JP2023515346A - Multi-layer molded products with excellent adhesion and electrical conductivity and electronic products transported by them - Google Patents

Abstract

A multi-layer molded article having at least two layers including a surface layer and an inner layer, in particular, the surface layer is characterized by adding a carbon filler to the adhesive resin to provide excellent adhesiveness and electrical conductivity. do. The multilayer molded article according to the present invention has improved mechanical properties compared to conventional products and can be manufactured economically by reducing production costs. , interior materials, containers, trays for manufacturing electronic parts, and the like. [Selection drawing] Fig. 1

Description

The present invention relates to a multi-layer molded article having at least two layers, including a surface layer and an inner layer, and an electronic product transported therewith. and electrical conductivity. The multi-layer molded article according to the present invention has improved mechanical properties compared to conventional products and can be manufactured economically by reducing production costs. , interior materials, containers, trays for manufacturing electronic parts, and the like.

In modern society, the use of electronic products such as mobile phones, televisions, and computers is indispensable, and the pace of their development is rapidly changing. A variety of electronic components are used to manufacture such electronic products, and most are advanced through automated processes for rapid mass production of electronic products. Trays for transporting electronic components used in such automated processes are usually vacuum-formed from conductive polyethylene terephthalate (PET), polystyrene (PS), acrylonitrile butadiene styrene (ABS) resin compositions. ing. These are relatively simple in process and low in unit cost of production, making them economical. However, during the transportation of electronic components, the sliding phenomenon of the components caused by low surface friction causes scratches on the surface of the components, which leads to loss of conductivity. Problems such as connection static electricity and scratches on the film surface may cause defects. In addition, a phenomenon in which electronic components are displaced due to slipping during transportation poses a problem in the quality of the final product produced in the automated process. In order to solve these problems, non-slip mats or pads are mainly used in automated production processes for manufacturing electronic products to prevent slippage.

For example, Patent Document 1 discloses a multilayer tray comprising a thermoplastic polymer sheet having a predetermined area and an antistatic polyolefin foam sheet having a predetermined area bonded to at least one surface of the thermoplastic polymer sheet. Disclosed is an electronic product carrying tray formed by molding a sheet to form a large number of accommodation grooves having a predetermined shape in which electronic products can be accommodated, and a method of manufacturing the same. Therefore, it has the effect of providing a buffer against external force and the effect of reducing static electricity by preventing electrification that may occur between the electronic product and the antistatic polyolefin foam sheet.

Patent Document 2 relates to a tray for transferring electronic components, which is made by injection molding a resin that provides heat resistance of 110° C. or more, and is characterized by including a detachable adhesive plate on the tray surface. Therefore, it provides an effect of preventing damage and contamination due to external vibrations during the process of transferring parts of electronic products.

Patent Document 3 relates to a conductive sheet and a molded product for packaging electronic components, the conductive sheet includes a base layer and a conductive layer, and in the case of the base layer, a polypropylene-based resin and a polyethylene-based resin containing an antistatic agent, In the case of the conductive layer, it is provided by including a conductive agent in a polypropylene-based resin. Accordingly, it is a feature of the present invention to provide a molded product for packaging and transporting electronic components, which is excellent in heat resistance, moldability, conductivity, and the like.

In addition, Patent Document 4, Patent Document 5, etc. also mention conductive sheets and the provision of them as molded articles for transporting electronic components.

As described above, various technologies related to trays for transporting electronic components have been actively developed. INDUSTRIAL APPLICABILITY The present invention provides high surface friction force and excellent electrical conductivity to the surface of a molded product for transferring electronic components, improves mechanical properties and reduces production costs compared to conventional products. Completed to ensure economy.

Korean Patent Publication No. 10-2013-0011050 (2013.01.30) Japanese Patent Publication No. 31014488 (2019.01.31) Japanese Patent No. 4813397 (2011.09.02) Japanese Patent No. 05419078 (2014.02.19) Japanese Patent No. 03998956 (2007.10.31)

SUMMARY OF THE INVENTION An object of the present invention is to solve all the problems mentioned above.

