JP2023178889A - Information processing device, display input device and program - Google Patents

Abstract

An object of the present invention is to reduce the number of man-hours by standardizing settings for the polishing content of a probe.
An information processing device sets the polishing content of a probe that contacts an object to be inspected. The information processing device includes an area setting unit that sets a polishing area in a polishing member for polishing the probe, a pattern setting unit that sets an operation pattern when polishing the probe, the set polishing area, and the set polishing area. The apparatus further includes a simulation unit that calculates a relative trajectory between the polishing member and the probe based on the operation pattern.
[Selection diagram] Figure 4

Description

The present disclosure relates to an information processing device, a display input device, and a program.

Patent Document 1 discloses a polishing method for polishing the needle tips of a plurality of probes that come into contact with a test object during testing in an inspection device (prober device) that electrically tests a test object such as a wafer. .

In polishing the probe, requirements regarding the form of the polishing member (for example, the size and layout of the grindstone) and the operation during polishing (for example, the operation pattern of the polishing member) vary depending on the user who uses the inspection device. Conventionally, an apparatus has been provided that performs polishing operations for each user by individually designing the inspection apparatus at the time of manufacturing or setting the inspection apparatus based on the requirements of each user.

Japanese Patent Application Publication No. 2010-48789

The present disclosure provides a technique that can reduce the number of man-hours by standardizing the settings for the polishing content of the probe.

According to one aspect of the present disclosure, there is provided an information processing device that sets the polishing content of a probe that contacts an object to be inspected, the information processing device including an area setting unit that sets a polishing area in a polishing member that polishes the probe; a pattern setting unit that sets an operation pattern during polishing; and a simulation unit that calculates a relative trajectory between the polishing member and the probe based on the set polishing area and the set operation pattern. An information processing device having the following is provided.

According to one aspect, the number of man-hours can be reduced by standardizing the settings for the polishing content of the probe.

FIG. 1 is a schematic explanatory diagram showing the overall configuration of an inspection device and a setting computer according to an embodiment. FIG. 1 is a block diagram showing the overall configuration of a processing system including an inspection device. FIG. 2 is a block diagram showing the hardware configuration of a control device and a setting computer. FIG. 2 is a block diagram showing functional blocks for setting polishing contents in a setting computer. FIG. 3 is a diagram showing a main screen for setting polishing contents. FIG. 6(A) is a diagram showing a polishing media selection button. FIG. 6(B) is a diagram showing a size input screen. FIG. 6(C) is a diagram showing another size input screen. FIG. 7(A) is a diagram showing the installation number selection button. FIG. 7(B) is a diagram showing a conduction area selection button. FIG. 7(C) is a diagram showing a multiple area input screen. FIG. 8(A) is a diagram showing another multiple area input screen. FIG. 8(B) is a first diagram showing yet another multiple area input screen. FIG. 8(C) is a second diagram showing yet another multiple area input screen. FIG. 6 is a diagram schematically showing the display of a setting input screen and a pattern setting screen as the display screen is operated. It is a figure showing a setting input screen. FIG. 11(A) is a plan view schematically showing the misalignment between the polishing member and each probe. FIG. 11(B) is a plan view schematically showing a state in which the polishing member and each probe are brought into alignment by movement based on the index amount. FIG. 12(A) is a diagram showing pattern selection buttons. FIG. 12(B) is a diagram showing the pattern setting screen. FIG. 13(A) is a first diagram showing a free pattern setting screen. FIG. 13(B) is a second diagram showing the free pattern setting screen. FIG. 14A is a diagram schematically showing the settings of multiple frames in the simulation. FIG. 14(B) is a diagram schematically showing the usage range of the polishing member in the simulation. FIG. 1 is a diagram illustrating a main screen display during simulation. FIG. 2 is a diagram illustrating a main screen display during simulation. FIG. 17A is a diagram schematically showing a plurality of frames and polishing areas in the simulation. FIG. 17(B) is a diagram schematically showing a plurality of plots and polishing areas in the simulation.

Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same components are given the same reference numerals, and redundant explanations may be omitted.

As shown in FIG. 1, the information processing device according to one embodiment includes a setting computer 80 that is connected to an inspection device 10 that polishes a plurality of probes 33 (probes) used in inspection, and that configures polishing contents. It is configured as. In the following description, the configuration of the inspection apparatus 10 will first be described in order to facilitate understanding of the operation and the like during polishing of each probe 33.

The inspection apparatus 10 according to the present embodiment is installed, for example, in a factory that manufactures wafers W, which are an example of substrates (see also FIG. 2), and performs electrical inspection of the manufactured wafers W. On the surface of the wafer W, a plurality of semiconductor devices (LSI, semiconductor memory, etc.), which are devices under test (DUT) with which each probe 33 comes into contact, are formed. In electrical inspection, semiconductor devices are tested for abnormalities and electrical characteristics. Note that the substrate is not limited to the wafer W, and may be a carrier on which a semiconductor device is placed, a glass substrate, a single chip, an electronic circuit board, or the like.

The inspection apparatus 10 includes a loader 11 that transports a wafer W, a casing 20 disposed adjacent to the loader 11, a tester 30 disposed above the casing 20, and a stage housed within the casing 20. 40, and a control device 90 that controls each component of the inspection device 10.

The loader 11 takes out the wafer W from a FOUP (Front Opening Unified Pod) (not shown) and places it on the stage 40 that has moved inside the housing 20 . Further, the loader 11 takes out the inspected wafer W from the stage 40 and stores it in the FOUP.

The housing 20 is formed into a substantially rectangular box and has an inspection space 21 therein for inspecting the wafer W. A stage 40 for transporting the wafer W is installed below the inspection space 21 . The wafer W placed on the stage 40 from the loader 11 in the inspection space 21 moves in three-dimensional directions (X-axis direction, Y-axis direction, Z-axis direction) by the operation of the stage 40.

A probe card 32 is held in the upper part of the housing 20 via an interface 31 . The interface 31 includes a performance board (not shown) and a large number of connection terminals, and is electrically connected to the tester 30 via a test head (not shown). The tester 30 is connected to the control device 90 of the inspection apparatus 10 and tests the wafer W under the commands of the control device 90.

