JP2023503885A - ANTI-SLIP CONDUCTIVE RESIN COMPOSITION AND MOLDED PRODUCT CONTAINING THE SAME - Google Patents

Abstract

Regarding the conductive resin composition with anti-slip function and the molded product containing it, unlike the conventional method of coating adhesive to prevent slipping or adding antistatic agent to impart conductivity, it has a high surface The inclusion of a carbon filler in the adhesive resin, which can provide frictional force, provides low surface resistance and excellent conductivity. [Selection drawing] Fig. 1

Description

The present invention relates to a conductive resin composition having an anti-slip function and a molded product containing the same, which is different from the conventional method of coating an adhesive to prevent slipping or adding an antistatic agent to impart conductivity. In contrast, the present invention relates to a technique of providing low surface resistance and excellent electrical conductivity by including a carbon filler in an adhesive resin capable of providing high surface friction.

In modern society, the use of electronic products such as mobile phones, televisions, and computers is indispensable, and the pace of their development is rapidly changing. A variety of electronic components are used to manufacture such electronic products, and most are advanced through automated processes for rapid mass production of electronic products. At this time, a tray for transferring electronic parts used in an automated process is usually vacuum-formed from a conductive polyethylene terephthalate (PET), polystyrene (PS), acrylonitrile butadiene styrene (ABS) resin composition. are used. These are relatively simple in process and low in unit cost of production, making them economical. However, during the transportation of electronic components, the sliding phenomenon of the components caused by low surface friction causes scratches on the surface of the components, which leads to loss of conductivity. Problems such as connection static electricity and scratches on the film surface may cause defects. In addition, a cavity is formed in the tray to fix the position of electronic components loaded on the tray, but in this case, trays with different specifications are required for each product, which increases the production, storage, and management costs of trays. will increase.

To solve these problems, automated production processes mainly use mats or pads to prevent slippage. In this case, in most cases, the surface of the mat or pad is coated with an adhesive paint to provide an anti-slip function.

As a technique related to this, see Patent Document 1, which discloses a technique relating to a coating composition having excellent frictional resistance reduction performance. Ester compounds and silyl acrylate-based monomers as binder resins are added as radically polymerizable unsaturated monomers to adjust the molecular weight and hydrophilic-lipophilic balance, thereby exhibiting a uniform wear rate for a long period of time and antifouling and antifouling properties. It discloses one having excellent frictional resistance reduction performance. However, when coating with a coating composition as in the above patent, there is a problem that the adhesiveness of the coating is weakened or the coating is peeled off over time.

On the other hand, antistatic agents are mainly used to provide the necessary antistatic function as well as slip prevention in the automated process for the production of electronic parts. As a technique related to this, Patent Document 2 discloses a sheet excellent in antistatic function. The sheet body includes a hybrid coating liquid coating layer on the upper and lower parts of the sheet body, and the hybrid coating liquid consists of solvent, polyurethane resin, anti-blocking agent, abrasion resistance improver, anti-slip agent, anti-foaming agent and anti-static agent. characteristic. However, when an antistatic agent or an antistatic agent is used as in the above patent, the surface resistance is as high as 10 ¹⁰ Ω/sq or more, so there is some limitation in providing excellent antistatic performance.

Therefore, the present invention solves the above-mentioned problems, provides a simpler process, improves processability, and provides a resin composition having excellent surface friction force of molded products, low surface resistance, and excellent conductivity. Completed at the end of a long study to offer.

Korean Patent Publication No. 10-2016-0007099 (2016.01.20) Korean Patent Publication No. 10-2017-0033986 (2019.03.28)

SUMMARY OF THE INVENTION An object of the present invention is to solve all the problems mentioned above.
An object of the present invention is to provide a resin composition capable of providing a resin molded product with a high surface friction force.

An object of the present invention is to provide a resin composition capable of providing a resin molded product with a low surface resistance value, thereby imparting excellent electrical conductivity.

SUMMARY OF THE INVENTION An object of the present invention is to simplify the processability of molded articles to improve productivity.

The characteristic configuration of the present invention for achieving the above object of the present invention and realizing the characteristic effects of the present invention to be described later is as follows.

According to an embodiment of the present invention, the anti-slip conductive resin provides a frictional force of 10 N or more according to ASTM D1894 and a surface resistance value of 10 ³ to 10 ⁹ Ω/sq according to ASTM D257. A composition is provided.