An object of the present invention is to provide a surface layer of a multi-layer molded product with high surface frictional force to provide excellent adhesiveness.

SUMMARY OF THE INVENTION An object of the present invention is to provide a surface layer of a multilayer molded product with a surface resistance value to impart excellent electrical conductivity.

SUMMARY OF THE INVENTION An object of the present invention is to improve the mechanical properties of a multi-layer molded product compared to conventional products and to reduce the production cost to ensure economic efficiency.

The characteristic configuration of the present invention for achieving the above object of the present invention and realizing the characteristic effects of the present invention to be described later is as follows.

According to one embodiment of the present invention, there is provided a multi-layer molded article including a surface layer and an inner layer, wherein the surface layer has a maximum static friction coefficient of tan θ value of 1 or more based on ASTM D4521, and a surface resistance value of ASTM D257. A multi-layer molded product is provided which has excellent adhesion and electrical conductivity of 10 ³ to 10 ⁹ Ω/sq as a standard.

According to an embodiment of the present invention, the multi-layer molded article having excellent adhesiveness and electrical conductivity is manufactured by at least one selected from coextrusion, injection, lamination and coating for the surface layer and the inner layer. characterized by being In this case, at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays may be provided.

According to an embodiment of the present invention, an electronic product transported by the multi-layer molded article having excellent adhesion and electrical conductivity can be provided.

The surface layer of the multi-layer molded article according to the present invention can be provided with a high surface frictional force to provide excellent adhesiveness. Therefore, even if the multi-layer molded article is used for a long time, it can provide a non-slip effect, which is an excellent anti-slip function.

Therefore, when the multilayer molded article according to the present invention is applied to a tray used in the process of manufacturing electronic parts, the electronic parts and materials can be protected during the process of moving the parts.

The surface layer of the multi-layer molded article according to the present invention can be provided with a surface resistance value to provide excellent electrical conductivity.

The multi-layer molded article according to the present invention can improve mechanical properties and reduce production costs compared to conventional products, thereby providing economy.

1 is a diagram showing the structure of a multilayer molded product according to the present invention; FIG. FIG. 4 shows the excellent adhesion and electrical conductivity of the multilayer molded article according to the present invention;

Hereinafter, the configuration and operation of the present invention will be described in more detail through preferred embodiments of the present invention. However, this is presented as a preferred example of the present invention and cannot be construed as limiting the present invention in any way.

Since the content not described here can be technically inferred by a person skilled in the relevant technical field, the description thereof will be omitted.

<Example 1: Production of multilayer molded article>

12 parts by weight of carbon black (Carbon black, Chezacarb AC-60) and carbon nanotubes (CNT, Nanocyl NC7000) are added to 100 parts by weight of ethylene vinyl acetate copolymer (Hanwha Solutions Co., Ltd. EVA 1834) as an adhesive resin. A surface layer was prepared with a resin composition containing 1 part by weight. In this case, the surface layer was produced using an extruder T-die, and the inner layer was provided with a commercial PET film and laminated through a lamination process. A multi-layer molded article having a total thickness of 1 mm, a surface layer thickness of 800 μm and an inner layer thickness of 200 μm was produced.

<Comparative Example 1>

12 parts by weight of carbon black (Carbon black, Chezacarb AC-60) and carbon nanotubes (CNT, Nanocyl NC7000) are added to 100 parts by weight of ethylene vinyl acetate copolymer (Hanwha Solutions Co., Ltd. EVA 1834) as an adhesive resin. A resin composition containing 1 part by weight was prepared, filled into a mold cavity, pressed with a press, and then cooled and solidified to prepare a 1 mm single-layer molded product sheet.

<Comparative Example 2>

A commercially available PET monolayer sheet (1 mm) was provided.

<Experimental Example 1: Surface Friction Measurement>

The maximum tilt angle (θ) of the molded pads according to the examples and comparative examples was measured using a Slip Angle Type Friction Tester manufactured by Toyoseiki, and the maximum coefficient of static friction was determined according to ASTM D4521. shown in

Maximum static friction coefficient = tan θ

<Experimental Example 2: Surface resistance measurement>

The surface resistance of the moldings of Examples and Comparative Examples was measured by the ASTM D257 method. The results are shown in [Table 1].