The probe card 32 has a plurality of probes 33 that protrude downward into the inspection space 21 . During inspection by the inspection apparatus 10, each probe 33 comes into contact with a pad or solder bump of each DUT on the wafer W that has been moved to an appropriate three-dimensional coordinate position by the stage 40. As a result, appropriate circuits formed on one or more test boards (not shown) of the tester 30 are electrically connected to each DUT on the wafer W. In this conductive state, the tester 30 performs an electrical test on each DUT that each probe 33 is in contact with.

The stage 40 is provided within the housing 20 and transports the wafer W or probe card 32 in the inspection space 21. For example, the stage 40 transports the wafer W from the loader 11 to a position facing the probe card 32 and raises the wafer W toward the probe card 32 to bring the wafer W into contact with the plurality of probes 33 . After the inspection, the stage 40 lowers the inspected wafer W from the probe card 32 and further transports the wafer W toward the loader 11.

Specifically, the stage 40 includes a moving unit 41 (X-axis moving mechanism 42, Y-axis moving mechanism 43, Z-axis moving mechanism 44) movable in the X-axis direction, Y-axis direction, and Z-axis direction, and a mounting table 45. and a stage control section 49. Furthermore, the housing 20 includes a frame structure 22 that supports the moving unit 41 and the mounting table 45 of the stage 40, and the stage control unit 49 in two upper and lower stages. In addition to moving the mounting table 45 in the X-axis direction, Y-axis direction, and Z-axis direction, the moving unit 41 may be configured to rotate the mounting table 45 around an axis (in the θ direction).

The X-axis moving mechanism 42 of the moving unit 41 includes a plurality of guide rails 42a fixed to the upper surface of the frame structure 22 and extending along the X-axis direction, and an X-axis movable body 42b arranged between the guide rails 42a. and, including. The X-axis movable body 42b has an X-axis operating section (not shown) (a motor, a gear mechanism, etc.) inside, and this X-axis operating section is connected to the stage control section 49. The X-axis movable body 42b reciprocates in the X-axis direction based on power supplied from a motor driver (not shown) of the stage control section 49.

Similarly, the Y-axis moving mechanism 43 includes a plurality of guide rails 43a fixed to the upper surface of the X-axis movable body 42b and extending along the Y-axis direction, and a Y-axis movable body disposed between the guide rails 43a. 43b. The Y-axis movable body 43b has a Y-axis operating section (not shown) (a motor, a gear mechanism, etc.) inside, and this Y-axis operating section is connected to the stage control section 49. The Y-axis movable body 43b reciprocates in the Y-axis direction based on power supplied from a motor driver (not shown) of the stage control unit 49.

The Z-axis moving mechanism 44 includes a fixed body 44a installed on the Y-axis movable body 43b, and a Z-axis movable body 44b that moves up and down along the Z-axis direction relative to the fixed body 44a. A mounting table 45 is held at the top of the body 44b. The Z-axis moving mechanism 44 has a Z-axis operating section (not shown) (a motor, a gear mechanism, etc.), and this Z-axis operating section is connected to the stage control section 49. The Z-axis movable body 44b is displaced in the Z-axis direction (vertical direction) based on power supplied from a motor driver (not shown) of the stage control unit 49, and accordingly raises and lowers the wafer W held on the mounting table 45.

The mounting table 45 is a device on which the wafer W is directly mounted, and holds the wafer W on the mounting surface 45s using appropriate holding means. For example, when vacuum suctioning the wafer W, the holding means has a suction passage for suction in the mounting table 45, and is equipped with piping and a suction pump connected to the suction passage at appropriate locations.

The stage control unit 49 is connected to the control device 90 and controls the operation of the stage 40 based on commands from the control device 90. The stage control section 49 includes an integrated control section that controls the operation of the entire stage 40, a PLC and motor driver that controls the operation of the moving section 41, a lighting control section, a power supply unit, etc. (both not shown).

The control device 90 can be a general-purpose computer having a control main body 91 that controls the entire inspection device 10 and a display input device 92 (user interface) connected to the control main body 91.

The inspection apparatus 10 configured as described above operates as follows under the control of the control device 90 to electrically inspect the wafer W. First, the inspection apparatus 10 transmits a command to move the loader 11 and the stage 40 to the stage control unit 49, transfers the wafer W from the loader 11 to the mounting table 45, and transports the wafer W within the inspection space 21. At this time, the stage control unit 49 moves the mounting table 45 in the horizontal direction using the X-axis moving mechanism 42 and the Y-axis moving mechanism 43 to bring the contact position of the wafer W to face each probe 33, and then moves the mounting table 45 to the Z-axis moving mechanism 43. 44 raises the mounting table 45 along the vertical direction (Z-axis direction).

When the mounting table 45 is raised, each probe 33 comes into contact with the wafer W, thereby establishing electrical continuity between the tester 30 and the wafer W. Thereafter, the tester 30 transmits electrical signals from the test head to each DUT on the wafer W, receives device signals responded from each DUT, and determines the presence or absence of an abnormality, electrical characteristics, etc. of each DUT. In addition, the inspection apparatus 10 performs a complete inspection of each DUT by moving the stage 40 in the X-axis direction, Y-axis direction, and Z-axis direction and sequentially repeating the inspection of each DUT while shifting the position on the wafer W.

After testing all the DUTs, the testing device 10 lowers the mounting table 45 to remove the wafer W from each probe 33, and transports the wafer W to the loader 11. The loader 11 receives the inspected wafer W from the stage 40 and stores it in a FOUP.

Further, in the inspection apparatus 10 according to the present embodiment, foreign matter may adhere to a portion of each probe 33 or each probe 33 may be partially worn out during the inspection. Therefore, during maintenance of the inspection device 10, the needle polishing process is performed to polish each probe 33 of the probe card 32 as described above. For example, in the needle polishing process, the user places the polishing member PM on the mounting surface 45s of the stage 40. Then, the control device 90 operates the stage 40 having the polishing member PM based on the recipe for the needle polishing process (polishing content). As the stage 40 moves, the polishing member PM contacts each probe 33 and then moves relative to each probe 33 in the horizontal direction (X-axis-Y-axis direction) to polish each probe 33. can.

The processing system 1 having the above inspection device 10 allows the user to arbitrarily set the polishing contents of the needle polishing process for polishing each probe 33. Next, with reference to FIG. 2, the processing system 1 having the inspection device 10 will be explained, and the setting of the sharpening process in this processing system 1 will be explained in detail.

