JP2023507205A - A cooling device for cooling a plurality of heat-generating electronic components arranged on a circuit board and a system comprising the cooling device - Google Patents

Abstract

The present invention relates to a cooling device 1 for cooling a plurality of heat generating electronic components 3 arranged on a circuit board 2. The cooling device 1 has a distributor unit 10 and at least one cooling satellite 20. A distributor unit has a coolant inlet 11 and a coolant outlet 12, and the coolant passes through the distributor unit 10 from the coolant inlet 11 to the coolant outlet 12 along a predetermined and fixed coolant path P. It flows. At least one cooling satellite 20 is fixed to the distributor unit 10 at a predetermined spatial position relative to the distributor unit 10. The cooling satellite 20 has a heat sink 23, a coolant inlet 21, and a coolant outlet 22, the heat sink 23 being able to make extensive contact with the at least one electronic component 3, and the coolant flowing through the cooling satellite 20. The coolant flows along the coolant path P from the coolant inlet 21 to the coolant outlet 22. A coolant path P extends through the distributor unit 10 and at least one cooling satellite 20 and along a portion of the heat sink 23 of the cooling satellite 20 . [Selection diagram] Figure 1

Description

The present invention relates to a cooling device for cooling a plurality of heat-generating electronic components arranged on a circuit board, and a system comprising such a cooling device and a circuit board having a plurality of electronic components arranged thereon. Regarding.

Electronic components such as CPUs or GPUs that emit heat during operation need to be cooled, and both cooling capacity and efficiency of cooling are critical to the efficiency of the electronic components.

In systems having multiple circuit boards with heat-generating electronic components, cooling the electronic components, or more precisely removing heat from the electronic components, is a space and cost issue.

Recently, such systems have also been made more compact, or more systems are provided in very small spaces, which is disadvantageous for cooling and consequently reduces the required cooling capacity and cooling power consumption. An increase also occurs.

For example, purely passive cooling devices that cool the components only by means of cooling fins are often not suitable in this regard as their cooling capacity is often insufficient. Even conventional cooling systems with fans often have insufficient cooling capacity, or require too much power to cool the electronic components sufficiently, so power consumption for cooling can be nearly half of the total power consumption of the system.

The prior art already contains various alternatives to pure passive cooling and pure air cooling based on fans or blowers.

Liquid-based cooling systems are one alternative, especially since the heat release to water is about 100 times the heat release to air, and even higher values can be achieved with other liquid coolants. . Therefore, it is possible to carry away a relatively large amount of heat with a relatively small water-filled tube.

In the prior art, there are basically three different alternatives to liquid-based cooling systems so far.

The first is classical water cooling, in which the individual electronic components are each associated with a heat sink through which water or another cooling medium is pumped, usually via flexible tubing lines. However, the problem here is that due to the presence of flexible pipe lines, automated production is not possible or can only be achieved with difficulty. In addition, leakage can occur due to aging phenomena and installation errors. It is also disadvantageous that only the parts in contact with the heat sink are cooled.

As an alternative to this, immersion cooling is known in the prior art. In this case, the entire system, more precisely the circuit board of the system, is positioned in an immersion bath so that liquid can circulate around and cool all the parts. However, in order to achieve this, it is necessary to use a low-corrosion, non-conductive liquid coolant such as oil as the cooling liquid or cooling medium. However, this type of solution is usually difficult to seal, and as a result is prone to leaks and "water" damage. Additionally, such systems are heavy and not portable due to the large amount of liquid required for the system. A short circuit of the circuit board can also occur if a conductive foreign object gets into the system, or more precisely into the liquid.

Newer solutions also provide cooling by a mixing system, or more precisely by two liquids separated from each other. Directly to the circuit board, or more precisely to the components placed on the circuit board, is provided in a closed system with a non-conductive, low corrosive liquid, thereby absorbing heat from the components. to transfer heat to the directly adjacent liquid cooled plate. Another cooling medium circulates through the plates, thereby carrying away heat. Such a system can be implemented in a hermetically sealed manner and does not require any separate flexible tubing, at least directly on the circuit board, making it relatively inexpensive due to the large volume of liquids used. It remains heavy but is relatively easy to produce.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to overcome the above-mentioned drawbacks and to provide a cooling device for cooling a plurality of heat-generating electronic components arranged on a circuit board, which cooling device is at the same time simple to manufacture. is cost effective to produce, is relatively lightweight, and allows for effective cooling of multiple components located on a circuit board.

This object is achieved by the combination of features according to claims 1 and 12 .