<Experimental Example 3: Hardness measurement>

The surface resistance of the molded articles of Examples and Comparative Examples was measured by Shore A. The results are shown in [Table 1].

<Experimental Example 4: Tensile modulus measurement>

The tensile modulus of the molded articles of Examples and Comparative Examples was measured at a speed of 50 mm/min according to ASTM D638. The results are shown in [Table 1].

From the results in Table 1, it was confirmed that the tan θ value based on ASTM D4521 for the maximum coefficient of static friction of the multi-layer molded product according to the present invention is 1 to 20, preferably 1 to 10. Therefore, it was confirmed that the examples of the present invention can provide a higher surface friction force than the values of the comparative examples.

In addition, in the case of the multi ^- layer molded product according to the present invention, the surface resistance value can be provided in the range of ^{10 3} to 10 ⁹ Ω/sq. I confirmed that it is excellent. Therefore, it was confirmed that a molded article having excellent electrical conductivity can be provided by providing low surface resistance and excellent antistatic function.

In addition, the multi-layer molded article according to the present invention can be provided with a hardness of 80 or less based on Shore A. It was confirmed that the value was significantly lower than that of Comparative Example 2.

In addition, the tensile modulus (Tensile modulus) is about 6,500 kgf/cm ² , which is much higher than that of Comparative Example 1, which is a single layer. It was confirmed that it can provide excellent resistance and rigidity (strength) against external deformation compared to .

Therefore, in the case of the present invention, when applied to a tray used in the manufacturing process of electronic parts, it provides adhesiveness and low surface resistance that are non-slip during the process of moving parts. can protect In addition, since the adhesive resin itself provides a frictional force without requiring a separate process, the manufacturing method is easy and the processing method is simple, so that the efficiency of workability and productivity can be improved. .

Furthermore, the multi-layer molded article according to the present invention can be manufactured economically by improving mechanical properties and reducing production costs compared to conventional products.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers, by way of illustration, to specific embodiments in which the invention may be practiced. These embodiments are described in detail to enable those skilled in the art to fully practice the invention. It should be understood that various embodiments of the invention are different from each other and need not be mutually exclusive. For example, the specific shapes, structures and features described herein may be embodied in one embodiment without departing from the spirit and scope of the invention. Also, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Therefore, the detailed description set forth below is not to be taken in a limiting sense, and the scope of the invention, if properly described, is to be followed, along with the full range of equivalents claimed by the claims. limited only by the following claims.

Hereinafter, preferred embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention.

Non-slip, which is an anti-slip performance, means that a high surface friction force can be provided. It is meant to impart a force that opposes the movement that occurs. In an automated process for producing electronic products, a tray for transferring electronic components is extremely vulnerable to external forces generated during movement, so it is essential to move stably without slipping.

Accordingly, the present invention provides a multilayer molded article applicable to such a process, which contains a resin composition that imparts a high surface frictional force and excellent electrical conductivity to the surface layer. In addition, the molded product is molded in multiple layers to improve mechanical properties and reduce production costs to ensure economic efficiency.

According to one embodiment of the present invention, a multilayer molded article is provided that includes at least two or more layers including a surface layer and an inner layer. This can be seen in FIG.

First, the surface layer has a maximum static friction coefficient of tan θ value of 1 or more based on ASTM D4521, and a surface resistance value of 10 ³ to 10 ⁹ Ω/sq based on ASTM D257. In order to provide such physical properties, the surface layer is characterized by including a carbon filler in the adhesive resin.

