JP2023507205A - 回路基板上に配置された複数の発熱電子部品を冷却するための冷却装置およびその冷却装置を備えるシステム - Google Patents

回路基板上に配置された複数の発熱電子部品を冷却するための冷却装置およびその冷却装置を備えるシステム Download PDF

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Publication number
JP2023507205A
JP2023507205A JP2022538210A JP2022538210A JP2023507205A JP 2023507205 A JP2023507205 A JP 2023507205A JP 2022538210 A JP2022538210 A JP 2022538210A JP 2022538210 A JP2022538210 A JP 2022538210A JP 2023507205 A JP2023507205 A JP 2023507205A
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Japan
Prior art keywords
cooling
distributor unit
satellite
coolant
circuit board
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2022538210A
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English (en)
Japanese (ja)
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JPWO2021121688A5 (zh
Inventor
トーマス フェルナー
ベッティーナ フレミング
フリオ クンツ
エーベルハルト シュナイダー
ミヒャエル ニールセン
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インタープレックス ナス エレクトロニクス ゲーエムベーハー
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Publication of JP2023507205A publication Critical patent/JP2023507205A/ja
Publication of JPWO2021121688A5 publication Critical patent/JPWO2021121688A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022538210A 2019-12-19 2020-09-07 回路基板上に配置された複数の発熱電子部品を冷却するための冷却装置およびその冷却装置を備えるシステム Pending JP2023507205A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019135101.4 2019-12-19
DE102019135101.4A DE102019135101A1 (de) 2019-12-19 2019-12-19 Kühlvorrichtung zur Kühlung einer Vielzahl von auf einer Platine angeordneten und Wärme abgebenden Elektronikkomponenten sowie System umfassend die Kühlvorrichtung
PCT/EP2020/074952 WO2021121688A1 (de) 2019-12-19 2020-09-07 Kühlvorrichtung zur kühlung einer vielzahl von auf einer platine angeordneten und wärme abgebenden elektronikkomponenten sowie system umfassend die kühlvorrichtung

Publications (2)

Publication Number Publication Date
JP2023507205A true JP2023507205A (ja) 2023-02-21
JPWO2021121688A5 JPWO2021121688A5 (zh) 2023-09-15

Family

ID=72470349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022538210A Pending JP2023507205A (ja) 2019-12-19 2020-09-07 回路基板上に配置された複数の発熱電子部品を冷却するための冷却装置およびその冷却装置を備えるシステム

Country Status (6)

Country Link
EP (1) EP4052549A1 (zh)
JP (1) JP2023507205A (zh)
KR (1) KR20220118474A (zh)
CN (1) CN114902822A (zh)
DE (1) DE102019135101A1 (zh)
WO (1) WO2021121688A1 (zh)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US7187549B2 (en) * 2004-06-30 2007-03-06 Teradyne, Inc. Heat exchange apparatus with parallel flow
WO2006029527A1 (en) * 2004-09-13 2006-03-23 Lighthaus Logic Inc. Structures for holding cards incorporating electronic and/or micromachined components
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7298617B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
US8432691B2 (en) * 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
TWI404904B (zh) * 2010-11-19 2013-08-11 Inventec Corp 可拆式液態冷卻散熱模組
US8922998B2 (en) * 2011-10-26 2014-12-30 International Business Machines Corporation Coolant manifold with separately rotatable manifold section(s)
US9265176B2 (en) * 2013-03-08 2016-02-16 International Business Machines Corporation Multi-component electronic module with integral coolant-cooling
AU2015339823A1 (en) * 2014-10-27 2017-06-15 Ebullient, Llc Method of absorbing heat with series-connected heat sink modules
TWM534509U (en) * 2016-08-24 2016-12-21 Man Zai Ind Co Ltd Liquid-cooling heat dissipation assembly

Also Published As

Publication number Publication date
WO2021121688A1 (de) 2021-06-24
EP4052549A1 (de) 2022-09-07
CN114902822A (zh) 2022-08-12
KR20220118474A (ko) 2022-08-25
DE102019135101A1 (de) 2021-06-24

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