According to the present invention, a cooling device is proposed for cooling a plurality of heat-generating electronic components arranged on a circuit board. The cooling device has a distributor unit and at least one cooling satellite. The distributor unit is preferably of a dimensionally stable design and has a coolant inlet and a coolant outlet, along a predetermined fixed coolant path from its coolant inlet to its coolant outlet. to allow coolant to flow. At least one cooling satellite is fixed to the distributor unit at a predetermined spatial position relative to the distributor unit and has a heat sink, a coolant inlet and a coolant outlet. A heat sink of at least one cooling satellite can be in extensive surface contact with at least one electronic component of the plurality of electronic components. In addition, coolant may flow through the cooling satellites from their coolant inlets to their coolant outlets along a coolant path, the coolant path passing through the distributor unit and the at least one cooling satellite. , and along a portion of the heat sink of the cooling satellite.

The basic inventive idea is therefore to provide a distributor unit in which a cooling satellite or a plurality of cooling satellites are provided, whereby certain electronic components of the circuit board are selectively contacted and cooled. . In this case, the distributor unit, which may be provided in the form of a distributor plate, has a fixed and predetermined position with respect to the circuit board and is preferably dimensionally stable, thus allowing easy and automated assembly. enable. In addition, the distributor unit, more precisely, the cooling liquid transported therein, is not only transported via the cooling satellites, but also by other heat transport phenomena, the distributor unit, more precisely, It can also absorb the heat transported by the cooling liquid carried therein, thereby dividing the electronic components of the circuit board into two groups. The first group is provided to be directly cooled by the cooling satellites, and the second group, whose electronic components are not in direct contact with the cooling satellites, uses other heat transport phenomena to heat the distributor unit. can be released and this heat is absorbed and carried away by the distributor unit.

Both the distributor unit and the cooling satellites can each have multiple coolant inlets and multiple coolant outlets, through which the flow can be directed along one coolant path or through multiple parallel cooling channels. It can pass along the liquid path.

This advantageously allows the cooling device to be embodied in a modular fashion, allowing the cooling device to be arranged individually for different circuit boards. Since circuit boards are usually of standardized size, the same distributor unit can be provided for all sizes of circuit boards, having a specific shape and size adapted to the size of the circuit board. Depending on the position of the electronic components on the circuit board to be directly cooled, one cooling satellite or several cooling satellites can be installed in the grid or freely on the distributor unit, and the cooling liquid of one cooling satellite An inlet and a coolant outlet, or multiple coolant inlets and multiple coolant outlets of multiple cooling satellites, is a common coolant flow path from the coolant inlet to the coolant outlet of the distributor unit. It must be fluidly connected to cooling channels provided in the distributor unit so as to pass through each cooling satellite along a flow path or different flow paths.

For this purpose, advantageous variants of the cooling device include that the distributor unit is embodied as flat or frame-shaped. In a particularly advantageous variant, the distributor unit is embodied in the form of a flat distributor plate, more preferably having a length and width equal to the length and width of the circuit board.

Also, the distributor unit is in particular embodied as at least partially hollow, inside which it has one or more cooling channels and a flow path for the cooling liquid, more precisely the cooling liquid path. is defined in part by the cooling channels of the distributor unit and by the cooling satellites.

If the distributor unit is embodied as a frame shape, the circuit board, and more precisely the electronic components arranged thereon, are at least partially laterally enclosed. This also means that the distributor unit is embodied in two parts, the two parts of the distributor unit, more precisely the two layers of the distributor unit, being positioned opposite each other with respect to the circuit board. , in particular embodiments in which the circuit board is positioned between two portions of the distributor unit such that the two portions of the distributor unit are spaced from each other by the width or length of the circuit board.

Also advantageous is a variant of the cooling device having a cooling surface which faces the electronic components on the circuit board when the distributor unit is used appropriately. More preferably, the cooling surface is oriented parallel to or perpendicular to the surface of the circuit board. In this case, the electronic components of the circuit board are not in contact, or at least not in direct contact, with one of the cooling satellites, for example by convection or via air between the electronic component and the cooling surface. used to absorb heat emitted by and absorbed by the cooling surface.

As already mentioned above, an embodiment of the cooling device with at least one cooling channel defining the coolant path inside the distributor unit is advantageous. In this case, the cooling channels are used both to transport coolant from the distributor unit's cooling channel inlets to the respective cooling satellite's cooling channel inlets and to carry away heat from any cooling surface of the distributor unit. As a result, the heat absorbed from the cooling satellites and also directly by the distributor unit can be transported from the cooling device by the cooling liquid flowing through the cooling channel or channels.

In an alternative and equally advantageous variant, the cooling device comprises that the cooling channel is made up of several parts. Further, a first portion of the cooling channel extends from the coolant inlet of the distributor unit to the coolant inlet of the cooling satellite, and a second portion of the cooling channel extends from the coolant outlet of the cooling satellite to the distributor unit. Extends to the coolant outlet.