That is, it is provided by including a carbon filler in an adhesive base resin having excellent surface friction. In this case, 0.1 to 22 parts by weight of the carbon filler is added to 100 parts by weight of the adhesive resin. characterized by comprising

In order to provide a high surface friction force and an anti-slip effect, the base resin of the surface layer may be a very low density polyethylene (VLDPE), a polyolefin elastomer (POE), an olefin as a resin that imparts adhesion. block copolymer (OBC), ethylene vinyl acetate copolymer (EVA), ethylene butyl acrylate (EBA), ethylene propylene diene rubber (EPDM), styrene butadiene rubber (SBR), styrene butadiene styrene copolymer (SBS), Styrene ethylene butadiene styrene copolymer (SEBS), ether block amide copolymer (PEBA), thermoplastic urethane (TPU), polyester thermoplastic elastomer (TPEE), silicone rubber, natural rubber (NR), isoprene rubber (IR ), butyl rubber (IIR), and butadiene rubber (BR).

Preferably, the adhesive resin is one or more selected from ethylene-vinyl acetate copolymer (EVA), polyolefin elastomer (POE), olefin block copolymer (OBC) and ethylene-propylene-diene monomer (EPDM). can be provided including

Ethylene-vinyl acetate copolymer (EVA) means a polymer obtained by copolymerizing ethylene and vinyl acetate monomer, and generally polyethylene products made from ethylene monomer have acetic acid as a basic property. It has the added properties of vinyl. Compared to ethylene monomers, vinyl acetate monomers contain acetoxy groups, and the higher the content, the more polar properties are provided. As the content of vinyl acetate increases, optical properties (glossiness) improve and density increases, but crystallinity decreases and flexibility increases. In the case of the ethylene vinyl acetate copolymer (EVA), it exhibits slipperiness, but as the vinyl acetate content increases, the coefficient of friction increases and becomes less slippery. Accordingly, the ethylene-vinyl acetate copolymer (EVA) of the present invention is characterized by having a vinyl acetate (VA) content of 10 to 50% by weight. If the content is less than 10% by weight, the slipperiness is too high, and if it exceeds 50% by weight, processing becomes difficult. Therefore, by providing the above range of 10 to 50% by weight, it is possible to provide excellent non-slip stickiness. Moreover, the melt index (MI) of ethylene vinyl acetate copolymer (EVA) is provided at 2.16 kg at 190° C. from 0.01 to 5 g/10 min based on ASTM D1238. Also, the ethylene vinyl acetate copolymer (EVA) has a weight average molecular weight of 10,000 to 800,000 g/mol.

Polyolefin elastomer (POE) refers to a polymer obtained by copolymerizing ethylene and alpha olefin, and has characteristics that basic properties vary depending on the type and content of alpha olefin comonomer. As the alpha-olefin content increases, the degree of crystallinity decreases, the density decreases, and the optical properties and flexibility increase. Accordingly, the polyolefin elastomer (POE) of the present invention is characterized by copolymerizing butene and octene with alpha olefins and having a crystallinity of 34% or less. Preferably a polyolefin elastomer (POE) having a crystallinity of 13 to 24% and a range of 0.85 to 0.88 g/cm ³ and a melt index (MI) of 0 at 190°C and 2.16 Kg based on ASTM D1238. .01 to 5 g/10 min. Also, the polyolefin elastomer (POE) has a weight average molecular weight of 10,000 to 800,000 g/mol.

Olefin block copolymer (OBC) consists of a crystalline hard block in which ethylene is copolymerized with a small amount of 1-octene and a soft block in which ethylene is copolymerized with a relatively large amount of 1-octene. It is a multi-block copolymer. Olefin block copolymers have a lower glass transition temperature and a higher melting point than ethylene-vinyl acetate copolymers (EVA). Has low strengths. Also, the decrease in impact resilience and the generation of permanent deformation due to repeated deformation are smaller than those of ethylene-vinyl acetate copolymer (EVA). Therefore, it is used in place of or mixed with ethylene-vinyl acetate copolymer (EVA) to compensate for its shortcomings. The melt index (MI) of olefin block copolymers (OBC) is provided from 0.01 to 5 g/10 min at 190° C. and 2.16 Kg based on ASTM D1238. Also, the olefin block copolymer (OBC) is provided with a weight average molecular weight of 10,000 to 800,000 g/mol and a density range of 0.860 to 0.890 g/cc.

