JP2023514586A5 - - Google Patents
Info
- Publication number
- JP2023514586A5 JP2023514586A5 JP2022549238A JP2022549238A JP2023514586A5 JP 2023514586 A5 JP2023514586 A5 JP 2023514586A5 JP 2022549238 A JP2022549238 A JP 2022549238A JP 2022549238 A JP2022549238 A JP 2022549238A JP 2023514586 A5 JP2023514586 A5 JP 2023514586A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- composition according
- hydroxide
- ammonium
- polishing composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025120392A JP2025143522A (ja) | 2020-02-13 | 2025-07-17 | 研磨組成物及びその使用方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062975829P | 2020-02-13 | 2020-02-13 | |
| US62/975,829 | 2020-02-13 | ||
| PCT/US2021/017049 WO2021162978A1 (en) | 2020-02-13 | 2021-02-08 | Polishing compositions and methods of use thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025120392A Division JP2025143522A (ja) | 2020-02-13 | 2025-07-17 | 研磨組成物及びその使用方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023514586A JP2023514586A (ja) | 2023-04-06 |
| JP2023514586A5 true JP2023514586A5 (enExample) | 2024-02-27 |
| JP7715720B2 JP7715720B2 (ja) | 2025-07-30 |
Family
ID=77273440
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022549238A Active JP7715720B2 (ja) | 2020-02-13 | 2021-02-08 | 研磨組成物及びその使用方法 |
| JP2025120392A Pending JP2025143522A (ja) | 2020-02-13 | 2025-07-17 | 研磨組成物及びその使用方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025120392A Pending JP2025143522A (ja) | 2020-02-13 | 2025-07-17 | 研磨組成物及びその使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US12371589B2 (enExample) |
| EP (1) | EP4103662A4 (enExample) |
| JP (2) | JP7715720B2 (enExample) |
| KR (1) | KR20220137754A (enExample) |
| CN (1) | CN114945648B (enExample) |
| TW (1) | TWI912280B (enExample) |
| WO (1) | WO2021162978A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11508585B2 (en) * | 2020-06-15 | 2022-11-22 | Taiwan Semiconductor Manufacturing Company Ltd. | Methods for chemical mechanical polishing and forming interconnect structure |
| TWI804925B (zh) * | 2020-07-20 | 2023-06-11 | 美商Ｃｍｃ材料股份有限公司 | 矽晶圓拋光組合物及方法 |
| US20230052829A1 (en) * | 2021-08-05 | 2023-02-16 | Fujifilm Electronic Materials U.S.A., Inc. | Compositions and methods of use thereof |
| US11820919B2 (en) * | 2021-10-19 | 2023-11-21 | Tokyo Electron Limited | Ruthenium CMP chemistry based on halogenation |
| US20230135325A1 (en) * | 2021-10-28 | 2023-05-04 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
| US20230348754A1 (en) * | 2022-03-31 | 2023-11-02 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
| EP4562104A4 (en) * | 2022-07-26 | 2025-11-19 | Fujifilm Electronic Mat Usa Inc | COMPOSITIONS AND THEIR METHODS OF USE |
| TW202428806A (zh) * | 2022-11-29 | 2024-07-16 | 美商富士軟片電子材料美國股份有限公司 | 拋光組成物及其使用方法 |
| KR20250150100A (ko) * | 2023-02-17 | 2025-10-17 | 버슘머트리얼즈 유에스, 엘엘씨 | 얕은 트렌치 절연을 위한 화학적 기계적 평탄화 |
| CN120041101B (zh) * | 2025-02-20 | 2025-09-23 | 中国矿业大学(北京) | 一种用于芯片高k介质金属栅钌栅平坦化的抛光液及其制备方法与应用 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6936543B2 (en) | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
| US20080105652A1 (en) * | 2006-11-02 | 2008-05-08 | Cabot Microelectronics Corporation | CMP of copper/ruthenium/tantalum substrates |
| US20080148649A1 (en) * | 2006-12-21 | 2008-06-26 | Zhendong Liu | Ruthenium-barrier polishing slurry |