In this case, several different alternative variants are possible, depending on the exact embodiment of the cooling device.

In a first variant, a first portion of the cooling channel fluidly connects the coolant inlet of the distributor unit to the coolant inlets of all cooling satellites. A second portion of the cooling channel also fluidly connects the coolant outlets of all the cooling satellites to the coolant outlets of the distributor unit. The cooling satellites in this case are arranged fluidly parallel to each other.

In a second variant, all cooling satellites are arranged fluidically in series. A first portion of the cooling channel fluidly connects the coolant inlet of the distributor unit to the coolant inlet of the first cooling satellite. A second portion of the cooling channel fluidly connects the coolant outlet of the first cooling satellite to the coolant inlet of the second cooling satellite. This design, i.e., the connection of cooling satellites in series via the portion of the cooling channel that connects the cooling satellites to each other, can optionally extend to the end of the serially connected cooling satellites. The last part of the cooling channel connects the coolant outlet of the last cooling satellite to the coolant outlet of the distributor unit.

A third variant comprises a mixture of the first two variants in which groups of multiple cooling satellites arranged in fluidic series are fluidly connected to each other in parallel.

In order to ensure the most effective possible cooling of the cooling surfaces of the distributor unit, an advantageous variant of the cooling device comprises that the cooling channels run in a meandering manner within the distributor unit. Through smooth serpentine curves it is possible to form a fixed pattern or grid at the same time, which allows the cooling satellites to be fastened to the distributor unit and fluidly connected to the cooling channels in a particularly simple manner. For example, the serpentine curve can be opened externally, e.g., by a drill, such that a cooling channel can be opened and a section of a cooling satellite, such as a supply or discharge line described below, can be inserted therein. , may be marked or recognizable on the cooling surface of the distributor unit.

There is also an advantageous variant of the invention in which the distributor unit has two layers separated from each other, fluidly connected only by at least one cooling satellite and through which cooling liquid can flow. The two layers can be positioned next to or against each other, or can be spaced apart from each other. In this case, the coolant inlet of each cooling satellite is directly fluidly connected to the first of the two layers, or more precisely to the part of the cooling channel that extends through the first layer. It is In addition, the coolant outlet of each cooling satellite is directly fluidly connected to the second of the two layers, or more precisely to the part of the cooling channel that extends into the second layer. It is In addition, the coolant inlet of the distributor unit is positioned in and fluidly connected to the first layer and the coolant outlet of the distributor unit is positioned in and fluidly connected to the second layer. . Correspondingly, the coolant inlet of the distributor unit is preferably fluidly connected to a portion of the cooling channel extending through the first layer, and the coolant outlet of the distributor unit is preferably , is fluidly connected to a portion of the cooling channel extending through the second layer.

In order to mechanically and fluidically couple the at least one cooling satellite to the distributor unit, an advantageous variant of the cooling device also provides that one cooling satellite, and preferably each of the plurality of cooling satellites, has at least one including having one tubular supply line and one tubular discharge line. A tubular supply line fluidly connects the coolant inlet of the cooling satellite to the heat sink. A tubular exhaust line fluidly connects the heat sink to the coolant outlet of the cooling satellite. Preferably, the flow cross-section of the supply line through which the cooling liquid can flow corresponds to the flow cross-section of the discharge line, particularly in a serial or serial connection of cooling satellites, further provided in the distributor unit. corresponding to the flow cross-sectional area of the cooling channel, thus enabling a uniform volumetric flow rate of the cooling liquid along the entire cooling liquid path. Correspondingly, the coolant flow passes through the supply line and the exhaust line, so that the supply line and the exhaust line each define a section of the coolant path. Supply and discharge lines connect the cooling satellites to and secure to the distributor unit. Additionally, the supply and exhaust lines maintain the cooling satellites in place relative to the distributor unit.

Possible cross-sectional shapes for the supply and discharge lines include both angular and round shapes. Preferably, the supply line and the discharge line are embodied at a distance from each other, and there is also an advantageous variant in which the supply line and the discharge line are arranged coaxially to each other. In this case, each inner line may be simultaneously connected to a heat sink and/or integrally embodied thereby, so that the inner lines around which the cooling liquid flowing in the outer lines circulates are used as cooling fins or cooling surfaces. It is particularly advantageous to function In this case, the outer lines extend into a first layer of distributor units and the inner lines extend into a second layer of distributor units positioned behind the first layer with respect to the cooling satellites. It is advantageous if

Also, the supply lines and/or the discharge lines have a width or diameter corresponding to the width or diameter of the cooling channels in the distributor unit, so that the cooling channels in the distributor unit are the same as the supply lines or the discharge lines. It is also advantageous if the insertion into the cooling channel is sealed and the cooling liquid has to flow through openings provided in the supply or discharge lines. For this purpose, in sections where the supply line or the discharge line extends into the distributor unit, the supply line and/or the discharge line are preferably arranged so that the cooling liquid leaves the cooling channel of the distributor unit and enters the supply line. or respectively out of the discharge line and into the cooling channel of the distributor unit.