A processing system 1 according to an embodiment includes a plurality of factories 2 having one or more inspection devices 10, an external network 3 such as the Internet connected to each factory 2, and a server device connected via the external network 3. 4 and has.

As described above, the factory 2 is a manufacturing place where wafers W are manufactured, and by installing the inspection device 10, the manufactured wafers W can be immediately inspected. The server device 4 is a computer that centrally manages the manufacturing status of wafers W in a plurality of factories 2, the status of installed equipment, and the like. The server device 4 can be a computer owned by a user. Alternatively, the server device 4 may be a computer provided by the provider of the inspection device 10. It goes without saying that the processing system 1 may have only one factory 2, or may have a system configuration that does not use the external network 3 and server device 4.

In the factory 2, in addition to the plurality of inspection devices 10, there is an internal network 60 such as a LAN connected to each of the plurality of inspection devices 10, and a management network connected to each inspection device 10 via this internal network 60. A computer 70 is provided. The processing system 1 also includes a setting computer 80 in order to set the functions of various devices installed in the factory 2. In this embodiment, as described above, the setting computer 80 sets the polishing content of the needle polishing process of the inspection device 10 and transmits the information to the control device 90.

Note that the setting of the polishing contents of the needle polishing process may be performed using the management computer 70 that is communicatively connected to the inspection device 10. Alternatively, the processing system 1 may have a configuration in which the polishing contents are set in the server device 4 communicably connected to the factory 2 and the polishing contents are transmitted to the control device 90 of the inspection device 10. Further, the polishing content can also be set in the control device 90 itself of the inspection device 10. In other words, any of the server device 4, the management computer 70, the setting computer 80, and the control device 90 may be used as the information processing device for setting the polishing content of the inspection device 10.

As shown in FIGS. 1 and 3, the setting computer 80 according to the present embodiment is removably connected to the control device 90 of the inspection device 10 through a communication line 61, and performs information communication with the control device 90. . The setting computer 80 is mounted, for example, on a trolley 62 or the like, and can be freely moved within the factory 2. As a result, even if a plurality of inspection devices 10A, 10B, ..., 10N are installed in the factory 2, the user can configure settings for each inspection device 10 using one setting computer 80. can. Note that the setting computer 80 may be communicably connected to the control device 90 by a communication means such as a wireless LAN instead of the communication line 61.

A control main body 91 of the control device 90 includes one or more processors 96, a memory 97, an input/output interface 98, a communication interface 99, and an electronic circuit (not shown). The processor 96 includes one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), a circuit made of a plurality of discrete semiconductors, etc. It is a combination. The memory 97 is an appropriate combination of volatile memory and nonvolatile memory (eg, compact disc, DVD (Digital Versatile Disc), hard disk, flash memory, etc.). The processor 96 controls the operation of the inspection apparatus 10 by reading and executing a program 97p stored in the memory 97.

On the other hand, the display/input device 92 of the control device 90 may include a touch panel 93 that visualizes and displays the operating status of the inspection device 10 and allows the user to perform input operations. Alternatively, the display input device 92 is not limited to the touch panel 93, and may be a monitor, a keyboard, a mouse, or the like.

The setting computer 80 may also have a similar configuration to the control device 90. That is, the setting computer 80 can be a general-purpose computer having a control main body 81 and a display input device 82 connected to the control main body 81.

The display input device 82 of the setting computer 80 includes a monitor 83, a keyboard 84, a mouse 85, and the like. Moreover, a device having a touch panel can also be applied to the display input device 82. Like the control main body 91, the control main body 81 of the setting computer 80 includes one or more processors 86, a memory 87, an input/output interface 88, a communication interface 89, an electronic circuit (not shown), and the like. Then, the processor 86 reads out and executes a program 87p (application) stored in the memory 87, thereby internally building a functional unit for setting the polishing contents of the needle polishing process.

As shown in FIG. 4, within the control main body 81, an input information acquisition section 801, a display control section 802, a display screen generation section 803, a polishing content transmission section 804, etc. are formed. The input information acquisition unit 801 receives the content of the user's operation on the display input device 82 (input information OI), and transmits this input information OI to the display screen generation unit 803. On the other hand, the display control unit 802 transmits the upper part of the display screen 100 generated by the display screen generation unit 803 to the display input device 82 and causes the display input device 82 to display it.

The display screen generation unit 803 performs appropriate processing based on the input information OI, generates the display screen 100 according to the operation, and stores the input information OI necessary for the polishing content of the needle sharpening process in the memory 87. On the other hand, the polishing content transmitting unit 804 generates setting information SI that can be transmitted to the inspection apparatus 10 after the user sets the polishing content. The polishing content transmitting unit 804 monitors the connection between the setting computer 80 and the inspection device 10, and transmits the setting information SI to the control device 90 based on the user's operation while connected to the inspection device 10.

Specifically, inside the display screen generation section 803, an area setting section 805, a pattern setting section 806, and a simulation section 807 are constructed. Hereinafter, the functions of each part will be explained in detail together with the various display screens 100 that the control main body 81 displays on the monitor 83 of the display input device 82.

The display screen generation unit 803 generates a main screen 110 showing editing of the polishing contents as shown in FIG. 5 as the display screen 100 when starting to set the polishing contents (when starting the program 87p). The main screen 110 includes an area setting display group 111 for setting the polishing area of the probe 33, a simulation display group 141 for simulating the set polishing contents, and a simulation display screen 140 for showing the results of the simulation. include.

In the main screen 110 according to the present embodiment, a simulation display screen 140 is provided in about 70% of the area from the left side of the main screen 110 including the center portion in order to make it easier for the user to visually recognize the simulation results. In the main screen 110, an area setting display group 111 is arranged on the right side and above the simulation display screen 140, and a simulation display group 141 is arranged on the right side and below the simulation display screen 140.

The area setting display group 111 includes a plurality of button images for the user to perform predetermined operations. Examples of the plurality of button images include a polishing media selection button 112, an input button 113, a detailed setting button 114, and a data button 115. The polishing media selection button 112 is a button used by the user to set the polishing member PM for polishing the probe 33. The input button 113 is a button for the user to set the polishing area of the polishing member PM in more detail. The detailed settings button 114 is a button for changing various settings for the application that edits the polishing. The data button 115 is a button that displays the history of polishing contents set in the past and reads out the past polishing contents selected by the user.

