JP2023508687A - センシングシステム - Google Patents
センシングシステム Download PDFInfo
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- JP2023508687A JP2023508687A JP2022539258A JP2022539258A JP2023508687A JP 2023508687 A JP2023508687 A JP 2023508687A JP 2022539258 A JP2022539258 A JP 2022539258A JP 2022539258 A JP2022539258 A JP 2022539258A JP 2023508687 A JP2023508687 A JP 2023508687A
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- 230000001902 propagating effect Effects 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims description 31
- 239000003990 capacitor Substances 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 7
- 238000001514 detection method Methods 0.000 abstract description 9
- 238000005259 measurement Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 description 25
- 230000005669 field effect Effects 0.000 description 4
- 238000010348 incorporation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/483—Details of pulse systems
- G01S7/486—Receivers
- G01S7/487—Extracting wanted echo signals, e.g. pulse detection
- G01S7/4876—Extracting wanted echo signals, e.g. pulse detection by removing unwanted signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
- G01S7/4813—Housing arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/483—Details of pulse systems
- G01S7/486—Receivers
- G01S7/4865—Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
- H01L31/173—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier formed in, or on, a common substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
Abstract
Description
本開示のいくつかの実施形態について、ここで添付図面を参照して、例としてのみ説明する。
110 エミッタ
120 検出器
130 第1のダイ
140 第2のダイ
150 電気コンタクト(ダイ)
160 基板
170 電気コンタクト(基板)
180 シールド
182 第1のケーシング
184 第2のケーシング
186 レンズ
190 キャップ
192 第1のアパーチャ
194 第2のアパーチャ
200 既知のプリント回路基板
210 集積回路
220 入力部/出力部
230 コンデンサ
240 ダイ
250 導電路
260 第1の電圧源接続部
265 第2の電圧源接続部
270 グラウンド接続部
300 センシングシステム
310 エミッタ
315 エミッタ電極
320 検出器
330 電子部品
332 第1の電極
334 第2の電極
338 充填物
340 ダイ
350 電気コンタクト
400 センシングシステム
410 エミッタ
415 エミッタ電極
420 検出器
430 電子部品
432 第1の電子部品コンタクト
434 第2の電子部品コンタクト
436 第1の導電コネクタ
438 第2の導電コネクタ
440 ダイ
450 電気コンタクト(ダイ)
460 基板
470 電気コンタクト(基板)
S1~S4 第1、第2、第3および第4の方法ステップ
Claims (18)
- センシングシステムであって、前記センシングシステムは、
電磁放射を放出するように構成されたエミッタと、
電磁放射を検出するように構成された検出器と、
前記センシングシステムの回路と相互作用するように構成された電子部品と、
を備え、
前記電子部品は、前記エミッタと前記検出器との間に少なくとも部分的に配置されており、前記電子部品は、前記エミッタから前記検出器へ伝播する電磁放射の量を低減させる、
センシングシステム。 - 前記電子部品は、前記回路の電圧を少なくとも部分的に安定させるように、かつ/または、前記回路に作用するフィールドの影響を低減させるように構成されたコンデンサを備える、
請求項1記載のセンシングシステム。 - 前記電子部品は、前記回路のフィルタとして機能するように構成されたインダクタを備える、
請求項1記載のセンシングシステム。 - 前記電子部品は、前記回路のプルアップ抵抗器またはプルダウン抵抗器として機能するように構成された抵抗器を備える、
請求項1記載のセンシングシステム。 - 前記電子部品は、前記回路のRCフィルタとして機能するように構成された抵抗器およびコンデンサを備える、
請求項1記載のセンシングシステム。 - 前記電子部品は、前記回路に作用するフィールドの影響を低減させるように構成されたダイオードを備える、
請求項1記載のセンシングシステム。 - 前記センシングシステムは、前記センシングシステムの前記回路を収容するように構成されたダイを備え、前記電子部品は、前記ダイに配置されている、
請求項1記載のセンシングシステム。 - 前記エミッタおよび前記検出器は、前記ダイに配置されている、
請求項7記載のセンシングシステム。 - 前記センシングシステムは、前記ダイと前記センシングシステムのプリント回路基板との間に電気的接続をもたらすように構成された基板を備え、前記エミッタは、前記基板に配置されており、前記検出器は、前記ダイに配置されている、
請求項7記載のセンシングシステム。 - 前記センシングシステムは、前記電子部品と前記センシングシステムとの間に設けられた充填物を含む、
請求項1記載のセンシングシステム。 - 前記センシングシステムは、前記電子部品を受容するように構成された電極を備え、前記充填物は、前記電子部品を前記電極に取り付けるように構成された導電性接着剤を含む、
請求項10記載のセンシングシステム。 - 前記センシングシステムは、電気コンタクトと、前記電子部品を前記電気コンタクトに接続するように構成された導電コネクタと、を備え、前記充填物は、前記電子部品を前記センシングシステムに取り付けるように構成された非導電性接着剤を含む、