An advantageous embodiment variant of the cooling device includes the fact that at least one cooling satellite adjacent to the heat sink defines a section of the coolant path and forms a hollow space through which the coolant can flow. . At least one cooling satellite also has cooling fins coupled to the heat sink in the hollow space.

Also preferably with the fact that the cooling fins extend into the supply line and/or the discharge line, so that the coolant circulates around the cooling fins already present in the supply line and/or the discharge line. .

Where multiple cooling satellites are provided, they may also be embodied in different ways with respect to the length of the section of the coolant path defined by the cooling satellites. For example, the heat sink of the first cooling satellite if the first cooling satellite has to cool an electronic component that requires more cooling than another electronic component provided on the circuit board. may be embodied with a larger area and the section of the coolant path extending along the heat sink may be embodied longer so that more heat flows through the first cooling satellite. It can be absorbed and carried away by the coolant. A cooling capacity adapted to each component to be cooled can also be achieved by local variations in the coolant flow velocity at the component and the resulting flow effects. Each cooling satellite is also adapted to a respective electronic component, e.g. having different length supply and discharge lines, so that despite the different dimensions of the electronic components, the cooling satellites are suitable for them. can be adapted to

In order to fasten each cooling satellite to its respective electronic component, the embodiment also provides that each cooling satellite fastens the distributor plate to the circuit board, or more precisely, to the circuit board. pressed against the electronic component by connecting elements of the distributor plate for fixing to the electronic component. Alternatively, at least some of the cooling satellites may be provided with fastening sockets so that each cooling satellite can be directly fixed to the circuit board and pressed against the respective electronic component.

The distributor unit is provided with coupling elements for fixing the distributor unit to the circuit board so that the distributor unit and the entire cooling device can be fixed in place with respect to the circuit board. The connecting element has a predetermined position with respect to at least one cooling satellite, so that by positioning the distributor unit with respect to the circuit board with the connecting element, the cooling satellite is to be cooled. It can be positioned simultaneously on each associated part. Correspondingly, the distributor unit can be placed in place relative to the circuit board and the cooling satellite can be placed in place relative to or on the electronic component. can.

Additionally, the cooling device can have a housing or frame embodied to house the distributor unit and cooling satellites and the circuit board. The housing can also be embodied to accommodate a circuit board. Alternatively, the housing can be open on one side through which the circuit board can be inserted into the opening, thus constituting a cover closing the open hollow space of the housing. The housing may also integrally form the connecting element and thus define the maintenance of a predetermined position, more precisely the distributor unit relative to the circuit board.

Another aspect of the invention also relates to a system comprising a cooling device according to the invention and a circuit board having heat-generating electronic components arranged thereon. In this case, the distributor unit of the cooling device is in position relative to the circuit board, with the heat sink of at least one cooling satellite in contact with at least one of the electronic components. In this case, the heat sink can be in direct contact with the electronic component, or the heat sink can be in indirect contact with the electronic component via heat conducting means such as a heat conducting pad or thermal paste.

Another advantageous variant of the system is characterized in that the distributor unit is embodied in the form of a distributor plate and of flat geometry, positioned parallel to and at a predetermined distance from the circuit board. , at least one cooling satellite is positioned between the circuit board and the distributor plate, with supply and exhaust lines of the cooling satellite extending perpendicular to the circuit board to the distributor plate. Alternatively, the distributor unit is embodied as a frame shape. In this alternative, the distributor unit at least partially surrounds or laterally surrounds the circuit board and/or electronic components disposed thereon, preferably each layer or section of the distributor unit , are positioned opposite each other, and cooling satellites are positioned between and fluidly couple these sections or layers to each other.

Another advantageous embodiment of the system is that the system includes a housing, with the circuit board and/or the distributor unit integrally forming a section of the housing. In this case, electronic components and cooling satellites are positioned in the interior space defined by the housing.

In this case, the distributor unit can have a cooling surface integrally forming the inner surface of the housing facing the interior space, so that the heat emitted by the electronic components is at least partially absorbed by the cooling surface. It can be absorbed and carried away through the distributor unit, more precisely by the coolant flowing through it.