| US20100096584A1 (en) | 2008-10-22 | 2010-04-22 | Fujimi Corporation | Polishing Composition and Polishing Method Using the Same |
| JP2013533614A (ja) | 2010-06-01 | 2013-08-22 | アプライド マテリアルズ インコーポレイテッド | 銅ウエハ研磨の化学的平坦化 |
| JP6050934B2 (ja) | 2011-11-08 | 2016-12-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物並びにそれを用いた研磨方法及び基板の製造方法 |
| US8545715B1 (en) * | 2012-10-09 | 2013-10-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method |
| DE112013005264T5 (de) * | 2012-11-02 | 2015-09-24 | Fujimi Incorporated | Polierzusammensetzung |
| KR20160002729A (ko) | 2013-04-25 | 2016-01-08 | 히타치가세이가부시끼가이샤 | Cmp용 연마액 및 이것을 사용한 연마 방법 |
| KR20160002728A (ko) | 2013-04-25 | 2016-01-08 | 히타치가세이가부시끼가이샤 | Cmp용 연마액 및 이것을 사용한 연마 방법 |
| US9735030B2 (en) * | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
| US9481811B2 (en) * | 2015-02-20 | 2016-11-01 | Cabot Microelectronics Corporation | Composition and method for polishing memory hard disks exhibiting reduced edge roll-off |
| US11046869B2 (en) * | 2015-09-09 | 2021-06-29 | Showa Denko Materials Co., Ltd. | Polishing liquid, polishing liquid set, and substrate polishing method |
| JP6978933B2 (ja) * | 2017-12-27 | 2021-12-08 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| JP6962247B2 (ja) * | 2018-03-14 | 2021-11-05 | Jsr株式会社 | 半導体表面処理用組成物および半導体表面処理方法 |
| WO2019190730A2 (en) | 2018-03-28 | 2019-10-03 | Fujifilm Electronic Materials U.S.A., Inc. | Barrier ruthenium chemical mechanical polishing slurry |
| WO2019190738A1 (en) | 2018-03-28 | 2019-10-03 | Fujifilm Electronic Materials U.S.A., Inc. | Bulk ruthenium chemical mechanical polishing composition |
| US10847410B2 (en) * | 2018-09-13 | 2020-11-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ruthenium-containing semiconductor structure and method of manufacturing the same |
| US20200102476A1 (en) * | 2018-09-28 | 2020-04-02 | Versum Materials Us, Llc | Barrier Slurry Removal Rate Improvement |
| KR102952447B1 (ko) | 2019-09-24 | 2026-04-13 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 연마 조성물 및 이의 사용 방법 |
| KR20220083728A (ko) | 2019-10-15 | 2022-06-20 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 연마 조성물 및 이의 사용 방법 |
| CN114945649B (zh) * | 2020-02-13 | 2024-05-07 | 富士胶片电子材料美国有限公司 | 抛光组合物及其使用方法 |
| TW202138505A (zh) * | 2020-03-31 | 2021-10-16 | 美商富士軟片電子材料美國股份有限公司 | 研磨組成物及其使用方法 |
| US20230135325A1 (en) * | 2021-10-28 | 2023-05-04 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
| US20230348754A1 (en) * | 2022-03-31 | 2023-11-02 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
-
2021
- 2021-02-08 WO PCT/US2021/017049 patent/WO2021162978A1/en not_active Ceased
- 2021-02-08 KR KR1020227031237A patent/KR20220137754A/ko active Pending
- 2021-02-08 EP EP21753150.8A patent/EP4103662A4/en active Pending
- 2021-02-08 US US17/169,685 patent/US12371589B2/en active Active
- 2021-02-08 JP JP2022549238A patent/JP7715720B2/ja active Active
- 2021-02-08 CN CN202180009070.1A patent/CN114945648B/zh active Active
- 2021-02-17 TW TW110105350A patent/TWI912280B/zh active
-
2025
- 2025-07-07 US US19/261,302 patent/US20250333622A1/en active Pending
- 2025-07-17 JP JP2025120392A patent/JP2025143522A/ja active Pending
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