According to an embodiment of the present invention, the anti-slip conductive resin composition is provided by including a carbon filler in an adhesive resin having excellent surface friction.

According to one embodiment of the present invention, the adhesive resin is very low density polyethylene (VLDPE), polyolefin elastomer (POE), olefin block copolymer (OBC), ethylene acetate copolymer (EVA), ethylene butyl acrylate. (EBA), ethylene propylene diene rubber (EPDM), styrene butadiene rubber (SBR), styrene butadiene styrene copolymer (SBS), styrene ethylene butadiene styrene copolymer (SEBS), ether block amide copolymer (PEBA), Thermoplastic urethane (TPU), thermoplastic ester elastomer (TPEE), silicone rubber, natural rubber (NR), isoprene rubber (IR), butyl rubber (IIR), butadiene rubber (BR), acrylic rubber (ACM), nitrile butadiene rubber (NBR) and chloroprene rubber (CR).

According to one embodiment of the present invention, the carbon filler is at least one selected from carbon nanotube (CNT), graphite, carbon black, carbon fiber and graphene. or one or more.

According to one embodiment of the present invention, there is provided a molded article comprising the anti-slip conductive resin composition.

Molded articles made from the resin according to the present invention can provide high surface friction and provide excellent anti-slip properties even after long-term use.

Molded articles made from the resin according to the present invention can provide low surface resistance to provide excellent antistatic effect and electrical conductivity.

When the resin according to the present invention is used for molding, the processing method is simpler than the conventional method, and the efficiency of workability and productivity can be improved.

When the molded article according to the present invention is applied to a tray used in the manufacturing process of electronic parts, it can protect electronic parts and materials by providing non-slip effect and low surface resistance during the process of moving parts.

FIG. 2 is a diagram showing a method for measuring the surface friction force of a molded product (sheet) containing a resin according to the present invention; FIG. 2 shows the anti-slip and anti-static properties of molded articles (sheets) containing resins according to the present invention.

Hereinafter, the configuration and operation of the present invention will be described in more detail through preferred embodiments of the present invention. However, this is presented as a preferred example of the present invention, and does not limit the present invention in any way.
Since the content not described here can be technically inferred by a person skilled in the relevant technical field, the description thereof will be omitted.

[Example]
<Example 1: Production of conductive resin composition>
Adhesive resin 100 parts by weight (Hanwha Solution EVA 1834 80 parts by weight, Dow Engage 8137 POE 20 parts by weight), carbon nanotube (CNT) 2 parts by weight, carbon black 8 parts by weight, antioxidant An anti-slip conductive resin composition containing 0.1 parts by weight (hindered phenol-based) and 0.3 parts by weight of processing aid (fatty acid amide-based) was prepared.

The prepared anti-slip conductive resin composition was filled into a cavity of a mold, pressed with a press, and then cooled and solidified to prepare a molded product (sheet).

<Example 2>
The procedure of Example 1 was repeated except that 100 parts by weight of the adhesive resin (20 parts by weight of EVA 1834 manufactured by Hanwha Solution, and 80 parts by weight of Engage 8137 POE manufactured by Dow) was used.

<Example 3>
The procedure of Example 1 was repeated except that 100 parts by weight of adhesive resin (20 parts by weight of EVA 1834 manufactured by Hanwha Solution, 80 parts by weight of FLEXOMER DFDB-9042 NT VLDPE manufactured by Dow) was used.

<Example 4>
The procedure of Example 1 was repeated except that 100 parts by weight of adhesive resin (20 parts by weight of EVA 1834 manufactured by Hanwha Solution Co., Ltd. and 80 parts by weight of Infuse 9807 OBC manufactured by Dow) was used.

<Example 5>
The procedure of Example 1 was repeated except that 14 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (EVA 1834 manufactured by Hanwha Solution Co., Ltd.).

<Example 6>
Example 1 was followed except that 14 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (Engage 8137 POE manufactured by Dow).

<Example 7>
Example 1 was repeated except that 14 parts by weight of carbon black was used per 100 parts by weight of adhesive resin (FLEXOMER DFDB-9042 NT VLDPE manufactured by Dow).

<Example 8>
Example 1 was followed except that 14 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (Infuse 9807 OBC from Dow).

<Example 9>
The procedure of Example 1 was repeated except that 8 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (EVA 1834 manufactured by Hanwha Solution Co., Ltd.).