Ethylene-propylene-diene monomer (EPDM) is composed of a terpolymer of ethylene, propylene, and a non-conjugated diene. It provides cross-linking points for the most common method, Sulfur Crosslink. In this case, Ethylidene Norbornene (ENB) is used as the third component. Therefore, the present invention provides ethylene, propylene and ethylidenenorbornene (ENB), more specifically 40 to 80% by weight of ethylene, 10 to 50% by weight of propylene and 0.5 to 10% by weight of ethylidenenorbornene. An ethylene-propylene-diene monomer (EPDM) is provided. Therefore, it is possible to provide a resin excellent in kneading workability and compression deformation.

As described above, the adhesive resin of the present invention can be melt-kneaded containing at least one or more selected from the above-mentioned resins, where melt-kneading means It can be carried out using extruders, kneaders, roll mills, etc. under conditions, and can be carried out within a suitable range of processing that can be carried out by ordinary technicians.

Therefore, the melt index (MI) of the adhesive resin is 0.01 to 5 g/10 min at 190° C. and 2.16 kg based on ASTM D1238.

Density is provided from 0.85 to 1.2 g/cc. In general, the lower the density, the more sticky the property, and the ethylene-vinyl acetate copolymer (EVA) shows the stickier property as the density increases. In the case of the present invention, the density of the adhesive resin can be provided within the above range to help improve anti-slip properties.

Also, the adhesive resin has a weight average molecular weight of 10,000 to 800,000 g/mol.

According to one embodiment of the present invention, the surface layer includes a carbon filler, and the carbon filler includes carbon nanotube (CNT), graphite, carbon black, carbon fiber and graphene. (Graphene). Preferably carbon black, carbon nanotubes (CNT) may be provided. Relatively high surface resistance values are provided when the antistatic effect is provided by the loading of conventional antistatic agents, whereas lower surface resistance values are provided when the antistatic effect is provided by the conductive carbon filler. can thus provide excellent electrical conductivity. In addition, physical properties such as tensile elongation and gloss of the final product can be improved, and an improved impact reinforcement effect can be provided.

According to one embodiment of the present invention, 0.1 to 22 parts by weight of the carbon filler is provided with respect to 100 parts by weight of the adhesive resin. In this case, the carbon filler is melted and kneaded into the basic resin, which itself can provide high surface friction without performing a separate process on the surface of the molded article, thereby providing excellent antistatic performance at the same time. In particular, the present invention has the advantage of simplifying the processing process by melting and kneading a conductive carbon filler in a resin having a high frictional force.

More specifically, the carbon filler is any one selected from 5 to 20 parts by weight of carbon black and 0.1 to 2 parts by weight of carbon nanotubes (CNT) with respect to 100 parts by weight of the adhesive resin. may be provided including one or more. When provided within the above range, it is possible to maintain electrical conductivity at a predetermined level or higher even when the internal structure changes due to resin flow during processing. Therefore, it is possible to maintain the adhesion properties of the resin and provide a high surface friction force while providing excellent electrical conductivity compared to a low carbon content. In addition, carbon black and carbon nanotube (CNT) may be mixed to improve electrical conductivity, if necessary.

Also, the thickness of the surface layer can occupy a range of 10% to 90% of the total thickness of the multilayer molded product. If it is less than 10%, it may be difficult to develop surface resistance and adhesiveness, and if it exceeds 90%, it is economically disadvantageous and the effect of improving mechanical properties is insignificant. In this case, the total thickness of the multi-layer molded article can be provided in the range of 50 μm to 5,000 μm.

According to one embodiment of the present invention, the surface layer may contain at least one selected from a compatibilizer, a stabilizer, an antioxidant and a colorant, if necessary. It is not limited to this.

In the case of a compatibilizer, when a polymer is used in combination, it can provide compatibility to the bond between polymer resins, thereby improving physical properties such as strength, tensile strength, and elongation. In the case of compatibilizers, 0.1 to 20 parts by weight are provided, preferably comprising 3 to 15 parts by weight. If the amount is less than 3 parts by weight, it is difficult to expect a compatibilizing effect, and if it exceeds 15 parts by weight, it is inefficient in terms of cost. Therefore, the inclusion of 3 to 15 parts by weight provides excellent processing fluidity and molding, and provides favorable compatibilizing effect.