One variation is that the housing also has ventilation holes through which the interior space is open to the outside, e.g. air can flow through the interior space, thereby Including that in addition to liquid cooling, air cooling can also be implemented at the same time.

Another aspect to be mentioned is also a method for manufacturing a cooling device. This includes, inter alia, that uniform distributor units are provided for a plurality of circuit boards. Openings are then made in the distributor unit according to the positions of the electronic components on the circuit board to be cooled, after which the supply and discharge lines of the cooling satellites are inserted into these openings and the respective cooling The feed and drain lines are embodied such that the heat sinks of the satellites contact their respective electronic components while the distributor unit is in place relative to the circuit board.

The features disclosed above can be combined in any way that is technically possible and provided that the combined features do not conflict with each other.

Other advantageous variants of the invention are disclosed in the dependent claims and are explained in more detail below together with the description of preferred embodiments of the invention on the basis of the drawings.

FIG. 1 shows a first variant of a system comprising a cooling device or a cooling device and a circuit board. FIG. 2 shows a second variant of the system with cooling device or cooling device and circuit board. FIG. 3 shows a third variant of the cooling device. FIG. 4 shows a fourth variant of the cooling device. FIG. 5 shows a fifth variant of the cooling device in FIG. FIG. 6 shows a fifth variant of the cooling device in FIG. FIG. 7 shows a first variant of the cooling satellite. FIG. 8 shows a first variant of the cooling satellite in cross-section. FIG. 9 shows a second variant of the cooling satellite. FIG. 10 shows the heat sink of the second variant of the cooling satellite. FIG. 11 shows a third variant of the cooling satellite. FIG. 12 schematically shows a first variant of a cooling device with two layers. FIG. 13 shows a sixth variant of the cooling device. FIG. 14 schematically shows a second variant of a cooling device with two layers.

The figure is an example depicted schematically. The same reference numbers in the figures are used to indicate the same functional and/or structural features.

1 and 2 each show a variant of the cooling device 1 together with the circuit board 2, the electronic component 3 being in contact with and being cooled by the cooling satellites 20 of the cooling device 1. FIG. The cooling device 1 of FIGS. 1 and 2 with the respective circuit board 1 therefore also corresponds to the system 1 ′ composed of the cooling device 1 and the circuit board 2 .

The circuit board provided as an example in FIGS. 1 and 2 has three electronic components 3 to be cooled, and in different embodiments more or less electronic components 3 requiring cooling may also be provided. The cooling device 1 is adapted to each circuit board and has, for example, cooling satellites 20 corresponding to the number of electronic components 3 to be cooled and arranged in a corresponding arrangement.

In addition to the electronic components 3 to be cooled, further other electronic components not shown that are not directly cooled or need to be cooled by the cooling satellites 20 of the cooling device 1 can also be provided on the circuit board. .

Each of the variants of cooling device 1 disclosed in FIGS. 1 and 2 is provided with a distributor unit 10 having two layers 101 , 102 . The two layers 101, 102 of the distributor unit 10 are fluidly separated, more precisely via three respective cooling satellites 20 fluidly connected in parallel between the layers 101 and 102. only connected.

Starting from the coolant inlet 11 of the distributor unit 10 fluidly connected to the first layer 101, the coolant is led to the three cooling satellites 20 along coolant paths not shown in FIGS. , through which it flows to the second layer 102 of the distributor unit 10 and is conveyed to the coolant outlet 12 of the distributor unit 10 . As the coolant flows through the cooling satellites 20, the coolant absorbs the heat released by the electronic components 3 to their respective adjacent cooling satellites 20 and carries it away.

Distributor units 10, embodied as frame-shaped in the variant shown in FIGS. 1 and 2, each form one or more cooling surfaces 13 extending perpendicularly to the circuit board 2, thereby allowing the circuit to cool. It is even possible to absorb the heat emitted by the components of the substrate 2 and transfer the heat to the cooling liquid, thus cooling components that are not directly cooled by the cooling satellites 20 .

The cooling satellites 20 used in the variant according to FIG. 2 are explained in detail in the description relating to FIG. The cooling satellites 20 of the variant according to FIG. 1 are basically identical in design, but embodied as flatter, in this case the supply of each cooling satellite 20 seen in the variant of FIG. Line 24 and discharge line 25 extend directly to circuit board 2 .

Figures 3 and 4 each disclose a respective embodiment of the cooling device 1 in which the distributor unit 10 comprises only one layer. Each distributor unit 10 is positioned parallel to a circuit board, not shown, such that one cooling satellite 20 or multiple cooling satellites 20 are positioned between the circuit board and the distributor unit 10 .