<Example 10>
The procedure of Example 1 was repeated except that 11 parts by weight of carbon black was used for 100 parts by weight of adhesive resin (EVA 1834 manufactured by Hanwha Solution Co., Ltd.).

[Comparative example]
<Comparative Example 1>
A commercially available conductive PET sheet was provided.

<Comparative Example 2>
The sheet was provided with an antistatic coating on a commercially available PET resin layer.

[Experimental Example 1: Surface Friction Measurement]
The surface friction force was measured according to ASTM D1894. After fixing the molded products (pads) according to Examples and Comparative Examples to a stand, the force applied is measured while pulling the jig to which the PET film is attached. This is shown in [Fig. 1]. The results for this are shown in [Table 1].

[Experimental Example 2: Surface resistance measurement]
Surface resistance was measured by the ASTM D257 method. The results for this are shown in [Table 1].

Looking at the results in Table 1, the surface friction force of the molded product provided with the anti-slip conductive resin composition according to the present invention was 10N to 40N, and the comparative example was 1N or less. It was confirmed that a remarkably high surface friction force can be provided compared to the

In addition, the surface resistance value can be provided in the range of 10 ³ to 10 ⁹ Ω/sq, which is significantly lower than the surface resistance value provided in the comparative example in the range of 10 ⁶ to 10 ⁹ Ω/sq. I can confirm. Therefore, it was confirmed that a low surface resistance can be provided, and excellent antistatic function and electrical conductivity can be provided.

Therefore, in the case of the present invention, when it is applied to a tray used in the manufacturing process of electronic parts, it provides non-slip effect and low surface resistance during the process of moving parts to protect electronic parts and materials. It could be confirmed.

In addition, since the frictional force is provided by the adhesive resin itself without adding a separate process, the manufacturing method is easy and the processing method is simple, so that the efficiency of workability and productivity can be improved. .

Although the present invention has been described in terms of specific items such as specific components and limited examples, this is merely provided to facilitate a more general understanding of the present invention. However, the present invention is not limited to the above embodiments, and a person having ordinary knowledge in the field to which the present invention belongs can make various modifications and variations based on the above description.
Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and not only the scope of the claims described below, but also any equivalent or equivalent modifications to the scope of the claims described below. It can be said that the object belongs to the category of the idea of the present invention.
DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers, by way of illustration, to specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to fully practice the invention. Various embodiments of the invention are different from each other, but need not be mutually exclusive. For example, the specific shapes, structures and features described herein may be embodied in one embodiment without departing from the spirit and scope of the invention. Also, the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Therefore, the detailed description set forth below is not to be taken in a limiting sense, and the scope of the invention, if properly described, is to be followed, along with the full range of equivalents claimed by the claims. limited only by the following claims.
Hereinafter, preferred embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention.

Anti-slip performance means a high surface friction force, which means maximizing the contact area between the load-bearing surface of the product and that surface, giving the contact surface a force that hinders the movement that occurs. means In the case of a tray for transferring electronic parts in an automated process for producing electronic products, the present invention uses an anti-slip conductive resin that can provide high surface friction to prevent parts from slipping during transfer. A composition is provided.

According to one embodiment of the present invention, the surface frictional force of the resin molded product is 10 N or more according to ASTM D1894, and the surface resistance value is 10 ³ to 10 ⁹ Ω/sq according to ASTM D257. An attempt is made to provide a resin composition.

According to an embodiment of the present invention, the anti-slip conductive resin composition is provided by including a carbon filler in an adhesive base resin having excellent surface friction, and if necessary, compatibilized. Agents, antioxidants, processing aids, and the like can also be included.

According to one embodiment of the present invention, very low density polyethylene (VLDPE), polyolefin elastomer (POE) is used as a base resin that provides adhesion to provide high surface friction and anti-slip effect. ), olefin block copolymer (OBC), ethylene acetate copolymer (EVA), ethylene butyl acrylate (EBA), ethylene propylene diene rubber (EPDM), styrene butadiene rubber (SBR), styrene butadiene styrene copolymer (SBS ), styrene ethylene butadiene styrene copolymer (SEBS), ether block amide copolymer (PEBA), thermoplastic urethane (TPU), thermoplastic ester elastomer (TPEE), silicone rubber, natural rubber (NR), isoprene rubber ( IR), butyl rubber (IIR), butadiene rubber (BR), acrylic rubber (ACM), nitrile butadiene rubber (NBR) and chloroprene rubber (CR). Preferably, at least one or more selected from polyolefin elastomer (POE), ethylene acetate copolymer (EVA), very low density polyethylene (VLDPE) and olefin block copolymer (OBC) can be provided.