When the display screen generation unit 803 receives as input information OI that the polishing media selection button 112 has been pressed by the user, the display screen generation unit 803 operates the area setting unit 805. Area setting section 805 displays a plurality of types of polishing members PM and allows the user to select a polishing member PM.

The polishing media selection button 112 can display a pull-down screen 112A having a plurality of pull-down options 200, for example, as shown in FIG. 6(A). Alternatively, the polishing media selection button 112 may be configured to pop up another image showing a plurality of types of polishing members PM when pressed by the user. The pull-down screen 112A can be arranged on the mounting surface 45s of the stage 40, and displays a list of multiple types of polishing members PM that are sold and used as options 200.

For example, the plurality of types of polishing members PM include a square polishing sheet, a horizontally long polishing sheet, a large polishing sheet, a polishing wafer, and the like. The horizontally elongated polishing sheet is a sheet that is formed into a rectangle and has a long side longer than one side of the square polishing sheet. A large abrasive sheet is a rectangular sheet that is larger than a square abrasive sheet. The polishing wafer is a grindstone formed into a wafer shape or provided on a dummy wafer. In addition to arranging the polishing member PM on the stage 40, the inspection device 10 includes a prober (not shown) having a polishing grindstone that is separate from the stage 40, and operates this prober in the same manner as the stage 40. A configuration in which each probe 33 is polished may also be used. In this case, the area setting unit 805 may select a grindstone installed in the prober as the polishing member PM.

The area setting unit 805 automatically sets the size of the polishing member PM stored in advance together with information on the polishing member PM in accordance with the user's selection of the polishing member PM. However, the size of the polishing member PM can be arbitrarily changed by the user when placing the polishing member PM on the mounting surface 45s. Therefore, the area setting unit 805 may be configured to allow the user to input the size of the polishing member PM. For example, as shown in FIG. 6(B), the area setting unit 805 may display a size input screen 112B (area setting screen) on which the user can numerically input the size of the polishing member PM. The size input screen 112B has a plurality of input columns 201 in which the X-axis dimension and Y-axis dimension, which are the horizontal planar shape of the polishing member PM, can be input.

Further, as shown in FIG. 6(C), the area setting unit 805 displays a size input screen 112C (area setting screen) on which the size of the polishing member PM can be input by the user's drag-and-drop operation of the mouse 85. Good too. For example, the size input screen 112C has an operation screen 202 for performing a drag-and-drop operation, and an input field 201 in which the X-axis dimension and Y-axis dimension of the polishing member PM can be entered in the horizontal direction of the operation screen 202. are doing. The input field 201 may be configured to automatically display the X-axis dimension and Y-axis dimension associated with a drag-and-drop operation, in addition to the user's manual input.

On the operation screen 202, a rectangular polishing member PM is displayed by the user placing a pointer 203 linked to the operation of the mouse 85 at an appropriate position and performing a drag-and-drop operation. Note that the drag-and-drop operation in this specification is not limited to an operation of continuing and moving a click with the mouse 85 and canceling the click. For example, when a touch panel is used as the display input device 82, an operation of touching the panel and then sliding the panel to release the touch may be sufficient. At this time, mechanical buttons may be used as the drag point and drop point. In short, the drag-and-drop operation can employ various user operations that allow the user to arbitrarily specify a range on the display screen in input to the information processing device.

When setting the size of the polishing member PM (polishing area), the area setting unit 805 not only sets the outer edge MO of the polishing member PM, but also sets the actual polishing effective range MM of the polishing member PM inside the outer edge MO. You can also set it. Note that the area setting unit 805 may set the outer edge MO and effective range MM of the polishing member PM by one drag-and-drop operation, or may set them by separate drag-and-drop operations. Further, the shape of the polishing member PM formed on the operation screen 202 is not limited to a rectangular shape, but preferably can be changed to a circular shape, another polygonal shape, or the like by performing an appropriate selection operation.

Further, the area setting unit 805 may be configured to set the number of polishing sheets, conduction area, etc., for example, when the polishing sheet, which is the polishing member PM, is pasted on the mounting surface 45s. In the needle polishing process, by using a plurality of polishing members PM, it is possible to perform polishing for different purposes, such as first coarsely polishing the probe 33 and then finely polishing the probe 33. .

In order to set the number of polishing members PM, the area setting unit 805 preferably displays an installation number selection button 112D having a plurality of pull-down options 210, as shown in FIG. 7(A). Similarly, as shown in FIG. 7B, the area setting unit 805 selects a conduction area selection button 112E having a plurality of pull-down options 211 to set the number of conduction areas (none if the number is zero). It is good to display it. For example, the installation number selection button 112D and the conduction area selection button 112E may be installed on the main screen 110 or the setting input screen 120 described later. Alternatively, the area setting section 805 is not limited to the pull-down type, and may be configured to display an input field (not shown) in which the user manually inputs the number of polishing members PM and the number of conductive areas.

For example, as shown in FIG. 7C, the area setting unit 805 displays a multiple area input screen 112F ( (area setting screen) may be displayed. As an example, the multiple area input screen 112F displays a polishing setting frame 212 indicating the size of the entire polishing area set on the mounting surface 45s. In this polishing setting frame 212, the user performs a drag-and-drop operation of the pointer 213 in conjunction with the operation of the mouse 85 to create a plurality of divided areas according to the number and shape of the polishing members PM, the conductive area, etc. Create a layout. FIG. 7C shows an example in which three divided areas (area A, area B, and area C) and one conductive area are formed on the multiple area input screen 112F.

Alternatively, as shown in FIG. 8A, the area setting unit 805 creates a table 220 in which the X-axis dimension and Y-axis dimension can be entered for a plurality of divided areas (areas A, B, ..., N). A configuration may also be adopted in which a multiple area input screen 112G (area setting screen) having a plural area input screen 112G (area setting screen) is displayed. The table 220 of the multiple area input screen 112G has input fields 221 in which the user manually inputs numerical values for each of the X-axis and Y-axis in the multiple divided areas. Then, when the user inputs a numerical value into the input field 221, divided areas corresponding to the input dimension are displayed. This allows the user to smoothly place the polishing member PM at the same position as the polishing member PM placed on the mounting surface 45s.