In the variant shown in FIG. 3, a flat distributor unit 10 or distributor plate is provided in which one cooling satellite 20 is arranged. The latter is embodied in one piece and is integral to the distributor unit 10 . Additionally, an opening or open space 15 is provided in the distributor unit 10 to save material and weight.

In the distributor unit 10, cooling channels, not shown, are embodied, as shown in FIGS. The cooling channels can be embodied in one piece or in multiple pieces, connecting the existing cooling satellites 20 in parallel to the coolant inlet 11 of the distributor unit 10 and the coolant outlet 12 of the distributor unit 10. or can be connected in series.

FIGS. 5 and 6 show another advantageous variant of the cooling device 1 with cooling satellites 20, 20' provided on the distributor unit 10 and the electronic components 3 of the circuit board 2, not shown. In FIG. 5, the view is shown obliquely from below so that the cooling surface 13 of the distributor unit 10 opposite to is visible. The distributor unit 10 may also be embodied as a flat distributor plate having a single layer, the distributor unit 10 passing from the coolant inlet 11 of the distributor unit 10 through cooling channels 14 of the type shown in FIG. The coolant is conveyed to the coolant outlet 12 of the unit 10 . The cooling satellites 20, 20' are arranged fluidly in series with each other such that the cooling channel 14 is subdivided into a plurality of sections or portions by the supply lines 24 and the discharge lines 25 of the two cooling satellites 20, 20'. It is A first portion 141 of the cooling channel 14 leads from the coolant inlet 11 of the distributor unit 10 to the coolant inlet 21 of the first cooling satellite 20 and a third portion 143 of the cooling channel 14 leads to the first cooling channel. Leading from the coolant outlet 22 of the satellite 20 to the coolant inlet 21 of the second cooling satellite 20 ′, the second portion 142 of the cooling channel 14 extends from the coolant outlet 22 of the second cooling satellite 20 to the distributor unit 10 . to the coolant outlet 12 of the . In this case, the individual parts 141 , 142 , 143 of the cooling channel 14 , more precisely the cooling channel 14 as a whole, extend in a meandering manner within the distributor unit 10 , whereby through the cooling channel 14 The flowing coolant cools the entire cooling surface 13 of the distributor unit 10 and carries away heat.

As shown in FIG. 6, the cooling channels 14 in the distributor unit 10 can be embodied in such a way that, for example, the distributor plate is made of solid material and the cooling channels 14 are milled therein. , and the resulting open upper side is closed by a cover, as shown in FIG.

The variant shown in FIGS. 5 and 6 comprises two different cooling satellites 20, 20', which basically differ only in the configuration of the supply lines 24 and the discharge lines 25. Alternatively, it is possible to have two identical cooling satellites 20, 20'. In the first cooling satellite 20, the supply line 24 and the discharge line 25 each have a rectangular channel cross-section and are more precisely embodied as rectangular tubes. A second variant, cooling satellite 20', comprises circular flow cross-sections of the supply line 24 and the discharge line 25, more precisely each comprising a circular tube. In both variants of cooling satellites 20, 20', the width or diameter of supply line 24 and discharge line 25 is preferably equal to the width of cooling channel 14, whereby cooling channel 14 is ', such that the coolant must flow through the coolant inlet 21 and the coolant outlet 22 of the cooling satellites 20, 20', or generally speaking. For example, it must flow through the cooling satellites 20, 20'.

A variant of the first cooling satellite 20 seen in FIGS. 5 and 6 is shown in more detail in FIGS. 7 and 8, which shows a schematic cross section through the cooling satellite 20. FIG. As already explained above, supply line 24 and discharge line 25 each comprise a respective rectangular tube extending from base body 28 of cooling satellite 20 to coolant inlet 21 and coolant outlet 22 . A hollow space 26 bordering the heat sink 23 is defined within the base body 28, the heat sink 23 preferably being constructed of a material with particularly good thermal conductivity, such as copper. In addition, the heat sink 23 is embodied such that the side that contacts the electronic components 3 of the circuit board 2 directly or via heat-conducting means faces away from the hollow space 26 . The coolant path P, more precisely the section of the coolant path P that extends into the cooling satellite 20, leads from the coolant inlet 21 of the cooling satellite 20 through the supply line 24 into the hollow space 26 and into the hollow space. 26 through a discharge line 25 to a coolant outlet 22 . The coolant path P extends adjacent to the heat sink 23 within the hollow space 26 . The coolant path P can extend in a meandering manner in the hollow space, and the hollow space 26 can be correspondingly embodied or have guide elements defining the coolant path P. .