The compatibilizer is ethylene-ethylene anhydride-acrylic acid copolymer, ethylene-ethyl acrylate copolymer, ethylene-alkyl acrylate-acrylic acid copolymer, maleic anhydride-modified (grafted) high-density polyethylene, maleic anhydride-modified From (graft) linear low density polyethylene, ethylene-alkyl methacrylate-methacrylic acid copolymer, ethylene-butyl acrylate copolymer, ethylene-vinyl acetate copolymer and maleic anhydride modified (graft) ethylene-vinyl acetate copolymer It includes at least one or more selected. Furthermore, it is not limited to this as long as it can provide the compatibilizing effect described above.

In the case of heat stabilizers, they help prevent the resin from decomposing at high temperatures during processing and help maintain the physicochemical properties of the molded article. For example, metallic heat stabilizers and non-metallic heat stabilizers can be used. Examples of the metal heat stabilizers include organotin heat stabilizers, mercaptide organotin heat stabilizers, and carboxylates. Organotin-based heat stabilizers, carboxylic acid metal salt-based heat stabilizers can be provided. Epoxy compounds and organic phosphites can be provided as non-metallic heat stabilizers.

Examples of the organic phosphorous acid-based heat stabilizer include triphenyl phosphite, diphenyl isodecyl phosphite, phenyl diisodecyl phosphite, trinonyl phenyl phosphite. phosphate).

The UV stabilizer may include at least one selected from benzotriazole-based, oxanilide-based, and hindered amine light stabilizers (HALS). In particular, the above HALS is a radical scavenger that scavenges radicals, and is used to treat and compensate for polymer radicals that are generated when 100% UV blocking is not possible despite the use of UV blocking agents. be done. It mainly provides the effect of preventing gloss loss and yellowing of molded products.

The heat or UV stabilizer may be included in an amount of 0.1 to 3 parts by weight based on 100 parts by weight of the adhesive resin.

Antioxidants prevent oxidation of the final product to be molded, and types of antioxidants include primary antioxidants and secondary antioxidants. Hindered phenols and lactones are used as primary antioxidants, and phosphates and thioesters are used as secondary antioxidants. The role of primary antioxidants is that of radical scavengers, and the hindered phenol system treats oxygen centered radicals. Secondary antioxidants act as hydroperoxide (ROOH) decomposers. Antioxidants further increase the boosting effect through the use of both primary and secondary antioxidants in most resins, hence hindered phenols, lactones and phosphates. ) systems are mixed in appropriate proportions and used. Phenols can be provided by 2,6-di-t-Butyl-4-methylphenol, 2,2-methylenebis (4-methyl-6-t-butylphenol) and the like, and in the case of phosphorus, Bis (2 ,4-di-t-butyl), Tris (2,4-di-t-butylphenyl)-phosphate, and the like. In the case of an antioxidant, 0.1 to 5 parts by weight may be included with respect to 100 parts by weight of the adhesive resin.

The coloring agent is for imparting aesthetics to the appearance of the molded article, and the coloring agent may be a pigment or dye, preferably a pigment. It may be included in an amount of 1 to 10 parts by weight based on 100 parts by weight of the adhesive resin.

According to an embodiment of the present invention, when the surface layer is molded with an adhesive resin containing a carbon filler, etc., the maximum coefficient of static friction is provided with a tan θ value of 1 or more based on ASTM D4521, preferably 1 to 20 provided. Therefore, the high frictional force on the surface can help support the placed object so that it does not move due to an external impact.

In addition, the surface resistance value of the surface layer is 10 ³ to 10 ⁹ Ω/sq based on ASTM D257, providing a relatively low surface resistance value and providing excellent antistatic effect, protecting electronic parts and materials. can. In particular, conventional products are provided with surface resistivities in excess of 10 ¹⁰ Ω/sq, whereas the carbon fillers of the present invention reduce the surface resistivity from 10 ³ to 10 ⁹ Ω/sq. can be reduced to sq.