Polyolefin elastomer (POE), which can be provided as an adhesive resin, means a polymer obtained by copolymerizing ethylene and alpha olefin, and has characteristics that basic properties vary depending on the type and content of alpha olefin comonomer. As the alpha-olefin content increases, the degree of crystallinity decreases, the density decreases, and the optical properties and flexibility increase. Accordingly, the polyolefin elastomer (POE) of the present invention is characterized by copolymerizing butene and octene with alpha olefins and having a crystallinity of 34% or less. Preferably a polyolefin elastomer (POE) in the range of 0.85 to 0.88 g/ ^cm3 with a crystallinity of 13 to 24% and a melt index (MI) of 0.5 to 60 g at 2.16 kg at 190°C according to ASTM D1238. /10min. Also, the polyolefin elastomer (POE) has a weight average molecular weight of 10,000 to 800,000 g/mol. Since the lower the specific gravity, the more sticky the properties are, so providing the above range of specific gravity can help improve the anti-slip properties.

Ethylene acetate copolymer (EVA) means a polymer obtained by copolymerizing ethylene and vinyl acetate monomer, and generally polyethylene products made from ethylene monomer have vinyl acetate as a basic property. It has the property of adding the properties of Compared to ethylene monomers, vinyl acetate monomers contain acetoxy groups, and the higher the content, the more polar properties are provided. As the content of vinyl acetate increases, optical properties (glossiness) improve and density increases, but crystallinity decreases and flexibility increases. Ethylene acetate copolymer (EVA) exhibits slipperiness, but as the vinyl acetate content increases, the coefficient of friction increases, making it difficult to slip. Accordingly, the ethylene acetate copolymer (EVA) of the present invention is characterized by having a vinyl acetate (VA) content of 10 to 50% by weight. If the content is less than 10% by weight, processing becomes difficult, and if the content exceeds 50% by weight, the crystallinity is disadvantageous. Therefore, it is possible to provide an excellent non-slip effect by providing the above range of 10 to 50% by weight. Moreover, the melt index (MI) of ethylene acetate copolymer (EVA) is provided according to ASTM D1238 from 0.5 to 80 g/10 min at 190°C and 2.16 kg. Also, the ethylene acetate copolymer (EVA) has a weight average molecular weight of 10,000 to 800,000 g/mol.

Very low density polyethylene (VLDPE) is a type of polyethylene with a density ranging from 0.890 to 0.914 g/cm ³ and is produced by low pressure polymerization technology using a metallocene catalyst like linear low density polyethylene (LLDPE). It is characterized by high alpha olefin content compared to other types of polyethylene. Alkyl branching of alpha olefins has the effect of lowering packing density and crystallinity, and exhibits high toughness and elasticity with very low tensile strength and melting point. Moreover, the melt index (MI) of very low density polyethylene (VLDPE) is provided at 2.16 Kg at 190° C. from 0.5 to 80 g/10 min according to ASTM D1238. Also, very low density polyethylene (VLDPE) is provided with a weight average molecular weight of 10,000 to 800,000 g/mol.

The olefin block copolymer (OBC) is an olefin block copolymer containing ethylene or propylene repeating units and a plurality of blocks or segments containing α-olefin repeating units, and is 0.860 to 0.890 g/ It has a density in the cm ³ range. The block copolymer can contain both a soft elastic block called a soft segment and a hard crystalline block called a hard segment, thereby exhibiting physical properties such as excellent elasticity and heat resistance. be able to. More specifically, such a block copolymer can exhibit soft properties above the glass transition temperature of the soft segment, and exhibit thermoplastic behavior at temperatures higher than the melting temperature. It can exhibit relatively excellent workability. Moreover, the melt index (MI) of the olefin block copolymer (OBC) is provided according to ASTM D1238 from 0.5 to 20 g/10 min at 190°C and 2.16 Kg. Also, the olefin block copolymer (OBC) has a weight average molecular weight of 10,000 to 800,000 g/mol.