A modification of the cooling satellite 20 variant seen in FIGS. 7 and 8 is disclosed in FIGS. Cooling satellite 20 includes cooling fins 27 fixed to or integrally formed with heat sink 23, as shown in FIGS. Cooling fins 27 are made of a material such as copper that has excellent thermal conductivity. In the illustrated exemplary embodiment, the cooling fins 27 extend into the supply line 24 and the exhaust line 25 of the cooling satellite 20, essentially to the coolant inlet 21 or the coolant outlet 22 of the cooling satellite 20. Including being extended. Therefore, the heat transferred to the heat sink 23 can be transferred or radiated to the coolant through the cooling fins 27 over a larger area and along a longer section of the coolant path P, thus allowing more effectively carried away.

A variant of the cooling satellites 20 shown in FIG. 11 preferably comprises two separate layers 101, 102 of the distributor unit 10 fluidly coupled to each other by one or more cooling satellites 20, as shown in FIG. should be used with any embodiment of the cooling device 1 that is The cooling satellite 20 of FIG. 11 basically also includes a base body 28 connected to a heat sink 23, not shown, and defining a hollow space 26 therein, also not shown. The hollow space 26 is in this case connected to the coolant inlet 21 of the cooling satellite 20 via a tubular supply line 24 and to the coolant outlet 22 via a tubular outlet line 25, As also shown in FIG. 14, the section of the coolant path extending into the substrate can be embodied as a serpentine.

In the variant of the cooling device shown in FIGS. 12 to 14, the distributor unit 10 is divided into a first layer 101 and a second layer 102 respectively, the schematic diagram according to FIG. The function of each cooling device 1 corresponding to FIGS. 1 and 2 is shown.

Figure 12 shows a distributor unit 10 having a first layer 101 and a layer 102 directly adjoining it. In this case, the first layer 101 corresponds to a distributor for low-temperature coolant, in which the coolant is conveyed from the coolant inlet of the distributor unit to the coolant inlets 21 of all cooling satellites 20 . The coolant flows through the cooling satellites 20 into the second layer 102 and is heated within the cooling satellites 20 in the process. In the second layer 102, the coolant from all cooling satellites 20 is collected and conveyed to the coolant outlet of the distributor unit. The coolant path P is thus divided into a plurality of sections P1, P2, P3. Coolant is supplied to all cooling satellites 20 via a first section P1 of the coolant path. A second section P2 of the coolant path extends through the cooling satellites 20 respectively. A third section P3 of the coolant path defines the coolant path in the second layer 102 and extends from the coolant outlet 22 of the cooling satellite 20 to the coolant outlet 12 of the distributor unit 10, more precisely the third 2 layer 102 to the coolant outlet 12 .

12 corresponds to the variant of FIG. 13, in which a section of supply line 24 extends through second layer 102 into first layer 101 of distributor unit 10 and discharge It is clear that a section of line 25 extends only into second layer 102 and not into first layer 101 . In this case, the layers 101, 102 of the distributor unit 10 are not embodied to be perfectly aligned, but instead define respective sections in which the layers 101, 102 directly abut one another. The distributor unit 10, more precisely the layers 101, 102, also define an open space 15 provided to save material and weight. In this case it is advantageous that sections in which only one of the layers 101, 102 is present can also be provided.

Figure 14 shows a variant of the system 1' in which the cooling device 1, more precisely the distributor unit 10, consists of two layers 101, 102 spaced apart from each other. The layers 101, 102 are fluidly connected by cooling satellites 20, and the cooling liquid, i.e. the coolant, flows from the coolant inlet 11 of the first layer 11 along the section P1 of the coolant path P all the way to the cooling. Distributed to the satellites 20 and flowing through the cooling satellites 20 along respective sections P2 of the coolant path P, absorbing heat in the process, the coolant flows through the sections of the coolant path within the second layer 102. It is collected along P3 and conveyed to the coolant outlet 12 of the distributor unit 10 .

Embodiments of the invention are not limited to the preferred exemplary embodiments disclosed above. On the contrary, there are several possible variations using the disclosed solution, even in fundamentally different embodiments.

Claims (15)