According to an embodiment of the present invention, the hardness of the adhesive resin is 80 or less, preferably in the range of 60 to 80, based on Shore A. Thus, the molded article can provide excellent resistance and impact reinforcement against external deformation.

In addition, it can be provided with a tensile modulus of 300 kgf/cm ² or more, preferably 1,000 to 10,000 kgf/cm ² to provide excellent resistance to external impact and deformation. It can provide improved mechanical properties from the point. Therefore, it is meaningful in that it can improve adhesiveness, excellent electrical conductivity and mechanical properties of the surface layer while satisfying the thickness of the product that is usually required, and can reduce the production cost.

According to one embodiment of the present invention, the resin of the inner layer is polyethylene terephthalate (PET), polystyrene (PS), high impact polystyrene (HIPS), styrene-butadiene copolymer (SBC), styrene acrylate copolymer, styrene. methacrylate copolymers, styrene-butadiene-styrene copolymers (SBS), styrene-isoprene-styrene copolymers (SIS), styrene-ethylene-butylene-styrene copolymers (SEBS), acrylonitrile-butadiene-styrene (ABS), polyethylene and ethylene containing ethylene groups A resin containing at least one or more selected from a propylene-based copolymer, polypropylene and a propylene-based copolymer containing a propylene group, a polyester, a polyphenyl ether, and a polyphenylene oxide is provided. The thickness of the inner layer may range from 10% to 90% of the total thickness of the multilayer molded article. If it is less than 10%, it may be difficult to develop surface resistance and adhesiveness, and if it exceeds 90%, it is economically disadvantageous and the effect of improving mechanical properties is insignificant. In this case, the overall thickness of the multi-layer molded article can be provided preferably between 50 μm and 5,000 μm.

According to one embodiment of the present invention, the surface layer and the inner layer are provided by injection molding, injection blow molding, vacuum molding, or extrusion sheet molding using a T-die. The above method can be obtained by heating and melting the molding material, injecting and filling it into a pre-closed mold cavity, and then cooling and solidifying to obtain a molded product, or after placing the molding material in the mold. , heating and then applying a vacuum to form the mold in close contact with the mold. Moreover, it goes without saying that modifications can be made within an appropriate range that a normal engineer can carry out.

According to an embodiment of the present invention, the multi-layer molded article having excellent adhesiveness and electrical conductivity is manufactured by at least one selected from coextrusion, injection, lamination and coating for the surface layer and the inner layer. characterized by being Preferably formed by coextrusion or lamination is provided.

A lamination process means a process of bonding two or more materials (film, paper, etc.) using heat or an adhesive. The lamination process according to the present invention is not particularly limited, and the surface layer and the inner layer can be formed as a molded article by a general lamination process. A method can be provided for bonding a surface layer extruded from one or more extruders in a lamination process to a film used as an inner layer by rolls. In addition, a method of co-extrusion with one extrusion die using a multi-flow nozzle, or a method of adhering a film shape with an adhesive or the like can be provided, but is not limited thereto.

According to one embodiment of the present invention, the multi-layer molded article having excellent adhesiveness and electrical conductivity is selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays. can be provided by at least one of the following, and can be preferably applied to electronic component manufacturing trays, but is not limited thereto.

According to an embodiment of the present invention, an electronic product transported by the multi-layer molded article having excellent adhesion and electrical conductivity can be provided. In this case, the electronic product can be an electronic component, a semi-finished product or a finished product.

For example, in the case of electronic components, they may be components such as display panels, batteries, semiconductors, etc. used in the manufacture of finished mobile phones. In addition, semi-finished products that can be transported, packaged, and transferred during the process of manufacturing a finished electronic product are not particularly limited.

Although the present invention has been described in terms of specific items such as specific components and limited examples, this is merely provided to facilitate a more general understanding of the present invention. However, the present invention is not limited to the above embodiments, and a person having ordinary knowledge in the field to which the present invention belongs can make various modifications and variations based on the above description.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and should not be limited to the scope of the claims described below, as well as any modifications equivalent to or equivalent to the scope of the claims. belongs to the concept of the present invention.