請求項10記載のセンシングシステム。 - 前記センシングシステムは、飛行時間センシングシステムである、
請求項1記載のセンシングシステム。 - 前記センシングシステムは、近接センシングシステムである、
請求項1記載のセンシングシステム。 - 請求項1記載のセンシングシステムを備える電子デバイス。
- 前記電子デバイスは、携帯電話機である、
請求項15記載の電子デバイス。 - 電磁放射を放出および検出する方法であって、請求項1記載のセンシングシステムを使用することを含む、方法。
- センシングシステムを製造する方法であって、前記方法は、
電磁放射を放出するように構成されたエミッタを設けるステップと、
電磁放射を検出するように構成された検出器を設けることと、
前記センシングシステムの回路と相互作用するように構成された電子部品を設けるステップと、
前記エミッタと前記検出器との間に少なくとも部分的に前記電子部品を配置するステップと、
を含み、
前記電子部品は、前記エミッタから前記検出器へ伝播する電磁放射の量を低減させる、
方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962953657P | 2019-12-26 | 2019-12-26 | |
US62/953,657 | 2019-12-26 | ||
PCT/EP2020/086493 WO2021130083A1 (en) | 2019-12-26 | 2020-12-16 | A sensing system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023508687A true JP2023508687A (ja) | 2023-03-03 |
JP7431979B2 JP7431979B2 (ja) | 2024-02-15 |
Family
ID=74104090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022539258A Active JP7431979B2 (ja) | 2019-12-26 | 2020-12-16 | センシングシステム |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230019676A1 (ja) |
EP (1) | EP4081885A1 (ja) |
JP (1) | JP7431979B2 (ja) |
CN (1) | CN114902168A (ja) |
WO (1) | WO2021130083A1 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008298485A (ja) | 2007-05-29 | 2008-12-11 | Yamatake Corp | 光電センサ |
JP5261320B2 (ja) | 2009-08-21 | 2013-08-14 | シャープ株式会社 | 光学式測距センサ、および、それを搭載した電子機器 |
GB2485990A (en) * | 2010-11-30 | 2012-06-06 | St Microelectronics Res & Dev | An optical user-input device using SPADs |
GB2486000A (en) * | 2010-11-30 | 2012-06-06 | St Microelectronics Res & Dev | Optical proximity detectors with arrangements for reducing internal light propagation from emitter to detector |
TW201320884A (zh) * | 2011-11-01 | 2013-05-16 | Jingle World Co Ltd | 減少行動電話之電磁波影響的方法 |
US20160050746A1 (en) * | 2013-04-11 | 2016-02-18 | Flatfrog Laboratories Ab | Printed Circuit Assembly And A Touch Sensitive System Comprising The Assembly |
WO2016038416A2 (en) | 2013-07-05 | 2016-03-17 | ActLight S.A. | Proximity sensor systems and methods of operating same |
US9354111B2 (en) * | 2013-10-18 | 2016-05-31 | Maxim Integrated Products, Inc. | Wafer level lens in package |
US9992477B2 (en) | 2015-09-24 | 2018-06-05 | Ouster, Inc. | Optical system for collecting distance information within a field |
US9985071B2 (en) | 2016-04-15 | 2018-05-29 | Qualcomm Incorporated | Active area selection for LIDAR receivers |
US10620176B2 (en) * | 2016-12-20 | 2020-04-14 | Zoetis Services Llc | Light controlling assembly for an egg identification system, and associated method |
US20180185959A1 (en) * | 2017-01-03 | 2018-07-05 | General Electric Company | System and methods for fabricating a component based on local thermal conductivity of a build material |
-
2020
- 2020-12-16 JP JP2022539258A patent/JP7431979B2/ja active Active
- 2020-12-16 WO PCT/EP2020/086493 patent/WO2021130083A1/en unknown
- 2020-12-16 EP EP20828748.2A patent/EP4081885A1/en active Pending
- 2020-12-16 CN CN202080089746.8A patent/CN114902168A/zh active Pending
- 2020-12-16 US US17/788,454 patent/US20230019676A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP4081885A1 (en) | 2022-11-02 |
WO2021130083A1 (en) | 2021-07-01 |
JP7431979B2 (ja) | 2024-02-15 |
US20230019676A1 (en) | 2023-01-19 |
CN114902168A (zh) | 2022-08-12 |
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