A cooling device (1) for cooling a plurality of heat-generating electronic components (3) arranged on a circuit board (2),
said cooling device (1) comprises a distributor unit (10) and at least one cooling satellite (20),
The distributor unit (10) has a cooling liquid inlet (11) and a cooling liquid outlet (12), the cooling liquid passing through the distributor unit (10) from the cooling liquid inlet (11) to the cooling liquid. able to flow along a predetermined fixed coolant path (P) to the liquid outlet (12);
said at least one cooling satellite (20) is fixed to said distributor unit (10) at a predetermined spatial position with respect to said distributor unit (10), said cooling satellite (20) comprising a heat sink (23); having a coolant inlet (21) and a coolant outlet (22);
The heat sink (23) is capable of extensive contact with at least one electronic component (3) of the plurality of electronic components (3), and the cooling liquid flows through the cooling satellites (20). can flow along said coolant path (P) from a coolant inlet (21) to its coolant outlet (22),
The coolant path (P) extends through the distributor unit (10) and the at least one cooling satellite (20) and along part of the heat sink (23) of the cooling satellite (20). cooling device (1). 2. Cooling device according to claim 1, wherein the distributor unit (10) is embodied as flat or frame-shaped. 3. According to claim 1 or 2, wherein said distributor unit (10) has a cooling surface (13) which, when properly used, is oriented facing said electronic components (3) on said circuit board (2). Cooling device as described. A cooling device according to any one of the preceding claims, comprising at least one cooling channel (14) defining the cooling liquid path (P) inside the distributor unit (10). Said cooling channel (14) is composed of a plurality of parts, a first part (141) of said cooling channel (14) cooling from said coolant inlet (11) of said distributor unit (10). Extending to said coolant inlet (21) of satellite (20), a second portion (142) of said cooling channel (14) extends from said coolant outlet (22) of cooling satellite (20) to said distributor. 5. Cooling device according to claim 4, extending to the coolant outlet (12) of the unit (10). 6. Cooling device according to claim 4 or 5, wherein the cooling channel (14) extends in a meandering manner through the distributor unit (10). said distributor unit (10) having two layers (101, 102) separated from each other and fluidly connected only by said at least one cooling satellite (20) and through which said cooling liquid can flow; death,
said coolant inlet (21) of each cooling satellite (20) being in direct fluid connection with a first of said two layers (101, 102) (101), each cooling satellite (20) said coolant outlet (22) of is in direct fluid communication with a second of said two layers (101, 102) (102),
The coolant inlet (11) of the distributor unit (10) is provided in the first layer (101) and the coolant outlet (12) of the distributor unit (10) is provided in the second layer. A cooling device according to any one of the preceding claims, provided in two layers (102). A cooling satellite (20) comprises at least one tubular feed line (24) fluidly connecting said coolant inlet (21) of said cooling satellite (20) to said heat sink (23) and said heat sink (23). a tubular discharge line (25) fluidly connected to the coolant outlet (22) of the cooling satellite (20);
said supply line (24) and said discharge line (25) each define a section of said coolant path (P);
Said cooling satellite (20) is fixedly connected to said distributor unit (10) by said supply line (24) and discharge line (25) and in position relative to said distributor unit (10). A cooling device according to any one of the preceding claims, maintained. said at least one cooling satellite (20) adjacent to said heat sink (23) defines a section of said coolant path and forms a hollow space (26) through which said coolant can flow;
According to any one of the preceding claims, wherein said at least one cooling satellite (20) has cooling fins (27) connected to said heat sink (23) within said hollow space (26). Cooling device as described. 10. Cooling device according to claim 9, wherein the cooling fins (27) extend into the supply line (24) and/or the discharge line (25). the distributor unit (10) is provided with a connecting element for fixing the distributor unit (10) to the circuit board (2),
Said connecting element has a predetermined position with respect to said at least one cooling satellite (20) and a distributor unit (10), said distributor unit (10) having a predetermined position with respect to said circuit board (2). 11. The cooling device according to any one of the preceding claims, wherein the cooling satellite (20) can be arranged in a predetermined position with respect to the electronic component (3). A system (1') comprising a cooling device (1) according to any one of claims 1 to 11 and a circuit board (2) on which heat-generating electronic components (3) are arranged There is
The distributor unit (10) of the cooling device (1) has a predetermined position with respect to the circuit board (2) and the heat sink (23) of the at least one cooling satellite (20) A system (1') in contact with at least one of the electronic components (3). said distributor unit (10) being embodied as a flat one in the form of a distributor plate and positioned parallel to said circuit board (2) and at a predetermined distance from said circuit board (2); wherein said at least one cooling satellite (20) is positioned between said circuit board (2) and said distributor plate (10), said cooling satellite (20) supply line (24) and exhaust A line (25) extends perpendicularly to the circuit board (2) to the distributor plate (10), or the distributor unit (10) is embodied as a frame shape, and the circuit 13. System according to claim 12, at least partially enclosing a substrate (2) and/or the electronic components (3) arranged thereon. said system (1') comprising a housing (30), said circuit board (2) and/or said distributor unit (10) integrally forming a section of said housing (30);
14. System according to claim 12 or 13, wherein the electronic component (3) and the at least one cooling satellite (20) are positioned in an interior space defined by the housing (30). 15. System according to claim 14, wherein the distributor unit (10) has a cooling surface (13) integrally forming the inner surface of the housing (30) facing the interior space.

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