Also, when setting multiple divided areas, the area setting unit 805 sets the outer edge MO and effective range MM for each divided area, as shown in FIG. 8(B) and FIG. 8(C). good. For example, the area setting unit 805 displays the multiple area input screen 112H (area setting screen) and first creates the outlines 222 of the plurality of divided areas (the outer edges MO1 and MO2 of the polishing member PM) by a drag-and-drop operation. . Furthermore, after setting the outlines 222 of the plurality of divided areas, the area setting unit 805 creates effective ranges MM1 and MM2 by performing a drag-and-drop operation inside each divided area. That is, each divided area has effective ranges MM1 and MM2, and a blank area outside of the effective ranges MM1 and MM2 that is not used for polishing each probe 33. In this way, the area setting unit 805 can easily set the effective ranges MM1 and MM2 even when setting a plurality of divided areas.

Returning to FIG. 5, the input button 113 of the area setting display group 111 on the main screen 110 is used to set the size, number, etc. of the polishing member PM, and the operation pattern of the stage 40 during needle sharpening processing. This is a button image. For example, as shown in FIG. 9, when the input button 113 is pressed by the user, the display screen 100 pops up a setting input screen 120, which is another screen information (window). The display screen 100 allows the user to input various information related to the polishing contents of the needle sharpening process through the setting input screen 120.

Further, the setting input screen 120 has a pattern setting item group 124 for setting the operation pattern of the needle sharpening process. For example, the pattern setting item group 124 includes a setting button 127, and when the setting button 127 is pressed by the user, a pattern setting screen 130, which is another screen information, is displayed as a pop-up. The pattern setting screen 130 allows the user to set various information regarding the operation pattern.

As shown in FIG. 10, the setting input screen 120 includes multiple types of setting items 121 such as the size of the polishing member PM, and multiple input fields 125 arranged horizontally for each setting item 121 for input by the user. and has. The plurality of types of setting items 121 are divided into a setting item group 122 for the polishing member PM, a setting item group 123 for the probe card 32, and the pattern setting item group 124 described above.

Examples of the setting item group 122 for the polishing member PM include media size (size of the polishing member PM), index size, position in the Z-axis direction, effective range, and the like. Basically, the media size can be automatically set by pressing the polishing media selection button 112 (see FIG. 5) described above, but the user can also input it on this setting input screen 120. Therefore, the setting input screen 120 is also one of the area setting screens for setting the polishing area. In addition, in FIG. 10, the input field 125 is used to input numerical values, but instead of the input field 125, etc., each screen of FIGS. It may be displayed as

The index size of the setting item group 122 of the polishing member PM is the amount of deviation (index amount) between the target position (new surface not used for polishing) on the polishing member PM placed on the mounting surface 45s and the probe 33. This is the numerical value shown. The polishing member PM is arbitrarily placed on the mounting surface 45s of the stage 40 by the user. Therefore, as shown in FIG. 11(A), when the index amount is not set, the needle sharpening process is performed in a state where the target position on the polishing member PM and each probe 33 of the probe card 32 are shifted from each other. become. The index size setting item 121 allows the user who has set the polishing member PM on the mounting surface 45s to input the index amount. Thereby, the inspection device 10 can perform polishing by moving the polishing member PM based on the index amount and bringing the probe 33 into contact with a new surface of the polishing member PM.

Specifically, the inspection device 10 that has set the polishing contents of the needle polishing process based on the setting information SI controls the moving position of the stage 40 based on the set index amount, and controls the polishing member for each probe 33 of the probe card 32. Adjust the relative position of PM. For example, as shown in FIG. 11(B), the inspection device 10 determines the center of the polishing member PM and each probe card 32 based on the index amount D (a vector that combines the X-axis index and the Y-axis index). The centers of the probes 33 can be made to coincide with each other.

Returning to FIG. 10, the position in the Z-axis direction in the setting item group 122 for the polishing member PM is an item for setting the contact state of each probe 33 and the polishing member PM in the Z-axis direction during the needle sharpening process. During the needle polishing process, the inspection device 10 raises the stage 40 so that each probe 33 and the surface of the polishing member PM just come into contact. The area setting unit 805 allows the position (overdrive) of the polishing member PM in the Z-axis direction to be changed, thereby controlling the contact pressure between the polishing member PM and each probe 33 and the degree of bending of each probe 33 during the needle sharpening process. etc. can be adjusted by the user.

In addition, the effective range input field 125 in the setting item group 122 of the polishing member PM in FIG. The user can also input information on the screen 120.

On the other hand, the setting item group 123 of the probe card 32 includes setting items such as die size and die number. The die size is a distance between each semiconductor device (DUT) set so that each probe 33 contacts each semiconductor device (DUT) on the wafer W. The die number is the number of each semiconductor device that each probe 33 can contact. Note that the die size and die number may be set automatically by the setting computer 80 by inputting the identification number of the probe card.

Then, the pattern setting item group 124 operates the pattern setting unit 806 based on the user's operation to set an operation pattern during the needle sharpening process of the stage 40 having the polishing member PM. The pattern setting item group 124 on the setting input screen 120 includes a pull-down pattern selection button 126 for selecting an operation pattern, a setting button 127 for displaying the pattern setting screen 130 described above, and the like. Next, the setting of the operation pattern during the needle sharpening process will be explained in detail.

As shown in FIG. 12A, the pattern selection button 126 of the pattern setting item group 124 allows the user to select an operation pattern of the stage 40 on which the polishing member PM is placed during the needle polishing process. Options for the pattern selection button 126 include an up/down option 230, a left/right option 231, an inclined option 232, a hexagonal option 233, and a rectangular option 234. The vertical option 230 sets a vertical movement pattern (first direction pattern) for reciprocating the polishing member PM in the vertical direction (X-axis direction). The left/right option 231 sets a left/right movement pattern (second direction pattern) for reciprocating the polishing member PM in the left/right direction (Y-axis direction). The tilt option 232 sets a tilt operation pattern (tilt direction pattern) for reciprocating the polishing member PM in a direction tilted with respect to the X-axis and the Y-axis. The hexagonal option 233 sets a hexagonal movement pattern (circling direction pattern) in which the polishing member PM is moved around in a hexagonal manner. The rectangular option 234 sets a rectangular movement pattern (circling direction pattern) in which the polishing member PM is moved around in a rectangular manner.

As shown in FIG. 12(B), the pattern setting screen 130 includes a plurality of types of parameters 131 for the operation pattern of the polishing member PM, and a plurality of input columns arranged below each parameter 131 for input by the user. 132. Examples of the plurality of types of parameters 131 include speed, X-axis size, Y-axis size, line size, and angle.