The surface layer of the multi-layer molded article according to the present invention can be provided with a high surface frictional force to provide excellent adhesiveness. Therefore, even if the multi-layer molded article is used for a long time, it can provide a non-slip effect, which is an excellent anti-slip function.

Therefore, when the multilayer molded article according to the present invention is applied to a tray used in the process of manufacturing electronic parts, the electronic parts and materials can be protected during the process of moving the parts.

The surface layer of the multi-layer molded article according to the present invention can be provided with a surface resistance value to provide excellent electrical conductivity.

The multi-layer molded article according to the present invention can improve mechanical properties and reduce production costs compared to conventional products, thereby providing economy.

Claims (12)

A multilayer molded article comprising a surface layer and an inner layer,
The surface layer has a maximum static friction coefficient of tan θ value of 1 or more based on ASTM D4521, and a surface resistance value of 10 ³ to 10 ⁹ Ω/sq based on ASTM D257. Multi-layer molded products with excellent 2. The multi-layer molded product according to claim 1, wherein the surface layer contains 0.1 to 22 parts by weight of carbon filler with respect to 100 parts by weight of the adhesive resin. The adhesive resin includes ultra-low density polyethylene (VLDPE), polyolefin elastomer (POE), olefin block copolymer (OBC), ethylene vinyl acetate copolymer (EVA), ethylene butyl acrylate (EBA), ethylene propylene diene rubber ( EPDM), styrene-butadiene rubber (SBR), styrene-butadiene-styrene copolymer (SBS), styrene-ethylene-butadiene-styrene copolymer (SEBS), ether block amide copolymer (PEBA), thermoplastic urethane (TPU), polyester 3. The rubber according to claim 2, comprising at least one or more selected from thermoplastic elastomer (TPEE), silicone rubber, natural rubber (NR), isoprene rubber (IR), butyl rubber (IIR), and butadiene rubber (BR). Multi-layer molded product with excellent adhesion and electrical conductivity. 3. The adhesive and electrical material according to claim 2, wherein the carbon filler includes at least one selected from 5 to 20 parts by weight of carbon black and 0.1 to 2 parts by weight of carbon nanotubes (CNT). Multilayer molded product with excellent conductivity. 3. The multi-layer molded article of claim 2, wherein the adhesive resin has a melt index (MI) of 0.01 to 5 g/10 min at 190° C. and 2.16 kg based on ASTM D1238. . 3. The multi-layer molded article according to claim 2, wherein the adhesive resin has a density of 0.85 to 1.2 g/cc. 3. The multilayer molded product according to claim 2, wherein the adhesive resin has a hardness (Shore A) of 80 or less. The resin of the inner layer is polyethylene terephthalate (PET), polystyrene (PS), high impact polystyrene (HIPS), styrene butadiene copolymer (SBC), styrene acrylate copolymer, styrene methacrylate copolymer, styrene butadiene styrene copolymer. styrene-isoprene-styrene copolymer (SIS), styrene-ethylene-butylene-styrene copolymer (SEBS), acrylonitrile-butadiene-styrene (ABS), polyethylene and ethylene-based copolymers containing ethylene groups, polypropylene and propylene groups 2. The multilayer molded article according to claim 1, which contains at least one or more selected from propylene-based copolymers, polyesters, polyphenyl ethers, and polyphenylene oxides. The multi-layer molded product according to claim 1, wherein the multi-layer molded product has a tensile modulus of 300 kgf/cm2 ^or more. 2. The adhesiveness according to claim 1, wherein the multi-layer molded article having excellent adhesiveness and electrical conductivity is manufactured by at least one selected from a coextrusion method, an injection method, lamination and coating for the surface layer and the inner layer. And multilayer molded products with excellent electrical conductivity. The multi-layer molded product having excellent adhesiveness and electrical conductivity is at least one selected from sheets, pads, films, wrapping paper, pipes, pouches, interior materials, containers, and electronic component manufacturing trays. 2. The multilayer molded article according to 1, which is excellent in adhesiveness and electrical conductivity. An electronic product that is transported by the multi-layer molded article having excellent adhesiveness and electrical conductivity according to any one of claims 1 to 11.

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