According to one embodiment of the present invention, the adhesive resin is selected from polyolefin elastomer (POE), ethylene acetate copolymer (EVA), very low density polyethylene (VLDPE) and olefin block copolymer (OBC). At least one or more can be melt-kneaded, and the melt-kneading can be carried out using an extruder, kneader, roll mill, etc. at a temperature of 80 ° C. to 190 ° C., and is performed by ordinary technicians. You can proceed within the appropriate processing range that you can.

According to one embodiment of the present invention, 0.1 to 40 parts by weight of the carbon filler is provided with respect to 100 parts by weight of the adhesive resin.

According to one embodiment of the present invention, the carbon filler is at least one selected from carbon nanotube (CNT), graphite, carbon black, carbon fiber and graphene. or one or more. Relatively high surface resistance values are provided when the antistatic effect is provided by the loading of conventional antistatic agents, whereas lower surface resistance values are provided when the antistatic effect is provided by the conductive carbon filler. can thus provide excellent antistatic effect and electrical conductivity. In addition, physical properties such as tensile elongation and gloss of the final product can be improved, and an improved impact reinforcement effect can be provided.

According to an embodiment of the present invention, 0.1 to 10 parts by weight of carbon nanotubes (CNT), 1 to 15 parts by weight of carbon black, and graphene are added to 100 parts by weight of the adhesive resin. It is characterized by containing at least one selected from 0.1 to 10 parts by weight. That is, by providing a composition within the above range, it is possible to provide excellent antistatic performance at the same time by melt-kneading a carbon filler capable of providing conductivity to the base resin capable of providing high surface friction. In particular, the present invention has the advantage of simplifying the processing process by including a conductive carbon filler in a resin having a high frictional force. In this case, the adhesive resin is 20 to 80 parts by weight of ethylene acetate copolymer (EVA) and 20 to 80 parts by weight of polyolefin elastomer (POE), very low density polyethylene (VLDPE) or olefin block copolymer (OBC). 80 parts by weight.

In particular, carbon nanotubes (CNT) are provided in an amount of 0.1 to 10 parts by weight with respect to 100 parts by weight of the adhesive resin, which provides excellent electrical conductivity compared to the low carbon content and adhesive properties of the resin. 1 to 15 parts by weight of carbon black can maintain electrical conductivity above a predetermined level even if the internal structure changes due to resin flow during processing. can provide In addition, by including 0.1 to 10 parts by weight of graphene, it is possible to provide an effect of improving tensile strength and flexural strength by improving modulus as well as improving electrical conductivity.

According to one embodiment of the present invention, the resin composition may further include at least one selected from antioxidants and processing aids. In this case, 0.01 to 10 parts by weight of at least one selected from antioxidants and processing aids is provided with respect to 100 parts by weight of the adhesive resin.

In the case of antioxidants, they are included in the resin composition to prevent oxidation of final products molded, and types of antioxidants include primary antioxidants and secondary antioxidants. be. Hindered phenols and lactones are used as primary antioxidants, and phosphates and thioesters are used as secondary antioxidants. The role of the primary antioxidant is a radical scavenger, and the hindered phenol system treats oxygen centered radicals. Secondary antioxidants act as hydroperoxide (ROOH) decomposers. Antioxidants further increase the lifting effect through the use of both primary and secondary antioxidants in most resins, hence the hindered phenol, lactone and phosphate systems. They are mixed in proper proportions and used. Phenols can be provided by 2,6-di-t-Butyl-4-methylphenol, 2,2-methylenebis (4-methyl-6-t-butylphenol) and the like, and in the case of phosphorus, Bis (2 ,4-di-t-butyl), Tris (2,4-di-t-butylphenyl)-phosphate, and the like. In the case of an antioxidant, it may be included in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the adhesive resin.

In the case of processing aids, the surface of the extrudate can be smoothed to improve the quality of the molded product. It is an additive that prevents stickiness between the mold surface and the extruder surface and the resin and improves the slip property. It is kneaded with the resin to reduce the melt viscosity and improve the molding processability, caking between pellets during resin processing. prevent the phenomenon. Such processing aids include acrylic polymers, styrene copolymers, mineral oils, petrolatum, paraffin waxes, petroleum resins, fatty acids, fatty acid esters, fatty alcohols, metallic soaps, fatty acid amides, phenolic resins, polyethylene, polybutene, organic silicones, and the like. can be provided, but not limited to. In addition, the processing aid may be included in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the adhesive resin.