The speed input field 132 is a field for setting the movement speed of the motion pattern selected by the pattern selection button 126. The X-axis size input field 132 is a field for setting the amount of movement in the X-axis direction of the movement pattern selected by the pattern selection button 126. Similarly, the Y-axis size input field 132 is a field for setting the amount of movement in the Y-axis direction of the movement pattern selected by the pattern selection button 126. The line size is a column for setting the length of the trajectory of the motion pattern selected with the pattern selection button 126 (the length of the entire motion amount). Angle is a column for setting an angle of inclination with respect to the X axis or the Y axis in the operation pattern set with the pattern selection button 126. In this way, the pattern setting unit 806 allows the user to set a plurality of types of parameters of the operation pattern, so that the polishing member PM in contact with each probe 33 can be adjusted according to the desired operation pattern during the needle sharpening process. It can be polished by hand.

Note that the setting of the operation pattern of the polishing member PM is not limited to setting via the pattern selection button 126 or the pattern setting screen 130, and various setting methods may be used. For example, the pattern setting unit 806 may display a free pattern setting screen 130A as shown in FIGS. Good too. Thereby, in the needle polishing process, the inspection device 10 can operate the polishing member PM along the operation pattern drawn by the user.

Specifically, the free pattern setting screen 130A displays a handwritten portion 133 having a square grid on substantially the entire free pattern setting screen 130A. On the free pattern setting screen 130A, for example, the user places the pointer 134 on an arbitrary grid and performs a drag-and-drop operation to create an operation pattern for the polishing member PM. Note that the handwriting unit 133 may allow the user to draw free lines without being bound by the grid.

As an example, the user places the pointer 134 at the polishing start position, moves the pointer 134 in a predetermined direction (upward in FIG. 8B) while clicking the mouse 85, and drops it at a desired position. Thereby, a locus 135 in which the polishing member PM moves upward can be set. Further, the pattern setting unit 806 can set a non-contact operation in which the polishing member PM and each probe 33 move in a non-contact (separated state) in the operation pattern. For example, after drawing a trajectory of the motion pattern and dropping it, move the pointer 134 to a desired position and perform the drag-and-drop operation with the mouse 85 again. Thereby, the section from dropping to dragging again can be set as the locus 136 of the non-contact operation in which the polishing member PM is separated from each probe 33. Furthermore, the user can draw the locus 137 of the motion pattern by performing another drag-and-drop operation.

As described above, by freely designing the operation pattern of the polishing member PM using the handwritten section 133, the control device 90, which has set the polishing contents, can adjust the operation pattern of the polishing member PM according to the user's operation pattern during the needle sharpening process. PM can be operated. Thereby, each probe 33 can be polished as desired by the user.

The polishing content of the needle polishing process is completed by setting the area and operation pattern. The setting computer 80 makes it possible to simulate the set polishing contents before sending the polishing contents setting information SI to the inspection device 10. The simulation unit 807 shown in FIG. 4 performs a polishing simulation based on set polishing contents based on a user's operation to execute a simulation. Specifically, the user operates the simulation display group 141 on the main screen 110 shown in FIG.

The simulation display group 141 includes a start button 142 for starting a simulation, an effective status graph 143 showing the execution status of the simulation, a reset button 144, and a stop and play button 145. When the user presses the start button 142, the simulation unit 807 starts a simulation in accordance with the set polishing details.

As shown in FIG. 14A, in the simulation by the simulation unit 807, a plurality of frames 241 are formed in units of semiconductor devices on the wafer W to be inspected by each probe 33, and the plurality of frames 241 are frame 241 is moved. In addition, in the needle polishing process, an operation is performed in which the position of the polishing member PM that each probe 33 comes into contact with is changed while polishing is performed according to a set operation pattern. Therefore, the simulation unit 807 calculates the movement areas of the plurality of frames 241 that will move relative to the polishing member PM, according to the movement pattern according to the polishing content and the movement of the position of the polishing member PM. do.

Then, the simulation unit 807 displays the calculated locus of the movement area on the simulation display screen 140 in real time. As a result, as shown in FIG. 14(B), the simulation unit 807 allows the user to clearly see the movement area of the plurality of frames 241, which is the actual use range 242 of the polishing member PM.

More specifically, as shown in FIG. 15, the simulation display screen 140 displays a polishing area frame 243 indicating the polishing member PM in advance in the simulation, and also displays the dies (semiconductor devices of the wafer W) of each probe 33 in advance. A plurality of grids 244 are formed according to the unit. The inside of the polishing area frame 243 has a display form in which a plurality of grid areas 245 are arranged in a matrix shape by a plurality of grids 244 . The simulation unit 807 generates grids according to the trajectory calculated by the simulation for the moving regions of the plurality of frames 241 (see FIG. 14(A)) based on the movement pattern according to the polishing content and the movement of the position of the polishing member PM. The area 245 is filled in. Thereby, the simulation display screen 140 can display the range actually used in the polishing member PM in real time.

For example, immediately after starting the simulation, the polishing member PM first polishes each probe 33 by filling in a small number of grid areas 245. Further, during the simulation, the effective status graph 143 displays the progress status of the simulation by a bar extending in the horizontal direction, and this bar is in a short state immediately after the simulation is started.

As the simulation progresses, as shown in FIG. 16, each probe 33 comes into contact with the entire polishing member PM as the polishing member PM moves. Therefore, many grid areas 245 are filled in. When the simulation is completed, the simulation display screen 140 can indicate the use range 242 used for polishing by the polishing member PM (the range in contact with each probe 33) by the filled-in range of the plurality of grid areas 245. As described above, the polishing member PM placed on the stage 40 changes its position while repeating reciprocating movement based on the set operation pattern. Therefore, the simulation display screen 140 may change the filling state of each grid area 245 depending on the frequency of contact with the polishing member PM. For example, when the frequency of contact is low, the fill color may be displayed in a lighter color, while as the frequency of contact increases, the fill color may be displayed darker.

As described above, in the simulation, the simulation unit 807 forms a plurality of frames 241 that move relative to the polishing member PM for each semiconductor device on the wafer W (see FIG. 17(A)). However, each frame 241 is large in size with respect to each probe 33 that is actually polished, and when the movement of each frame 241 is simulated, it may draw a trajectory in a larger area than the trajectory of polishing each probe 33. become.

