possible despite the use of UV blocking agents. be done. It mainly provides the effect of preventing gloss loss, yellowing, etc.

According to one embodiment of the present invention, the antioxidant prevents oxidation of the final product molded containing the resin composition. There are secondary antioxidants. Hindered phenols and lactones are used as primary antioxidants, and phosphates and thioesters are used as secondary antioxidants. The role of primary antioxidants is that of radical scavengers, and the hindered phenol system treats oxygen centered radicals. Secondary antioxidants act as hydroperoxide (ROOH) decomposers. Antioxidants further increase the boosting effect through the use of both primary and secondary antioxidants in most resins, hence hindered phenols, lactones and phosphates. ) systems are mixed in appropriate proportions and used. Phenols can be provided by 2,6-di-t-Butyl-4-methylphenol, 2,2-methylenebis (4-methyl-6-t-butylphenol) and the like, and in the case of phosphorus, Bis (2 ,4-di-t-butyl), Tris (2,4-di-t-butylphenyl)-phosphate, and the like. In the case of an antioxidant, 0.1 to 5 parts by weight may be included with respect to 100 parts by weight of the adhesive resin.

According to one embodiment of the present invention, the coloring agent is for giving aesthetics to the resin composition, and the coloring agent may be a pigment or a dye, preferably a pigment. obtain. It may be included in an amount of 1 to 10 parts by weight based on 100 parts by weight of the adhesive resin.

Molded articles made from the resin according to the present invention can provide high surface friction and provide excellent anti-slip properties even after long-term use.

Molded articles made with resins according to the present invention can provide low surface resistance to provide excellent electrical conductivity.

When the resin according to the present invention is applied and molded, the processing method is simpler than the conventional method, and the efficiency of workability and productivity can be improved.

When the molded article according to the present invention is applied to a tray used in the manufacturing process of electronic parts, it can protect electronic parts and materials by providing non-slip effect and low surface resistance during the process of moving parts.

Claims (12)

The maximum static friction coefficient of the resin molded product is tan θ value of 1 to 20 based on ASTM D4521, hardness of 80 or less based on Shore A, and surface resistance value of 10 ³ to 10 ⁹ Ω/sq based on ASTM D257. A resin composition characterized by providing in. 2. The resin composition according to claim 1, wherein the resin composition contains 0.1 to 20 parts by weight of a carbon filler with respect to 100 parts by weight of the adhesive resin. The adhesive resin includes at least one selected from ethylene-vinyl acetate copolymer (EVA), polyolefin elastomer (POE), olefin block copolymer (OBC) and ethylene-propylene-diene monomer (EPDM). The resin composition according to claim 2. 3. The resin of claim 2, wherein the carbon filler comprises at least one selected from 5 to 15 parts by weight of carbon black, 0.1 to 2 parts by weight of carbon nanotubes (CNT), and mixtures thereof. Composition. 3. The resin composition according to claim 2, wherein the melt index (MI) of the adhesive resin is 0.01 to 1 g/10 min at 190° C. and 2.16 kg based on ASTM D1238. 3. The resin composition according to claim 2, wherein the adhesive resin has a specific gravity of 0.85 to 1.2 g/cc. 3. The resin composition according to claim 2, wherein the adhesive resin has a weight average molecular weight of 10,000 to 800,000. 3. The resin composition according to claim 2, wherein the resin composition contains 0.1 to 3 parts by weight of a stabilizer with respect to 100 parts by weight of the adhesive resin. 3. The resin composition according to claim 2, wherein the resin composition contains 0.1 to 5 parts by weight of an antioxidant with respect to 100 parts by weight of the adhesive resin. 3. The resin composition according to claim 2, wherein the resin composition contains 1 to 10 parts by weight of a coloring agent with respect to 100 parts by weight of the adhesive resin. A molded article comprising the resin composition according to any one of claims 1 to 10. 12. The molded product according to claim 11, wherein the molded product is at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays.

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