According to one embodiment of the present invention, the surface friction force of the final molded article molded using the resin composition may be 10N or more, preferably 10N to 40N, according to ASTM D1894. Referring to FIG. 1, it is a diagram showing a method for measuring the surface friction of a molded product (sheet) containing a resin according to the present invention. It can be seen that it helps to support the object so that it does not move due to side impacts.

In addition, the final molded product has a surface resistance value of 10 ³ to 10 ⁹ Ω/sq, which provides a relatively low surface resistance value to provide an excellent antistatic function, which can protect electronic components and materials. In particular, conventional anti-slip mats or pads, when manufactured with antistatic agents to impart antistatic functionality, provide surface resistance values in excess of 10 ¹⁰ Ω/sq, whereas Therefore, in the case of the present invention, the surface resistance value can be reduced to 10 ³ to 10 ⁹ Ω/sq by including the carbon filler.

According to one embodiment of the present invention, there is provided a molded article comprising the anti-slip conductive resin composition. Injection molding, injection blow molding, vacuum molding, or an extrusion sheet molding method using a T-die can be provided for manufacturing the molded product. After the material is heated and melted and injected into a pre-closed mold cavity, it is cooled and solidified to obtain a molded product, or the molding material is raised to the mold, heated and then vacuumed to form a mold. It can proceed by a method of close contact molding in a mold. In addition, it goes without saying that modifications can be made within an appropriate range within the scope that a normal engineer can implement.

According to one embodiment of the present invention, the molded article is at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays. and preferably applied to electronic component manufacturing trays, but not limited thereto.

Claims (12)

An anti-slip conductive resin composition characterized by providing a resin molded product with a frictional force of 10 N or more according to ASTM D1894 and a surface resistance value of 10 ³ to 10 ⁹ Ω/sq according to ASTM D257. The anti-slip conductive resin composition of claim 1, wherein the resin composition contains a carbon filler in the adhesive resin. 3. The anti-slip conductive resin composition according to claim 2, comprising 0.1 to 40 parts by weight of a carbon filler with respect to 100 parts by weight of the adhesive resin. The adhesive resin includes ultra-low density polyethylene (VLDPE), polyolefin elastomer (POE), olefin block copolymer (OBC), ethylene acetate copolymer (EVA), ethylene butyl acrylate (EBA), ethylene propylene diene rubber (EPDM). ), styrene-butadiene rubber (SBR), styrene-butadiene-styrene copolymer (SBS), styrene-ethylene-butadiene-styrene copolymer (SEBS), ether block amide copolymer (PEBA), thermoplastic urethane (TPU), thermoplastic ester from elastomers (TPEE), silicone rubber, natural rubber (NR), isoprene rubber (IR), butyl rubber (IIR), butadiene rubber (BR), acrylic rubber (ACM), nitrile butadiene rubber (NBR) and chloroprene rubber (CR) 3. The anti-slip conductive resin composition according to claim 2, comprising at least one or more selected. 3. The carbon filler of claim 2, wherein the carbon filler comprises at least one selected from carbon nanotubes (CNT), graphite, carbon black, carbon fiber and graphene. anti-slip conductive resin composition. 0.1 to 10 parts by weight of carbon nanotubes (CNT), 1 to 15 parts by weight of carbon black, and 0.1 to 10 parts by weight of graphene, based on 100 parts by weight of the adhesive resin. 3. The anti-slip conductive resin composition according to claim 2, comprising at least one of The anti-slip conductive resin composition according to claim 2, comprising 0.01 to 10 parts by weight of at least one selected from antioxidants and processing aids with respect to 100 parts by weight of the adhesive resin. . 3. The anti-slip conductive resin composition of claim 2, wherein the adhesive resin has a weight average molecular weight of 10,000 to 800,000. 3. The anti-slip conductive resin composition according to claim 2, wherein the melt index (MI) of said adhesive resin is 0.5 to 60 g/10 min at 190[deg.] C. and 2.16 kg according to ASTM D1238. 3. The anti-slip conductive resin composition of claim 2, wherein the adhesive resin has a specific gravity of 0.85 to 0.96 g/cc. A molded article comprising the anti-slip conductive resin composition according to any one of claims 1 to 10. 12. The molded product according to claim 11, wherein the molded product is at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays.

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