Therefore, the simulation unit 807 may calculate a trajectory corresponding to each probe 33 instead of the frame 241 for each semiconductor device of the wafer W, as shown in FIG. 17(B). For example, instead of the frame 241, a plurality of plots 250 corresponding to each probe 33 are arranged on the simulation display screen 140A. The simulation unit 807 calculates the locus of each plot 250 in the simulation. As a result, the use range of the polishing member PM differs between when a simulation is performed with a plurality of frames 241 arranged and when a simulation is performed with a plurality of plots 250 arranged.

That is, when a plurality of frames 241 are used as shown in FIG. 17(A), even if the frames 241 are moved to the outer edge of the polishing member PM, the actual probe 33 is moved inside the outer edge of the polishing member PM. It may be located. On the other hand, as shown in FIG. 17(B), when a plurality of plots 250 are used, the plurality of plots 250 can be moved to near the outer edge of the polishing member PM, and simulation can be performed from this position. . Thereby, the setting computer 80 can generate the setting information SI used for polishing up to the vicinity of the outer edge of the polishing member PM, and by using this setting information SI, the polishing member PM can be used efficiently. It becomes possible.

Furthermore, the simulation unit 807 may be configured to determine whether or not there is an abnormality in the polishing content set by the user based on the usage state of the polishing member PM calculated through the simulation. For example, in a simulation, if the use range 242 used for polishing exceeds a set polishing area, it may be determined that there is an abnormality in the polishing content. Alternatively, the simulation unit 807 may determine that there is an abnormality in the polishing content when the use range 242 is too concentrated in a part of the polishing member PM. This is because if the usage range 242 is too concentrated, the life of the polishing member PM will be shortened.

Further, the user may operate the stop/play button 145 while viewing the simulation display screen 140 during execution of the simulation to stop the simulation at an appropriate timing, or may restart the simulation after stopping. Further, for example, if the user himself/herself determines that there is an abnormality during execution of the simulation, the simulation may be canceled by operating the reset button 144.

The user can then operate the area setting display group 111 to reset the polishing area or operation pattern based on the simulation results or process. By performing the simulation again with the reset polishing contents, it becomes possible to adjust the polishing contents more precisely as desired by the user. That is, the setting computer 80 may repeat the setting of the polishing area, the setting of the operation pattern, and the simulation many times. In this way, the setting computer 80, as an external device separate from the inspection apparatus 10, can set the polishing content of the needle sharpening process unique to the user and set this polishing content (recipe) in the inspection apparatus 10.

Note that the setting computer 80 can also read (import) previously created polishing content data and perform editing using the past polishing content. For example, by pressing the data button 115 on the main screen 110 shown in FIG. 5, a screen (not shown) for accessing a folder storing data on past polishing contents is displayed, and the user can select past polishing contents. can be done. Alternatively, the display screen generation unit 803 may display a list of simplified versions of a plurality of past polishing contents based on the operation of the data button 115, and allow the user to select the polishing contents.

Furthermore, in the embodiments described above, the inspection apparatus 10 includes one tester 30 and one stage 40. However, the configuration is not particularly limited as long as the device is capable of performing the needle sharpening process, and for example, it may be an inspection device (not shown) having a plurality of testers 30. Even in this case, by transmitting the polishing contents set in the setting computer 80 to the inspection device, the inspection device can align the probes 33 of the probe card 32 attached to each tester 30 with the needles according to the polishing contents. Can be polished. Alternatively, the processing system 1 may include a dedicated device that performs only the needle polishing process for each probe 33, and the setting computer 80 may be configured to set the polishing content for this dedicated device.

The technical idea and effects of the present disclosure explained in the above embodiments will be described below.

[1]: An information processing device (setting computer 80) that sets the polishing content of the probe 33 that comes into contact with the inspected object, comprising an area setting unit 805 that sets the polishing area in the polishing member PM that polishes the probe 33; , a pattern setting unit 806 that sets an operation pattern during polishing of the probe 33, and a simulation unit that calculates a relative trajectory between the polishing member PM and the probe 33 based on the set polishing area and the set operation pattern. 807.

According to the above, the information processing device (setting computer 80) can easily and precisely set the polishing contents in the needle polishing process for polishing the probe 33. In particular, an information processing device prepared outside the control device 90 sets the polishing contents of the needle sharpening process, thereby suppressing restrictions on the setting method for each device and an increase in man-hours due to development for each device. This allows a high degree of freedom in design. That is, the information processing apparatus can share the settings for the polishing content of the probe, and it is possible to reduce the number of man-hours.

[2]: The information processing device (setting computer 80) based on [1] includes a stage 40 that moves the polishing member PM in three-dimensional directions, and a control device that controls the operation of the stage 40. , is connected to the inspection apparatus 10 that actually polishes the probe 33, and transmits setting information SI set by the area setting section 405 and the pattern setting section 406 to the inspection apparatus 10. Thereby, the information processing device sets the polishing contents of the needle sharpening process for each of the plurality of inspection devices 10, and then transmits the setting information of the polishing contents to the inspection device 10, so that the inspection device 10 polishes the probe. The needle sharpening process can be carried out smoothly.

[3]: In the information processing device (setting computer 80) based on [1] or [2], the area setting unit 805 can set a plurality of divided areas for the polishing area. Thereby, even when polishing a probe using a plurality of types of polishing members PM, it is possible to set the areas of the plurality of polishing members PM in detail.

[4]: In the information processing device (setting computer 80) that assumes any one of [1] to [3], the area setting unit 805 sets an effective range for polishing the probe 33 in the polishing member PM. can be set inside the polishing area. Thereby, it is possible to appropriately set the effective range of the polishing member PM, and the entire polishing member PM can be effectively used in the needle polishing process.

[5]: In an information processing device (configuration computer 80) that assumes any one of [1] to [4], the area setting unit 805 can drag the display input device 82 connected to the information processing device. It is possible to set the polishing area by using the and-drop operation. Thereby, the information processing device can easily set the polishing area.

[6]: In the information processing device (setting computer 80) that assumes any one of [1] to [5], the pattern setting unit 806 allows the user to select a plurality of types of operation patterns. Thereby, the information processing apparatus can easily set the operation pattern of the polishing process.

[7]: In the information processing device (setting computer 80) based on [6], the plurality of types of operation patterns include a first direction pattern (vertical operation pattern) in which the polishing member PM is reciprocated in the first direction; , a second direction pattern (left-right movement pattern) in which the polishing member PM is reciprocated in a second direction orthogonal to the first direction; and a second direction pattern in which the polishing member PM is reciprocated in a direction inclined with respect to the first direction and the second direction. The pattern includes an inclined direction pattern and a circumferential direction pattern (hexagonal motion pattern, rectangular motion pattern) in which the polishing member PM is moved circumferentially along a polygonal shape. Thereby, the information processing device can selectively perform various operation patterns in the needle sharpening process.

[8]: In an information processing device (configuration computer 80) that assumes any one of [1] to [7], the pattern setting unit 806 is configured to perform a drag operation on the display input device 82 connected to the information processing device. Operation patterns can be set using the and-drop operation. Thereby, the information processing apparatus can easily set the operation pattern desired by the user.

[9]: In the information processing device (setting computer 80) that assumes any one of [1] to [8], the simulation unit 807 forms a plurality of frames 241 according to the object to be inspected, The trajectories of the plurality of frames 241 that move relatively with the movement of the polishing member PM are calculated, and the calculated trajectories of the plurality of frames 241 are displayed on the display input device 82 connected to the information processing device. Thereby, the user who visually confirms the simulation results can easily grasp the location on the polishing member PM where polishing is actually performed.

[10]: In the information processing device (setting computer 80) that assumes any one of [1] to [8], the simulation unit 807 forms a plurality of plots 250 according to the plurality of probes 33. , calculates the trajectories of the plurality of plots 250 that move relatively with the movement of the polishing member PM, and displays the calculated trajectories of the plurality of plots 250 on the display input device 82 connected to the information processing device. Thereby, the information processing apparatus can perform a simulation corresponding to the polishing of a plurality of probes. Further, in setting, the range in which the polishing member PM contacts each probe can be expanded, and the polishing member PM can be effectively utilized.

[11]: A display input device 82 that has a display screen 100 that displays the polishing content of the probe 33 in contact with the object to be inspected, and that allows the user to set the polishing content by performing an operation based on the display screen 100. The display screen 100 includes an area setting screen (setting input screen 120) for setting a polishing area in the polishing member PM for polishing the probe 33, a pattern setting screen 130 for setting an operation pattern when polishing the probe 33, and a setting screen 130 for setting an operation pattern for polishing the probe 33. a simulation display screen 140 that displays the relative trajectory of the polishing member PM and the probe 33 calculated based on the set polishing area and the set operation pattern.

[12]: A program 87p for setting the polishing content of the probe 33 that contacts the object to be inspected, which includes a step of setting a polishing area in the polishing member PM for polishing the probe 33, and an operation pattern when polishing the probe 33. The information processing device (setting computer 80) executes the step of setting and the step of calculating the relative trajectory of the polishing member PM and the probe 33 based on the set polishing area and the set operation pattern. let

The information processing device, display input device, and program according to the embodiments disclosed herein are illustrative in all respects and are not restrictive. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the plurality of embodiments described above may be configured in other ways without being inconsistent, and may be combined without being inconsistent.

10 Inspection device 33 Probe 80 Setting computer 805 Area setting section 806 Pattern setting section 806
807 Simulation part PM polishing member

Claims (12)

An information processing device that sets the polishing content of a probe that contacts an object to be inspected,
an area setting unit that sets a polishing area in a polishing member that polishes the probe;
a pattern setting unit that sets an operation pattern during polishing of the probe;
a simulation unit that calculates a relative trajectory between the polishing member and the probe based on the set polishing area and the set operation pattern;
Information processing device. The information processing device includes:
It has a stage that moves the polishing member in a three-dimensional direction, and a control device that controls the operation of the stage, is connected to an inspection device that actually polishes the probe, and is connected to the area setting section and the pattern setting section. Sending the setting information set in to the inspection device,
The information processing device according to claim 1. The area setting unit is capable of setting a plurality of divided areas for the polishing area.
The information processing device according to claim 1. The area setting unit is capable of setting an effective range for polishing the probe in the polishing member inside the polishing area.
The information processing device according to claim 1. The area setting unit is capable of setting the polishing area by a drag-and-drop operation on a display input device connected to the information processing device.
The information processing device according to claim 1. The pattern setting section allows the user to select a plurality of types of the operation patterns.
The information processing device according to any one of claims 1 to 5. The plurality of types of operation patterns include a first direction pattern in which the polishing member is reciprocated in a first direction, a second direction pattern in which the polishing member is reciprocated in a second direction orthogonal to the first direction, and a second direction pattern in which the polishing member is reciprocated in a second direction perpendicular to the first direction. A tilting direction pattern in which the polishing member is reciprocated in a direction inclined with respect to the first direction and the second direction, and a circumferential direction pattern in which the polishing member is circularly moved along a polygonal shape.
The information processing device according to claim 6. The pattern setting unit is capable of setting the operation pattern by a drag-and-drop operation on a display input device connected to the information processing device.
The information processing device according to any one of claims 1 to 5. The simulation unit forms a plurality of frames according to the object to be inspected, calculates trajectories of the plurality of frames that move relatively with the operation of the polishing member, and calculates the calculated trajectories of the plurality of frames. displaying on a display input device connected to the information processing device;
The information processing device according to any one of claims 1 to 5. The simulation unit forms a plurality of plots corresponding to the plurality of probes, calculates trajectories of the plurality of plots that move relatively with the operation of the polishing member, and calculates the calculated trajectories of the plurality of plots. displaying on a display input device connected to the information processing device;
The information processing device according to any one of claims 1 to 5. A display input device that has a display screen that displays polishing details of a probe that contacts an object to be inspected, and allows the polishing details to be set by a user's operation based on the display screen,
The display screen is
an area setting screen for setting a polishing area in a polishing member for polishing the probe;
a pattern setting screen for setting an operation pattern when polishing the probe;
a simulation display screen that displays a relative trajectory between the polishing member and the probe calculated based on the set polishing area and the set operation pattern;
Display input device. A program for setting the polishing content of a probe that comes into contact with an object to be inspected,
setting a polishing area in a polishing member for polishing the probe;
setting an operation pattern during polishing of the probe;
causing an information processing device to execute a step of calculating a relative trajectory between the polishing member and the probe based on the set polishing area and the set operation pattern;
program.

Images